Provided is a method for operating an electronic component mounting system including component storages including a dry box. The method includes maintaining a material management table including a whereabouts information field for indicating whether an electronic component is stored in the dry box, a target indicator field for indicating whether an electronic component is a moisture management target component, and an exposure time field for indicating an exposure time during the moisture management target component has been in an atmospheric exposure state. The method also includes pausing counting the exposure time when the moisture management target component is stored in the dry box, identifying a moisture management target component of which the exposure time has met or exceeded an exposure limit time based on the whereabouts information table, and notifying the identified moisture management target component to an apparatus.

Various technologies for integrating a microinverter with a photovoltaic module are disclosed. An alternating current photovoltaic (ACPV) module includes a photovoltaic module having a frame and a junction box including a direct current (DC) output connector, and a microinverter having a housing coupled to the frame and a DC input connector electrically mated with the DC output connector of the photovoltaic module.

Disclosed is a printed circuit board having a holder for a battery, wherein the holder includes first and second contacts connected to conductive traces of the printed circuit board and wherein the holder is embodied such that a battery inserted into the holder is clamped so that poles of the battery on opposite end faces of the battery make electrical contact with the first and second contacts. The battery lies clamped between the contacts on a support region of the printed circuit board and is oriented with reference to the printed circuit board so that an imaginary line connecting the poles of the battery is essentially in parallel with the plane of the support region. The printed circuit board has connected with the support region a rigid first section, which is essentially perpendicular to the support region, and wherein the first contact is arranged on the first section.

Techniques for reducing warpage for microelectronic packages are provided. A warpage control layer or stiffener can be attached to a bottom surface of a substrate or layer that is used to attach the microelectronics package to a motherboard. The warpage control layer can have a thickness approximately equal to a thickness of a die of the microelectronics package. A coefficient of thermal expansion of the warpage control layer can be selected to approximately match a CTE of the die. The warpage control layer can be formed from an insulating material or a metallic material. The warpage control layer can comprise multiple materials and can include copper pillar segments to adjust the effective CTE of the warpage control layer. The warpage control layer can be positioned between the microelectronics package and the motherboard, thereby providing warpage control without contributing to the z-height of the microelectronics package.

Provided is a method for operating an electronic component mounting system including component storages including a keeping rack, a dry box and a dryer. The method includes, after a reel of a moisture sensitive device is dispatched from a component keeping area and setup to a tape feeder is performed in an external setup area, measuring a exposure time for which the moisture sensitive device is in an atmospheric exposure state is in a reel unit, and comparing the exposure time with an exposure limit time set for the moisture sensitive device and stored in a storage. The method includes stopping using the reel of the moisture sensitive device whose exposure time exceeds the exposure limit time.

A camera substrate assembly, a camera apparatus, and a terminal device, where the camera substrate assembly includes a rigid support plate and a printed circuit board laminated, where at least two mounting holes for accommodating camera chips are disposed on the printed circuit board, the rigid support plate has mounting surfaces facing the mounting holes respectively and are configured to support the camera chips, strength of the rigid support plate is greater than strength of the printed circuit board, and flatness of the mounting surfaces is less than a specified threshold. The mounting holes disposed on the printed circuit board and the mounting surfaces disposed on the rigid support plate are used to support cameras. This avoids impact of warpage on camera mounting when the printed circuit board and a flexible circuit board are laminated, and improves flatness after camera mounting.

A formed enclosure part for mounting an electronic component on a printed circuit board includes a receiving side having an enclosure opening for receiving the electronic component in an enclosure interior, a connection side adjoining the receiving side and having connection leadthroughs for electrical connections of the electronic component, and a mounting side having a formed-on mounting profile for positioning the formed enclosure part and holding the formed enclosure part on the printed circuit board without the use of tools. An electronic subassembly, which is also provided, receives a printed circuit board and the formed enclosure part having an electronic component disposed therein.

A camera module according to one embodiment comprises: a housing including a through hole and a lens assembly disposed in the through hole toward a first surface on which light is incident; an infrared filter attached to a second surface of the housing, positioned on the opposite side of the first surface to shield inflow of infrared rays from the incident light; and an image sensor for recognizing the light passing through the infrared filter, wherein the infrared filter comprises: an effective filtering region for transmitting visible light; an attachment region attached by an adhesive applied to the second surface of the housing, for forming the exterior of the infrared filter; and a masking region formed between the attachment region and the effective filtering region, wherein the effective filtering region is formed to protrude from a vertex region and overlaps with a region in which the image sensor is positioned and the attachment region is formed as an area capable of securing adhesion with the second surface and forms chamfered edges according to a shape of the masking region such that ultraviolet light can be transmitted to cure the adhesive.

A method of printing comprises providing a component source wafer comprising components, a transfer device, and a patterned substrate. The patterned substrate comprises substrate posts that extend from a surface of the patterned substrate. Components are picked up from the component source wafer by adhering the components to the transfer device. One or more of the picked-up components are printed to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts, thereby providing one or more printed components in a printed structure.

An electronic device includes a plurality of chip components, an intermediate metal terminal, and an outer metal terminal. The intermediate metal terminal connects end surfaces of terminal electrodes of the chip components. The outer metal terminal is connectable to the terminal electrode positioned opposite to the terminal electrode connectable to the intermediate metal terminal.