A component mounting method includes an application step of applying a specific solder paste including Sn and a metal other than Sn to a board; a disposition step of positioning and disposing an upper surface reference type component having a positioning reference on an upper surface with respect to one or more reference points on the board; and a reflow step of reflow-soldering the component by heating the board, in which in the specific solder paste, at least a part of the Sn is melted, and molten Sn and the metal other than Sn form an intermetallic compound in the reflow step, thereby fixing the upper surface reference type component to the board.

A flip-chip process is to provide a pressing jig with a channel, so that the pressing jig grips a chip module by vacuum suction through the channel, and the chip module can be bonded onto a circuit board via a plurality of solder bumps through the pressing jig, and then a heating device is provided to heat the plurality of solder bumps and reflow the plurality of solder bumps. Therefore, the chip module can be vacuum-gripped by the pressing jig to suppress deformation of the chip module, so that the solder bumps can effectively connect to corresponding contacts of the circuit board.

A method for producing a power semiconductor module arrangement includes: arranging a semiconductor substrate in a housing, the housing including a through hole extending through a component of the housing; inserting a pin or bolt into the through hole such that an upper end of the pin/bolt is not inserted into the through hole; arranging a printed circuit board on the housing; arranging the housing on a heat sink having a hole, the housing being arranged on the heat sink such that the through hole is aligned with the hole in the heat sink; and by way of a first pressing tool, exerting a force on a defined contact area of the printed circuit board and pressing the pin/bolt into the hole in the heat sink, wherein the defined contact area is arranged directly above the pin/bolt.

A control device includes a standard substrate on which a first input/output circuit and a control circuit configured to control the first input/output circuit are mounted, and a power supply substrate on which a connection portion and a power supply circuit are mounted. The first input/output circuit is at least one of an input circuit or an output circuit for a standard electrical equipment. The connection portion is configured to be connected to a power supply line for supplying electric power. The power supply circuit is configured to generate electric power for operating the standard substrate from the electric power supplied from the power supply line.

A method of printing comprises providing a component source wafer comprising components, a transfer device, and a patterned substrate. The patterned substrate comprises substrate posts that extend from a surface of the patterned substrate. Components are picked up from the component source wafer by adhering the components to the transfer device. One or more of the picked-up components are printed to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts, thereby providing one or more printed components in a printed structure.

A multilayer printed circuit board having a stackup including an upper half of the stackup and a lower half of the stackup, the multilayer printed circuit board having a top exposed surface and a bottom exposed surface, a first trace and via structure, having one portion disposed on the top exposed surface and another portion disposed within the upper half of the stackup, a second trace and via structure, having one portion disposed on the top exposed surface and another portion disposed within the upper half of the stackup, and first electrical components and second electrical components disposed on the top exposed surface of the multilayer printed circuit board and associated, respectively, with the first trace and via structure and the second trace and via structure, wherein the first electrical components are mounted orthogonally with respect to the second electrical components.

A printed circuit board (PCB) (4) including an upper surface having one or more electrical terminals (9) thereon, said terminal adapted for connection to corresponding terminal of one or more electrical components, and further including one or more platforms (10) fabricated thereon, said platforms being located adjacent to corresponding component terminals, said platforms being adapted to support an electrical component thereupon, such that a portion of the component overhangs said platform above said corresponding PCB terminal.

A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.

Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface; and a die embedded in the package substrate, wherein the die has a first surface and an opposing second surface, the die has first conductive contacts at the first surface and second conductive contacts at the second surface, and the first conductive contacts and the second conductive contacts are electrically coupled to conductive pathways in the package substrate.

Precisely aligned assemblies can be complex, time consuming, labor intensive, and expensive and a need exists for better alternatives. Systems and methods described herein yield high precision printed circuit board assemblies (PCBAs) that contain pre-built alignment features to address this need. The work of precisely locating components on the PCBA to a final position in the overall assembly is already built in to the board. Locating features are used to precisely position one or more components, such as optical components, electro optical components, or mechanical components in assemblies. The locating features may be used to constrain the positions of those components, such as by kinematic coupling, solder wetting dynamics, semiconductor cleaving, dicing, photolithographic techniques for etching, constant contact force, and advanced adhesive technology to result in optical level positioning that significantly improves or eliminates assembly alignment challenges.