An electronic assembly includes an electronic package having an integrated circuit component and interposer assemblies with compressible interposer contacts electrically connected thereto. Cable connector modules are coupled to the interposer assemblies. A cover assembly is coupled to the upper surface of the electronic package over the cable connector modules. The cover assembly includes bridge assemblies having plates in a plate stack that are independently movable. A load plate engages upper edges of the plates of the bridge assemblies and press against the plates to drive the bridge assemblies into the cable connector modules using compression hardware. The cable connector modules compress the interposer contacts of the interposer assemblies when the load plate presses the plates of the bridge assemblies into the cable connector modules.

A battery pack including a first printed circuit board, a second printed circuit board, and a PCB spacer, the PCB spacer including a housing and at least two board-to-board terminals, the PCB spacer housing injection molded around the board-to-board terminals, wherein the first printed circuit board coupled to a first side of the PCB spacer and the second printed circuit board coupled to a second side of the PCB spacer, the first side of the PCB spacer being opposed to the second side of the PCB spacer.

The power semiconductor module includes a power semiconductor assembly and a heat transfer member. The power semiconductor assembly includes a circuit board and a case. The circuit board includes an insulating substrate. The second attachment surface to which the heat transfer member is attached is recessed from the first attachment surface to which the heat sink is attached. The maximum recessed distance of the second attachment surface from the first attachment surface is smaller than the original thickness of the heat transfer member, and is greater than the lower limit thickness of the heat transfer member.

A coupling device for coupling a plurality of cable units to a component carrier includes a base plate that is flat in at least one plane. A connecting device is disposed on a first side of the base plate and is configured to mechanically couple the base plate to the component carrier. An opening extends through the base plate for each cable end of a plurality of cable ends of the cable units. The opening in each case is disposed on the base plate at a position corresponding to the respective cable unit.

A surge protective device (SPD) circuit system for providing overvoltage protection to an electrical power circuit includes a PCB assembly, an SPD module, and an SPD monitoring system. The PCB assembly selectively mountable on the PCB includes a PCB and a remote signal (RS) PCB contact on the PCB. The SPD module includes an overvoltage clamping element and an RS spring contact including an RS contact portion. When the SPD module is mounted on the PCB and the electrical power circuit is connected to the PCB: the PCB electrically connects the SPD module to the circuit and the overvoltage clamping element provides overvoltage protection to the circuit; the RS contact portion engages the RS PCB contact; the RS spring contact is elastically deflected and persistently loads the RS contact portion against the RS PCB contact; and the RS spring contact is electrically connected to the SPD monitoring system via the RS PCB contact.

A structure includes a main substrate including a first surface and a second surface opposite to the first surface, a power supply module on the main substrate, a socket in the main substrate, and one or more power supply wirings and one or more signal wirings extending in a thickness direction of the main substrate and penetrating the socket. Each of the one or more power supply wirings includes a first end on the first surface side and a second end on a side opposite to the first end. Each of the one or more signal wirings includes a third end to be electrically connected to an electronic component and a fourth end on a side opposite to the third end. The fourth end is electrically connected to a conductor pattern on the first surface.

Provided is a method for operating an electronic component mounting system including component storages including a dry box. The method includes maintaining a material management table including a whereabouts information field for indicating whether an electronic component is stored in the dry box, a target indicator field for indicating whether an electronic component is a moisture management target component, and an exposure time field for indicating an exposure time during the moisture management target component has been in an atmospheric exposure state. The method also includes pausing counting the exposure time when the moisture management target component is stored in the dry box, identifying a moisture management target component of which the exposure time has met or exceeded an exposure limit time based on the whereabouts information table, and notifying the identified moisture management target component to an apparatus.

Disclosed are special component carriers made of MID-capable plastic in order to make the geometric arrangement of electrical components, such as microprocessors, LEDs, sensors, antennas and the like, on a circuit board more flexible. Said component carriers can have a standardized footprint for connecting to the circuit board and can be adapted to the terminals and the geometric arrangement of the components using individually applied conducting tracks, in particular in an LDS process. Furthermore, the specially shaped component carriers allow the electrical components to be geometrically oriented, in particular at a right angle to the circuit board and parallel to the circuit board, which is especially highly advantageous for antennas and acceleration sensors. Furthermore, SMT soldering is made possible in the pre-mounted state even for temperature-sensitive components.

A circuit board includes a board including a first surface and a second surface opposing the first surface, where the board includes at least one conductive layer and at least insulating layer, a plurality of electronic elements disposed on the first surface of the board, and a plurality of resistive pads disposed on the second surface of the board and electrically connected to at least one selected from the electronic elements. The resistive pads have a resistance of zero ohm.

A transmission control apparatus, particularly for a motor vehicle, includes a circuit board element, a signal input element, a base, and a first fixing layer. The base includes a hollow space for receiving at least a part of the signal input element and is fastened on a first surface of the circuit board element. The signal input element is at least partially fastened in the hollow space and is electrically connected to the circuit board element via the base. The circuit board element includes a cut-out for inserting the signal input element into the hollow space through the circuit board element. The first fixing layer is configured for sealing the area between the base and the circuit board element and is arranged on the first surface of the circuit board element and on a part of the base.