Disclosed are an implantable flexible neural microelectrode comb, and a preparation method and implantation method therefor. The flexible neural microelectrode comb is mainly composed of a flexible substrate layer (1), a flexible insulation layer (2), and a metal connection wire layer (3) arranged between the flexible substrate layer (1) and the flexible insulation layer (2); the flexible neural microelectrode comb comprises a filament structure (4), a mesh structure (5), a plane structure (6) and a bonding pad area (7) connected in sequence; electrode sites (8) are arranged on the filament structure (4); bonding pads are arranged on the bonding pad area (7); the metal connection wire layer (3) is composed of metal connection wires connecting the electrode sites (8) and the bonding pads; and the flexible insulation layer (2) is not arranged on the surfaces of the electrode sites (8) and the bonding pads. The prepared flexible neural microelectrode comb has a structure gradually changing from a filament to a mesh to a plane structure, thus improving mechanical stability during a deformation process. The mechanical properties of the implantable flexible neural microelectrode comb match brain tissue, the implantation footprint is small, an inflammatory response of the brain is avoided, and electrophysiological signals in the brain can be stably tracked and measured in a multi-site manner for a long time.

Disclosed are an implantable flexible neural microelectrode comb, and a preparation method and implantation method therefor. The flexible neural microelectrode comb is mainly composed of a flexible substrate layer (1), a flexible insulation layer (2), and a metal connection wire layer (3) arranged between the flexible substrate layer (1) and the flexible insulation layer (2); the flexible neural microelectrode comb comprises a filament structure (4), a mesh structure (5), a plane structure (6) and a bonding pad area (7) connected in sequence; electrode sites (8) are arranged on the filament structure (4); bonding pads are arranged on the bonding pad area (7); the metal connection wire layer (3) is composed of metal connection wires connecting the electrode sites (8) and the bonding pads; and the flexible insulation layer (2) is not arranged on the surfaces of the electrode sites (8) and the bonding pads. The prepared flexible neural microelectrode comb has a structure gradually changing from a filament to a mesh to a plane structure, thus improving mechanical stability during a deformation process. The mechanical properties of the implantable flexible neural microelectrode comb match brain tissue, the implantation footprint is small, an inflammatory response of the brain is avoided, and electrophysiological signals in the brain can be stably tracked and measured in a multi-site manner for a long time.

A conductive coating material is disclosed including at least (A) 100 parts by mass of a binder component including 5 to 30 parts by mass of solid epoxy resin that is solid at normal temperature and 20 to 90 parts by mass of liquid epoxy resin that is liquid at normal temperature, (B) 200 to 1800 parts by mass of silver-coated copper alloy particles in which the copper alloy particles are made of an alloy of copper, nickel, and zinc, the silver-coated copper alloy particles have a nickel content of 0.5% to 20% by mass, and the silver-coated copper alloy particles have a zinc content of 1% to 20% by mass with respect to 100 parts by mass of the binder component (A), and (C) 0.3 to 40 parts by mass of a curing agent with respect to 100 parts by mass of the binder component (A).

A deposition apparatus includes a first substrate support for supporting a substrate in a substantially vertical orientation. The substrate has a first main surface, a second main surface opposite the first main surface and a side surface between the first main surface and the second main surface. The deposition apparatus includes a first deposition device for depositing a first conductive pattern or a first resist mask on the side surface of the substrate while the substrate is supported in the substantially vertical orientation by the first substrate support.

The present disclosure provides a hydrophobic low-dielectric-constant film and a preparation method therefor. The low-dielectric-constant film is formed from one or more fluorine-containing compounds A by means of a plasma enhanced chemical vapor deposition method, and the one or more fluorine-containing compounds comprise a compound having the general formula C.sub.xSi.sub.yO.sub.mH.sub.nF.sub.2x+2y−n+2 or C.sub.xSi.sub.yO.sub.mH.sub.nF.sub.2x+2y−n, x being an integer from 1 to 20, y being an integer from 0 to 8, m being an integer from 0 to 6, and n being 0, 3, 6, 7, 9, 10, 12, 13, 15, 16, 17 and 19. Thus, a nano-film having a low dielectric constant and good hydrophobicity is formed on the surface of a substrate.

A deposition mask in which deformation of long sides is restrained is manufactured. A manufacturing method of a deposition mask includes a step of preparing a metal plate; a processing step of processing the metal plate into an intermediate product comprising: a plurality of deposition mask portions each including a pair of long sides and a pair of short sides, and having a plurality of through-holes formed therein; and a support portion that surrounds the plurality of deposition mask portions, and is partially connected to the short sides of the plurality of deposition mask portions; and a separation step of separating the deposition mask portions from the support portion to obtain the deposition mask. In the intermediate product, the long sides of the deposition mask portions are not connected to the support portion.

A bidirectional self-healing neural interface includes a first elastic substrate; a neural electrode disposed on the first elastic substrate and comprising a conductive polymer composite; and a second elastic substrate disposed on the neural electrode. The conductive polymer composite includes a matrix formed of a self-healing polymer material; and a plurality of electrical conductor clusters distributed in the matrix. Each of the electrical conductor clusters includes particles of a first electrical conductor; and a plurality of particles of a second electrical conductor formed of the same material as that of the first electrical conductor, distributed around each of the particles of the first electrical conductor, and having sizes that are smaller than those of the particles of the first electrical conductor. The first electrical conductor is a source for generating the second electrical conductor. The neural interface has excellent elasticity, electrical conductivity that is improved by deformation, and is self-healing.

A bidirectional self-healing neural interface includes a first elastic substrate; a neural electrode disposed on the first elastic substrate and comprising a conductive polymer composite; and a second elastic substrate disposed on the neural electrode. The conductive polymer composite includes a matrix formed of a self-healing polymer material; and a plurality of electrical conductor clusters distributed in the matrix. Each of the electrical conductor clusters includes particles of a first electrical conductor; and a plurality of particles of a second electrical conductor formed of the same material as that of the first electrical conductor, distributed around each of the particles of the first electrical conductor, and having sizes that are smaller than those of the particles of the first electrical conductor. The first electrical conductor is a source for generating the second electrical conductor. The neural interface has excellent elasticity, electrical conductivity that is improved by deformation, and is self-healing.

This application relates to an apparatus and method for manufacturing a transparent electrode. One surface of a base substrate is surface-treated with a predetermined material or predetermined light. A conductive material and a hydrophilic solution are sprayed onto the surface-processed base substrate by using a spray block including a spray nozzle and a thermographic camera. The conductive solution is sprayed onto the processed base substrate to form a surface heating body. The surface heating body is heated to be photographed by the thermographic camera. A controller analyzes a photographed image to define an area of supplementation and form a supplemented surface heating body in the area of supplementation by using the spray nozzle, and thus a transparent electrode having uniform heating characteristics is manufactured.

The invention, which relates to the technical field of circuit boards, specifically discloses a method for manufacturing an embedded circuit board, an embedded circuit board, and an application thereof. The method includes: providing a substrate, wherein an electronic component is embedded in the substrate, a pad is arranged on a side surface of the electronic component, and an end surface of the pad is flush with a same side surface of the substrate; forming a metallic layer on a side surface of the substrate adjacent to the pad by sputtering, evaporation, electroplating or chemical vapor deposition; and patterning the metallic layer to obtain a circuit board covered with the metallic layer on the pad, wherein the metallic layer on the pad protrudes beyond the same side surface of the substrate.