An optimally interconnected matrix of endpoints involves one or more conductive lanes of a substrate to be incorporated within a housing, with a plurality of conductive blocks positioned transverse to the conductive lanes. Any number of endpoints can be connected to any end of the conductive blocks. The endpoints can be interconnected by activating individual depressible terminals of the conductive lanes. Each depressible terminal is positioned above a conductive block, and activating a depressible terminals allows an electrical contact to be established between the corresponding conductive lane and the corresponding conductive block. The depressible terminals can be activated by extending a conductive or nonconductive pin through individual apertures of the housing which are positioned over the depressible terminals.

An optimally interconnected matrix of endpoints involves one or more conductive lanes of a substrate to be incorporated within a housing, with a plurality of conductive blocks positioned transverse to the conductive lanes. Any number of endpoints can be connected to any end of the conductive blocks. The endpoints can be interconnected by activating individual depressible terminals of the conductive lanes. Each depressible terminal is positioned above a conductive block, and activating a depressible terminals allows an electrical contact to be established between the corresponding conductive lane and the corresponding conductive block. The depressible terminals can be activated by extending a conductive or nonconductive pin through individual apertures of the housing which are positioned over the depressible terminals.

A printed circuit board assembly includes a main printed circuit board including a first main signal line and a first dielectric having a first permittivity; a sub printed circuit board including a first sub signal line and a second dielectric having a second permittivity smaller than the first permittivity; and a first connection block configured to connect the first main signal line of the main printed circuit board and the first sub signal line of the sub printed circuit board.

A method for modifying an elongate structure including providing a fluid deposited onto the substrate, the fluid containing a dispersion of electrically polarizable nanoparticles and applying an AC voltage across a portion of the elongate structure so as to cause an alternating electric current to pass through the narrow section such that a break in the elongate structure is formed at the narrow section, the break being defined between a first broken end and a second broken end of the elongate structure, and then cause, when the break is formed, an alternating electric field to be applied to the fluid such that a plurality of the nanoparticles contained in the fluid are assembled to form a continuation of the elongate structure extending from the first broken end towards the second broken end so as to join the first and second broken ends.

Printed circuit boards for a base station antenna include a substrate layer, and a first conductive trace and a second conductive trace which are printed on the substrate layer and cross each other. The first conductive trace has two trace sections separated by the second conductive trace. Adjacent ends of the two trace sections separated by the second conductive trace are connected electrically by a jumper. The jumper has an electrical conductor, is isolated electrically from the second conductive trace and is fixed on the printed circuit board. The electrical conductor and the two trace sections are connected electrically at adjacent ends. The printed circuit board allows flexible wiring of the conductive traces on the printed circuit board.

A microwave or radio frequency (RF) device includes an insulating substrate having a first surface and a second surface opposing the first surface. The device also includes a crossover conductor disposed on the first surface extending between a first edge of the first surface and a second edge of the first surface. The device also includes a depression in the second surface defined at least in part by (i) a third surface recessed in relation to the second surface, and (ii) at least one sidewall that extends between the second surface and the third surface. The device further includes a conductive coating formed over at least a portion of the second surface, the third surface, and the at least one sidewall, where the conductive coating is insulated from the crossover conductor by the insulating substrate.

An installation structure of a temperature fuse is disclosed. The temperature fuse includes a first leg fixed to one surface of a printed circuit board (PCB), a bent part formed to be bent several times in an outer direction of the PCB from an end part of the first leg, and a second leg incorporated with the bent part and fixed to one surface of the PCB while being spaced apart from the first leg by a predetermined distance. The installation structure of the temperature fuse includes a third leg formed to extend from any one of the first leg and the second leg, a conductive member electrically connected to the third leg while being electrically isolated from the PCB, and a sensing part electrically connected to the third leg through the conductive member, and configured to detect whether a connection state between the third leg and the conductive member is normal.

Disclosed are various embodiments relating to a circuit board included in an electronic device and, according to one embodiment, the circuit board can comprise: at least one wire included on the circuit board, at least one conductive structure arranged on the circuit board in order to reinforce the circuit board, and arranged in order to electrically connect the at least one wire; and at least one conductive member included on the circuit board, and electrically connecting the at least one wire with the at least one conductive structure, and additional other various embodiments are possible.

A circuit protection element includes a vertical wall substantially perpendicular to a mounting surface of a circuit board in a mounted state; a first mounting part formed by being bent from the first end part of the vertical wall once and substantially parallel to the mounting surface; the second mounting part formed by being bent from the second end part of the vertical wall once and substantially parallel to the mounting surface; an elastic deformation part formed so as to project from the vertical wall in a predetermined direction, which has the contact part in the vicinity of an end part thereof on the opposite side to the vertical wall, and accumulates an elastic stress caused by elastic deformation thereof; and the self-locking part formed on the vertical wall and the elastic deformation part for maintaining the elastic deformation part in a state elastically deformed.

A circuit protection element includes a first leg part formed by being bent once from a first end part of a ceiling part that is the bending reference plane; a second leg part formed by being bent once with respect to the bending reference plane; a first mounting part and a second mounting part each formed by being bent twice with respect to the bending reference plane so as to be flush mutually and parallel to a mounting surface of the circuit board; and a plastic deformation part (a curved part) set in a predetermined region of the second leg part and plastically deformed by applying a load in the vicinity of a second end part of the ceiling part toward the mounting surface of the circuit board.