A locator is for aligning cables which are configured to be connected with a circuit board having an accommodated portion. The locator comprises at least a main portion which extends in a pitch direction. The main portion is, at least in part, formed with at least one circuit board accommodating portion. The main portion is formed with at least one first through hole and at least one second through hole which is different from the first through hole. The at least one circuit board accommodating portion is configured to accommodate the accommodated portion of the circuit board. The at least one circuit board accommodating portion opens at least forward in a front-rear direction perpendicular to the pitch direction. In the pitch direction, the at least one first through hole is provided at a location which is different from a location of the circuit board accommodating portion.

A multi-functional spacer element for spacing at least one printed circuit board from an opposite spacing surface. The spacer element can not only accomplish the spacing of one or more printed circuit boards, but can also support a fastening function to a carrier element and an electrical ground connection. A passageway extends through the main body. The spacer element includes a press-in element. The spacer element 1 includes an electrically conductive material for electrically conducting from at least a first contact surface to the press-in element.

Provided is a method for operating an electronic component mounting system including component storages including a dry box. The method includes maintaining a material management table including a whereabouts information field for indicating whether an electronic component is stored in the dry box, a target indicator field for indicating whether an electronic component is a moisture management target component, and an exposure time field for indicating an exposure time during the moisture management target component has been in an atmospheric exposure state. The method also includes pausing counting the exposure time when the moisture management target component is stored in the dry box, identifying a moisture management target component of which the exposure time has met or exceeded an exposure limit time based on the whereabouts information table, and notifying the identified moisture management target component to an apparatus.

A fixing apparatus comprises a first fixing device and a second fixing device. The first fixing device is adapted to position and fix a circuit board having at least one pad. The first fixing device has a first positioning groove adapted to position the circuit board. The second fixing device is adapted to position and fix at least one wire. The second fixing device has at least one second positioning groove adapted to position the at least one wire. Each second positioning groove is aligned with a corresponding pad on the circuit board so that the wire in the second positioning groove is aligned with the corresponding pad on the circuit board.

Apparatuses, systems and methods associated with connector design for mating with integrated circuit packages are disclosed herein. In embodiments, a connector for mating with an integrated circuit (IC) package may include a housing with a recess to receive a portion of the IC package and a contact coupled to the housing and that extends into the recess. The contact may include a main body that extends from the housing into the recess and a curved portion that extends from an end of the main body, wherein the curved portion loops back and contacts the main body. Other embodiments may be described and/or claimed.

A heatsink assembly comprising a substrate having an active circuitry, at least one cavity located adjacent to at least one heat producing element of the active circuitry, at least one vessel sealably coupled to said substrate in fluid communication with the at least one cavity, and a phase change material (PCM) contained inside the vessel. The vessel and at least one cavity configured to facilitate migration of the PCM from the vessel into the at least one cavity for absorbing heat produced by the at least one heat producing element of the active circuitry

A mounting structure for a heater element includes a heater element having a surface to be cooled, a board on which the heater element is mounted, a cooling member that cools the surface to be cooled of the heater element mounted on the board, and a supporting member temporarily fixed to the board, the supporting member temporarily fixing the heater element.

An electrical connector includes an insulation body, a seat, and a positioning plug. The seat is disposed on an outer peripheral surface of the insulation body. The seat includes a tunnel defined through the seat to form an inlet and an outlet. The outlet and a front surface of the insulation body face the same side. The seat further includes a slit and one or more first bumps disposed on an inner wall of the slit. The positioning plug includes a sliding block and rib. The sliding block movably disposed in the tunnel via the inlet with the rib movably disposed in the slit. The positioning plug further includes a second bump disposed on a lateral side of the rib facing the first bump. When the sliding block moves to an installation position, the first bump stops the second bump to fix the sliding block at the installation position.

Disclosed herein is an apparatus that comprises a printed circuit board having a first major surface, a second major surface opposite the first major surface, and a minor surface perpendicular to the first major surface and the second major surface. The apparatus also comprises an electronic component that comprises a ball grid array, having spaced apart solder balls, on a mounting surface of the electronic component. The electronic component is mounted to the minor surface of the printed circuit board such that the mounting surface is parallel to the minor surface and perpendicular to the first major surface and the second major surface. The solder balls of the ball grid array are electrically connected to both the first major surface and the second major surface of the printed circuit board.

An electronic device includes chip components, a terminal connection body, conductive terminals, and a support member. Each of the chip components has a pair of end surfaces on which terminal electrodes are formed. The terminal connection body connects the terminal electrodes on one side of the chip components arranged next to each other in a parallel direction to the end surfaces. Each of the conductive terminals includes a connection part and a mount part. The connection part is connected with the terminal electrode of either of the chip components located on both ends of the chip components connected in series via the terminal connection body. The mount part faces the connection part and is connected with a mount board. The support member is disposed between the connection parts and the mount parts. The chip components are arranged so that the end surfaces face the mount board.