H05K3/14

Implantable electrical connecting device

An implantable electrical connecting device includes a first elastic multi-ply layer and a second elastic multi-ply layer. The first elastic multi-ply layer has a first electrically conductive layer and a plurality of first electrical contacts electrically conductively connected to the first electrically conductive layer of the first elastic multi-ply layer. The second elastic multi-ply layer has a first electrically conductive layer and a plurality of second electrical contacts electrically conductively connected to the first electrically conductive layer of the second elastic multi-ply layer. The second electrical contacts make contact with the first electrical contacts.

Right angle sidewall and button interconnects for molded SiPs

Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.

CONTROLLED DEPOSITION METHOD OF A DONOR MATERIAL ONTO A TARGET SURFACE AND PLATE THEREFOR
20230156926 · 2023-05-18 ·

A method of depositing a donor material onto a target surface is provided herein, in which a first main side of a substrate is covered with a stretchable layer that is attaching thereto with a sealing around an enclosed area at the first main side, therewith defining an enclosure. The stretchable layer has an outer surface that faces away from the substrate, and that is patterned with one or more recessed areas filled with the donor material to be deposited. A relatively high pressure is provided in an interior of the enclosure so that its volume is increased and the patterned surface of the stretchable layer is pressed against the target surface. In that state of the stretchable layer the substrate is irradiated at a second main side opposite its first main side with photon radiation that has an intensity and a duration that causes a transfer of donor material from the one or more recessed areas to the target surface. Also a plate and a deposition device are provided.

CONTROLLED DEPOSITION METHOD OF A DONOR MATERIAL ONTO A TARGET SURFACE AND PLATE THEREFOR
20230156926 · 2023-05-18 ·

A method of depositing a donor material onto a target surface is provided herein, in which a first main side of a substrate is covered with a stretchable layer that is attaching thereto with a sealing around an enclosed area at the first main side, therewith defining an enclosure. The stretchable layer has an outer surface that faces away from the substrate, and that is patterned with one or more recessed areas filled with the donor material to be deposited. A relatively high pressure is provided in an interior of the enclosure so that its volume is increased and the patterned surface of the stretchable layer is pressed against the target surface. In that state of the stretchable layer the substrate is irradiated at a second main side opposite its first main side with photon radiation that has an intensity and a duration that causes a transfer of donor material from the one or more recessed areas to the target surface. Also a plate and a deposition device are provided.

ELECTRONIC TEXTILES AND METHODS FOR FABRICATION THEREOF

Electronic textiles and methods of fabrication electronic textiles. Nanoparticles of a conductive material are sprayed along a conductive path into a fabric material so as to penetrate into the fabric. A layer of a second conductor material is coated over the nanoparticles along the conductive path. A layer of an insulator material is coated over the layer of the second conductor material so as to encapsulate the conductive path and form a trace. An electrode configured to contact a subject wearing the fabric material includes a layer of a third conductor material coated over the layer of the second conductor and electrically coupled with the conductive path. An electrical connector is secured to the fabric material and electrically coupled with the conductive path. The nanoparticles are sprayed onto the fabric material using a dual regime spray process implemented with a dual regime spray system.

ELECTRONIC TEXTILES AND METHODS FOR FABRICATION THEREOF

Electronic textiles and methods of fabrication electronic textiles. Nanoparticles of a conductive material are sprayed along a conductive path into a fabric material so as to penetrate into the fabric. A layer of a second conductor material is coated over the nanoparticles along the conductive path. A layer of an insulator material is coated over the layer of the second conductor material so as to encapsulate the conductive path and form a trace. An electrode configured to contact a subject wearing the fabric material includes a layer of a third conductor material coated over the layer of the second conductor and electrically coupled with the conductive path. An electrical connector is secured to the fabric material and electrically coupled with the conductive path. The nanoparticles are sprayed onto the fabric material using a dual regime spray process implemented with a dual regime spray system.

Systems and methods for selectively coating a substrate using shadowing features

Systems and methods for producing electromagnetic devices are provided. The systems and methods allow for an electromagnetic device having both a substrate (e.g., polymer) and conductive material (e.g., metal) to be manufactured without using masks or other outside objects disposed over a surface (e.g., the substrate) onto which the conductive material is deposited. In one exemplary embodiment, the method includes performing additive manufacturing using a polymer to produce a device having a plurality of interconnected walls and a plurality of frequency selective surface elements, and then coating portions of the device with a conductive material. A plurality of shadowing features are formed as part of one or more of the walls to protect the frequency selective surface elements from being coated by the conductive material. Other methods, and a variety of systems that can result from the disclosed methods, are also provided.

Method of manufacturing deposition mask, intermediate product to which deposition mask is allocated, and deposition mask

A deposition mask in which deformation of long sides is restrained is manufactured. A manufacturing method of a deposition mask includes a step of preparing a metal plate; a processing step of processing the metal plate into an intermediate product comprising: a plurality of deposition mask portions each including a pair of long sides and a pair of short sides, and having a plurality of through-holes formed therein; and a support portion that surrounds the plurality of deposition mask portions, and is partially connected to the short sides of the plurality of deposition mask portions; and a separation step of separating the deposition mask portions from the support portion to obtain the deposition mask. In the intermediate product, the long sides of the deposition mask portions are not connected to the support portion.

Increasing adhesion of metal-organic interfaces by silane vapor treatment

A method of improving the adhesion of a metal-organic interface in an electronic device includes providing a substrate with a metal structure, depositing a mono-layer of a selected silane composition on a surface of the metal structure with a vapor of the selected silane composition, and coating the treated surface with an organic material.

METHOD OF MANUFACTURING DEPOSITION MASK, INTERMEDIATE PRODUCT TO WHICH DEPOSITION MASK IS ALLOCATED, AND DEPOSITION MASK

A deposition mask in which deformation of long sides is restrained is manufactured. A manufacturing method of a deposition mask includes a step of preparing a metal plate; a processing step of processing the metal plate into an intermediate product comprising: a plurality of deposition mask portions each including a pair of long sides and a pair of short sides, and having a plurality of through-holes formed therein; and a support portion that surrounds the plurality of deposition mask portions, and is partially connected to the short sides of the plurality of deposition mask portions; and a separation step of separating the deposition mask portions from the support portion to obtain the deposition mask. In the intermediate product, the long sides of the deposition mask portions are not connected to the support portion.