An operator uses a handheld fastening tool to fasten a surface-mount technology printed-circuit board (PCB) to an adjacent object by installing a fastener at a target location on the PCB. The operator wears augmented-reality (AR) eyewear equipped with image-recognition technology. The system identifies the distance between the target location and the nearest electronic component mounted to the PCB. An accelerometer integrated into the fastening tool continuously monitors the inclination of the tool and the frequency of operator hand movements while holding the tool. The distance, inclination, and movement measurements are used to derive a composite score indicating a likelihood that the current fastening task will be completed successfully without damage. The eyewear represents the score to the operator as a color-coded AR object. The measurements, scores, and color coding are continuously updated to give the operator real-time feedback about the operator's current likelihood of success.

In an example, a device includes: a printed circuit board (PCB); at least one solid state drive (SSD) connected at a first side of the PCB via at least one SSD connector; at least one field programmable gate array (FPGA) mounted on the PCB at a second side of the PCB; and at least one connector attached to the PCB at a third side of the PCB, wherein the device is configured to operate in a first speed from a plurality of operating speeds based on a first input received via the at least one connector.

A connector includes mounting tabs that are extended relative to traditional mounting tabs. On a back side of the printed circuit board (PCB), the mounting tabs connect to a back plate. The mounting tabs extend through the PCB and connect with the back plate, which provides improved structural integrity. Depending on the connector, the use of the mounting tabs can use existing mounting holes for the connector and remove the need for additional mounting holes.

Various circuit boards with mounted passive components and method of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes at least partially encapsulating a first plurality of passive components in a molding material to create a first molded passive component group. The first molded passive component group is mounted on a surface of a circuit board. The first plurality of passive components are electrically connected to the circuit board.

Disclosed herein are embodiments of a sensor assembly, methods of manufacturing the same, and methods of using the same. In one embodiment, a sensor assembly comprises a substrate comprising an outer region, an inner region, and a middle region positioned between the outer region and the inner region, the substrate further comprising electrical contact pads on at least the inner region. The sensor assembly further comprises a housing coupled to the substrate at the outer region or at the middle region to form a hermetic seal. The sensor assembly further comprises a sensor device coupled to the substrate, via the electrical contact pads, at the inner region. In certain embodiments, the sensor assembly further comprises a conformal coating deposited on at least a portion of the sensor assembly.

Various circuit boards with mounted passive components and method of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes at least partially encapsulating a first plurality of passive components in a molding material to create a first molded passive component group. The first molded passive component group is mounted on a surface of a circuit board. The first plurality of passive components are electrically connected to the circuit board.

An electronic card includes a substrate, an electronic device bonded to the substrate via a solder bump, and configured to include a first ceiling, and a cover fixed to the substrate, provided over the electronic device, and configured to include a second ceiling that faces the first ceiling, wherein the first ceiling or the second ceiling is provided with an annular member extending in a facing direction of the first ceiling and the second ceiling, the annular member forming an annular shape along a circumferential direction of the first ceiling, wherein the first ceiling and the second ceiling form a gap between the first ceiling and the second ceiling filled with a filling material inside the annular member, and wherein the second ceiling includes a through hole at a position that overlaps the filling material when viewed in a plan view of the second ceiling.

A embedded passive structure, a microelectronic system, and an integrated circuit device assembly, and a method of forming the embedded passive structure. The embedded passive structure includes a base layer; a passive device attached to the base layer; a first power plane comprising metal and adjacent an upper surface of the base layer, the first power plane having a portion electrically coupled to a terminal of the passive device, wherein an upper surface of a combination of the first power plane and the passive device defines a recess; a second power plane comprising metal, the second power plane at least partially within the recess and having a lower surface that conforms with the upper surface of the combination; and a liner including a dielectric layer between the first power plane and the second power plane.

A surface mountable laser driver circuit package is configured to mount on a host printed circuit board (PCB). A surface mount circuit package includes a lead-frame. A plurality of laser driver circuit components is mounted on and in electrical communication with the lead-frame of the surface mount circuit package. A dielectric layer is located between the lead-frame and the host PCB and includes portals through the dielectric layer each arranged to accommodate an electrical connection between the lead-frame and the host PCB. The lead-frame and the dielectric layer are arranged such that a first lead-frame portion and a first dielectric layer portal align with a first end of a host PCB trace configured to provide a current return path for the surface mount laser driver, and a second lead-frame portion and a second dielectric layer portal align with a second end of the host PCB trace.

The present disclosure relates to a surface-mounted heat sink and a power module using the same. The power module includes a circuit board, a magnetic element and at least one power device. The magnetic element is disposed at an upper side of the circuit board, the at least one power device is disposed on a surface of the circuit board and located between the magnetic element and a lower side of the circuit board. The surface-mounted heat sink is disposed on the surface of the circuit board and adjacent to the at least one power device. A top surface disposed on one side of the magnetic element and the surface of the circuit board form a limiting height, the surface-mounted heat sink has a first height formed between a sucked surface and a surface-mounted surface thereof, and the limiting height is greater than or equal to the first height.