A power conversion device includes a printed wiring board on which an alternating-current power-supply input part, a converter circuit part to convert alternating-current power to direct-current power, an inverter circuit part to convert direct-current power converted by the converter circuit part to alternating-current power, an alternating-current power-supply output part to output alternating-current power converted by the inverter circuit part, and a conductive pattern to electrically connect the alternating-current power-supply input part, the converter circuit part, the inverter circuit part, and the alternating-current power-supply output part to one another are provided, and a busbar that has a plate-like shape with a plane direction thereof perpendicular to a plane direction of the printed wiring board, is arranged to overlap the conductive pattern in plan view, and includes two or more connecting portions that are in contact with the conductive pattern.

Disclosed herein is a board apparatus including a printed circuit board, including a first ground wiring disposed on one surface of the printed circuit board; a second ground wiring disposed on the other surface of the printed circuit board; and a switch module disposed in an overlapped region between the first ground wiring and the second ground wiring, and including a bolt which penetrates through the printed circuit board and a nut which is in contact with the second ground wiring and is coupled to a screw of the bolt.

A membrane circuit structure with function expandability is provided. The membrane circuit structure includes a substrate, a lower circuit layer and a covering layer. The substrate includes a first region and at least one second region. The at least one second region is arranged near the first region. The lower circuit layer is printed on the first region. The lower circuit layer is made of a first conductive material. The covering layer is electroplated on a portion of a surface of the lower circuit layer. The covering layer is made of a second conductive material. At least one expansion line is welded on the corresponding second region, and electrically connected with the covering layer and a corresponding function-expanding unit.

Disclosed is an apparatus for optimally facilitating interconnections between electrical endpoints. The apparatus comprises a number of terminals equal to a number of combinations of the plurality of endpoints. For example, to enable combinations of two endpoints to be made between N endpoints, the apparatus comprises N(N1)/2 terminals. Each terminal at least comprises a first contact coupled to a first endpoint and a second contact coupled to a second endpoint. The first contact and second contact of any terminal can be shorted to connect their corresponding endpoints. The apparatus may further comprise a circuit identification process executed by a microcontroller. In this case, each terminal additionally comprises a first circuit identification contact and a second circuit identification contact. The process involves outputting a voltage to the first circuit identification contact and detecting the voltage of the second circuit identification contact to determine whether the corresponding terminal is activated.

A computing device, computer-readable medium, and method are provided to dynamically configure an FPGA of a computing device at runtime without rebooting the computing device. At least one upgradable capability of the FPGA is displayed to a user. The user selects an upgradable capability of the FPGA and accepts a license to enable the selected upgradable capability. An update to a reconfigurable FPGA image associated with the FPGA is obtained in response to issuance of the license. The update to the reconfigurable FPGA image is installed on the FPGA to enable the selected upgradable capability of the FPGA. An operating system of the computing device is notified of the update to the reconfigurable FPGA image at runtime, and the operating system exposes the selected upgradable capability of the FPGA to at least one component of a software stack managed by the operating system.

The printed circuit board includes metallic zones including: a first, second and third positive terminal, a first and second negative terminal, wherein the second negative terminal is connected to the first negative terminal, and electric contacts for the mounting of one or more LEDs and electric traces such that the LEDs are connected in series forming a LED string. The printed circuit board comprises selection means implemented with electric traces and metallic contacts adapted to be short-circuited via links in order to permit all of the following connections: a connection of the LED string between the first and third positive terminal, a connection of the LED string between the first positive terminal and the first negative terminal, a connection of the LED string between the second and third positive terminal, and a connection of the LED string between the second positive terminal and the first negative terminal.

A substrate for a light emitting device includes: a plurality of wiring patterns, each including: a first conductive pattern including: a light emitting element mounting region defined by a first, second, third, and fourth sides in a plan view, and a contact region; and a second conductive pattern surrounding a portion of the first side where the contact region is not present, an entirety of the second side, and a portion of or an entirety of the third side, wherein a first end portion of the second conductive pattern at the third side is positioned nearer to the fourth side than a second end portion of the second conductive pattern at the first side is to the fourth side. The third side of a second wiring pattern faces the first side of a first wiring pattern.

A method for attaching a prefabricated miniature coaxial wire to a first electrical connection point, the prefabricated miniature coaxial wire having an electrically conductive core disposed within an electrical insulation layer disposed within an electrically conductive shield layer, includes attaching an exposed portion of the electrically conductive core at a distal end of the prefabricated miniature coaxial wire to the first electrical connection point, thereby establishing electrical conductivity between the electrically conductive core and the first electrical connection point, depositing a layer of electrically insulating material onto the exposed portion of the electrically conductive core such that the exposed portion of the electrically conductive core and the first electrical connection point is encased in the layer of electrically insulating material, and connecting the electrically conductive shield layer to a second electrical connection point using a connector formed from an electrically conductive material.

A circuit board with wire conductive pads is provided for insertion of wires, and includes: a circuit board and a wire conductive pad. The wire conductive pad includes a main body in the form of a hollow column and an elastic locking piece extending from the main body. The main body includes a peripheral wall defining an insertion space. The elastic locking piece is inserted from the peripheral wall into the insertion space in an inclined manner to press towards the peripheral wall. Wires are inserted into the insertion space and clamped against the peripheral wall by the elastic piece, so that the wires can be prevented from falling off in a reverse direction, and thus can be connected to the circuit board in a more quick and stable manner.

A semiconductor package includes a substrate, a conductive layer, a first surface mount device (SMD) and a bonding wire. The substrate has a t top surface. The first conductive layer is formed on the top surface and has a first conductive element and a first pad separated from each other. The first SMD is mounted on the first pad, overlapping with but electrically isolated from the first conductive element. The first bonding wire electrically connects the first SMD with the first conductive layer.