An active composite panel assembly is configured to transfer electrical signals from a source to an electrical device. The active composite panel assembly includes a composite layer, and an active layer secured to the composite layer. The active layer is configured to receive and conduct the electrical signals.

A method of manufacturing a wiring board includes: providing an insulating member that includes a plurality of regions partitioned by partitions provided with openings at each of which adjacent ones of the regions are joined to each other; disposing conductive members respectively in the plurality of regions; and joining adjacent ones of the conductive members through one of the partitions to each other at the opening of the partition.

Various circuit boards and methods of manufacturing the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first interconnect layer of a circuit board. The first interconnect layer includes a first conductor trace with a first segment that does not include a via land. A first via is formed on the first segment.

A resin multilayer substrate includes a plurality of insulating resin base material layers and a plurality of conductor patterns provided on the plurality of insulating resin base material layers. The plurality of conductor patterns include a signal line and a ground conductor overlapping the signal line as viewed from a laminating direction of the insulating resin base material layers. A plurality of openings are provided in the ground conductor, and an aperture ratio is higher in a zone far from the signal line than in a zone adjacent to or in a vicinity of the signal line in a direction perpendicular or substantially perpendicular to the laminating direction.

A method of manufacturing a transparent electrode substrate according to an exemplary embodiment includes: a) forming a structure including a transparent base, a bonding layer on a surface of the transparent base, and a metal foil on a surface of the bonding layer opposite the transparent base; b) forming a metal foil pattern by patterning the metal foil; c) heat-treating the structure resulting from b) at a temperature of 70° C. to 100° C.; and d) completely curing the bonding layer. Also, a transparent electrode substrate is disclosed.

A wiring body includes an adhesive layer and a mesh-like electrode layer having a shape of a mesh formed by fine wires intersecting each other is formed on the adhesive layer. The mesh-like electrode layer includes an intersection region intersecting the fine wires with each other and a non-intersection region corresponding to a region except for the intersection region. A depression recessed toward the adhesive layer is formed in the intersection region.

A wiring body includes an adhesive layer and a mesh-like electrode layer having a shape of a mesh formed by fine wires intersecting each other is formed on the adhesive layer. The mesh-like electrode layer includes an intersection region intersecting the fine wires with each other and a non-intersection region corresponding to a region except for the intersection region. A depression recessed toward the adhesive layer is formed in the intersection region.

Disclosed is a transparent electrode including a transparent substrate 100, conductive nanowires 10 forming networks, nanoparticles bonding the nanowires 10, and a conductive layer embedded in the transparent substrate 100.

A wiring substrate is manufactured by attaching an adhesive protective film to a metal-foiled laminate sheet, forming bottomed via holes by partially removing the film and an insulating film, filling conductive pastes into the holes, and peeling the film. A wiring substrate is manufactured by forming an adhesive protective layer so as to cover a patterned metal foil on a metal-foiled laminate sheet, forming bottomed step via holes by partially removing the layer and an insulating film, filling conductive pastes into the holes, and peeling off a protective film. The wiring substrate and the second wiring substrate are laminated in such a way that protruding parts of the pastes come into contact with respective protruding parts of the pastes.

A wiring body includes an adhesive :layer and a conductor pattern bonded to the adhesive layer. A surface roughness of an adhesive surface in the conductor pattern bonded to the adhesive layer is rougher than a surface roughness of another surface, which is a surface of the conductor pattern except for the adhesive surface in the conductor pattern.