A circuit board assembly for electronic devices includes a circuit board having a first surface and a second surface opposite the first surface, and a heat sink carrier disposed on the first surface of the circuit board. The heat sink carrier includes at least one clamp portion. The assembly also includes a heat sink. The heat sink is positioned in the at least one clamp portion of the heat sink carrier to transfer heat from one or more electronic devices to the heat sink via the heat sink carrier.

In an apparatus for coupling integrated circuits to printed circuit boards, a backing plate with manufactured features on the top surface includes a module lid; a planar structure; a device seated in the planar structure, with the module lid in contact with the top surface of the device; and a backing plate that contains manufactured features on one side. The backing plate is in contact with the planar structure, and a plurality of fastening mechanisms couple together the lid, the device, the planar structure, and the backing plate.

An example printed circuit board includes: a fixed portion disposed on the printed circuit board, the fixed portion defining a first end of a card slot to receive a card on the printed circuit board; a support bracket to be installed on the printed circuit board, the support bracket including a retaining portion to retain the card in the card slot, the retaining portion defining a second end of the card slot; and wherein the support bracket is orientable in one of: (i) a first orientation to define a first length of the card slot between the fixed portion and the retaining portion and (ii) a second orientation to define a second length of the card slot between the fixed portion and the retaining portion.

A speed sensor assembly (114) includes a printed circuit board (PCB) (120) having a first main side and a second main side, a magnet (116) directly coupled to the first main side of the PCB (120), a sensor (118) electrically connected to the PCB (120), and a pole piece (125) directly coupled to the magnet (116) and to the sensor (118), wherein the magnet (116) includes a slot partially enclosed by the pole piece (125). The speed sensor assembly (114) including a slotted magnet (116) to reduce magnetic field amplitude for single sensing element hall effect sensor applications. The speed sensor assemblies (114) operate with both minimum and maximum air gaps.

Various embodiments of the present disclosure are directed to electrically conductive connection between a first electrically conductive element and a second electrically conductive element on a textile carrier material. In one example embodiment, the electrically conductive connection includes an electrically conductive thermal transfer adhesive arranged on the carrier material and creates an electrically conductive connection between the first conductive element and the second conductive element. The electrically conductive connection is positioned in electrically conductive contact with the first conductive element and the second conductive element.

A semiconductor assembly includes a carrier including a dielectric substrate and a plurality of contact pads disposed on an upper surface of the carrier, first and second surface mount packages mounted on the carrier, first and second discrete inductors respectively mounted over the first and second surface mount packages, wherein the first and second surface mount packages each comprise lower surface terminals that face and electrically connect with the contact pads from the carrier, wherein the first and second surface mount packages each comprise an upper side that faces away from the carrier, and wherein the first and second discrete inductors are respectively thermally coupled to the upper sides of the first and second surface mount packages.

A method of manufacturing an electronic device including the following steps is provided herein. A plurality of first electronic components is provided. The plurality of first electronic components is transferred onto a plurality of pickup sites. An empty pickup site from the plurality of pickup sites may be figured out, wherein the plurality of first electronic components is absent at the empty pickup site. A second electronic component is transferred onto the empty pickup site. A target substrate is provided. The plurality of first electronic components and the second electronic component are transferred onto the target substrate.

A cable card assembly includes a circuit card having a substrate including mating pads at a mating end and cable pads at a cable end. The circuit card has a ground plane. Cables are terminated to the circuit card at the cable end each having signal conductors, an insulator surrounding the signal conductors, and a ground conductor surrounding the insulator. Cable shields are terminated to the ground plane providing electrical shielding for the corresponding cables. Each cable shield includes an end wall between first and second side walls to form a cable cavity. The end wall has a connecting portion between the first and second side walls and a shroud portion extending from the connecting portion covering a portion of the ground conductor. The shroud portion is curved to follow a curvature of the ground conductor and extend along opposite sides of the ground conductor.

A variable-stiffness module comprises a rigid structure (10) having a first stiffness, an intermediate substrate (20) having a second stiffness less than the first stiffness, and a flexible substrate (30) having a third stiffness less than the second stiffness. The rigid structure (10) is disposed on the intermediate substrate (20) and the intermediate substrate (20) is disposed on the flexible substrate (30). A conductor (40) is disposed partially on the intermediate substrate (21) and partially on the flexible substrate (30) and connected to the rigid structure (10). The conductor (40) extends from the rigid structure (10) to the intermediate substrate (21) to the flexible substrate (30). In some embodiments, a variable-stiffness module comprises any combination of multiple rigid structures, multiple intermediate substrates, and multiple conductors. The conductor (40) can be an optical conductor or an electrical conductor and can be disposed over the rigid structure (10) or between the rigid structure (10) and the intermediate substrate (21).

An electronic component includes an element body, an external electrode, and a metal terminal. In the metal terminal, a base includes a first surface and a second surface opposing each other, and a pair of third surfaces coupling the first surface and the second surface. A first metal layer is disposed on the first surface and connected to solder with which the external electrode and the metal terminal are connected together. A second metal layer is disposed on the second surface. A coating layer is disposed on each of the third surfaces. The first metal layer and the second metal layer each include an outermost layer containing Sn. Each of the coating layer includes an outermost layer lower in solder wettability than the respective outermost layers of the first metal layer and the second metal layer.