A wiring body includes an adhesive :layer and a conductor pattern bonded to the adhesive layer. A surface roughness of an adhesive surface in the conductor pattern bonded to the adhesive layer is rougher than a surface roughness of another surface, which is a surface of the conductor pattern except for the adhesive surface in the conductor pattern.

High thermal conductivity dielectric materials systems or pastes are useful on aluminum alloy substrates for LED and high power circuitry applications.

High thermal conductivity dielectric materials systems or pastes are useful on aluminum alloy substrates for LED and high power circuitry applications.

A wiring body includes a conductive portion that includes a contact surface having a concave-convex shape, and an adhesive layer stacked on the contact surface. The conductive portion further includes a top surface facing the contact surface that contains conductive particles. The adhesive layer includes a smooth portion with a smooth main surface provided at a constant thickness, and a protrusion that protrudes from the main surface toward a side of the conductive portion provided on the smooth portion to correspond to the conductive portion. The protrusion comes into contact with the contact surface and includes a concave-convex surface complementary to the concave-convex shape of the contact surface. The contact surface is positioned on a side of the top surface with respect to the main surface and a unit length of the contact surface is larger than a unit length of the top surface.

A wiring body includes a conductive portion that includes a contact surface having a concave-convex shape, and an adhesive layer stacked on the contact surface. The conductive portion further includes a top surface facing the contact surface that contains conductive particles. The adhesive layer includes a smooth portion with a smooth main surface provided at a constant thickness, and a protrusion that protrudes from the main surface toward a side of the conductive portion provided on the smooth portion to correspond to the conductive portion. The protrusion comes into contact with the contact surface and includes a concave-convex surface complementary to the concave-convex shape of the contact surface. The contact surface is positioned on a side of the top surface with respect to the main surface and a unit length of the contact surface is larger than a unit length of the top surface.

A wiring body includes an adhesive layer, a first conductor layer disposed on the adhesive layer that includes a first terminal portion, a resin layer covering the first conductor layer except for at least the first terminal portion, and a second conductor layer disposed on the resin layer that includes a second terminal portion. The first terminal portion and the second terminal portion are shifted from each other along a thickness direction of the adhesive layer. The first terminal portion protrudes towards a side separated from the adhesive layer in the thickness direction. In a case where the first terminal portion is projected in a direction orthogonal to the thickness direction, at least a part of a projection portion of the first terminal portion overlaps with the resin layer.

A camera module with compression-molded circuit board is manufactured by compression-molding that can obtain properties such as high flatness, ultra-thin, fine wiring width and high integration.

A printed wiring board includes a laminate, a wiring layer formed on first main surface of the laminate and including conductor pads, via conductors including first and second via conductors and formed in the laminate such that each via conductor has diameter gradually reducing from the first main surface toward second main surface of the laminate, and conductor post formed on the first via conductors such that each conductor post includes a metal foil and a plating layer formed on the metal foil. The via conductors are formed such that the first via conductors are positioned in an outer edge portion of the laminate and have minimum-diameter-side surfaces positioned to form a same plane with the second main surface of the laminate and that the second via conductors are positioned in a central portion of the laminate and have minimum-diameter-side surfaces recessed from the second main surface of the laminate.

Provided are a method of manufacturing a substrate for chip packages and a method of manufacturing a chip package, the method of manufacturing the substrate including: forming a lower adhesive layer in a lower part of an insulation film; forming an upper adhesive layer in an upper part of the insulation film to form a base material; forming via holes in the base material; and forming a circuit pattern layer on the upper adhesive layer, so it is effective to improve adhesion power between the molding resin and the insulation film at the time of manufacturing a chip package later.

A wiring board according to one embodiment of the present disclosure includes: partitions each having insulating property; and conductive members that are respectively disposed in at least two adjacent regions among a plurality of regions partitioned by the partitions. Two of the conductive members respectively disposed in the adjacent regions are joined to each other through an opening formed on one of the partitions interposed between the two of the conductive members, to serve as part of a wiring.