Provided are a light board, a method for manufacturing the same, a light-emitting diode (LED) backlight module and an LED backlight device. The light board includes a substrate and a LED device. The substrate includes a first surface and a second surface disposed opposite to each other. The first surface and the second surface are each provided with a wiring area and a non-wiring area. A first heat sink assembly and multiple first reinforcement ribs are disposed in the non-wiring area of the first surface. The multiple first reinforcement ribs intersect to form a first encircled area. The first heat sink assembly is disposed in the first encircled area. The LED device is disposed in the wiring area of the second surface.

A half-bridge having power connections and signal connections shaped from a leadframe, the signal connections electrically connected to semiconductor switching elements so that they can be switched by the signal connections, and the power connections are electrically connected to the switching elements in so that they switch an electrical power transmission between the power connections. The switching elements are embedded in a modular layer system including a contact-connection plane and a metallization for contact-connecting the switching elements, the signal connections and the power connections are arranged on a first surface of the substrate. The modular layer system, the signal connections and the power connections are potted with a potting compound, and external sections of the power connections and/or signal connections shaped in the leadframe extend out of the potting compound from a second surface orthogonal to the first surface, the external sections having ends that are perpendicular to the first surface.

A component holding device for the fixed-position arrangement of an electric component on a circuit board, having a support side for receiving the electric component, wherein at least one pretensioning element and at least one first latching element for the fixed-position latching of the electric component are provided on the support side, and the at least one pretensioning element is designed to exert a pretensioning force on the electric component, which presses the electric component against the at least one first latching element, and having at least one second latching element on an underside lying opposite the support side, wherein the second latching element is designed to fix the component holding device in a predefined location in a fixed position on the circuit board.

A method for soldering an electronic component to a circuit board involves jetting liquefied solder. A laser beam melts a solid solder ball to produce a liquefied solder ball before the ball is jetted. The liquefied solder ball is jetted towards a through hole in the circuit board such that a portion of the liquefied solder ball flows into an annular gap between a pin and sides of the through hole. The pin is attached to the electronic component and passes through the through hole. As the liquefied solder ball is jetted towards the through hole, the laser beam is directed at the ball so as to keep it liquefied. How much of the solder ball remains outside the through hole after liquefied solder has flowed into the annular gap is determined. The filling degree of the annular gap is determined based on how much solder remains outside the hole.

An electric compressor includes: a circuit board on which a plurality of switching elements (33) are mounted; a compression mechanism which is driven by a motor operated using AC power output from the switching elements (33); and a lead holding member (50) disposed between element main bodies (33a) of the switching elements (33) and the circuit board. The circuit board includes a plurality of through-holes through which a plurality of leads (33b) that extend from the element main bodies (33a) can be respectively inserted. The lead holding member (50) includes lead insertion holes (53) through which the leads (33b) can be inserted such that positions of the leads (33b) is held at positions that correspond to positions of the through-holes.

A wafer includes a number of conductive terminals and an insulating frame. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. Each conductive terminal includes a connection portion and a contact portion. The connection portions of the differential signal terminals, the first ground terminal and the second ground terminal are located in a first plane. The first ground terminal includes a first torsion portion and the second ground terminal includes a second torsion portion. The contact portion of the first ground terminal and the contact portion of the second ground terminal are both perpendicular to the first plane. This present disclosure can provide better shielding effect, reduce crosstalk and improve the quality of signal transmission. In addition, the present disclosure also relates to a backplane connector having the wafer.

Current measurement devices for printed circuit board mounting are disclosed herein. The current measurement devices include a hollow and flexible core to improve response to a primary signal and decrease weight. The current measurement device includes a housing with guides to maintain alignment of the core. An electromagnetic shield may be placed between the circumference of the core and the housing. The housing may include apertures to facilitate washing. The current measurement device may include a primary conductor external to the housing.

A package structure includes a first dielectric layer, semiconductor device(s) attached to the first dielectric layer, and an embedding material applied to the first dielectric layer so as to embed the semiconductor device therein, the embedding material comprising one or more additional dielectric layers. Vias are formed through the first dielectric layer to the at least one semiconductor device, with metal interconnects formed in the vias to form electrical interconnections to the semiconductor device. Input/output (I/O) connections are located on one end of the package structure on one or more outward facing surfaces thereof to provide a second level connection to an external circuit. The package structure interfits with a connector on the external circuit to mount the package perpendicular to the external circuit, with the I/O connections being electrically connected to the connector to form the second level connection to the external circuit.

A backplane connector includes a housing and a number of wafers assembled to the housing. Each wafer includes a number of conductive terminals, an insulating frame and a metal shield. The housing includes an insulating housing and a metal shell fixed to the insulating housing. The insulating housing includes a number of slots for positioning the wafers. The metal shell is provided with a mating surface and a number of terminal receiving grooves. The contact portions of the conductive terminals are exposed in the corresponding terminal receiving grooves. The present disclosure improves the structural strength of the backplane connector and reduces the risk of damage the mating surface due to the push or collision of a mating connector.

A power semiconductor component is specified, having a power semiconductor device arranged within a housing, wherein a heat sink is exposed on a first surface of the housing; a wiring substrate which receives the housing with the power semiconductor device and which has a first main surface and a second main surface. A heat dissipation region with increased thermal conductivity is arranged on the second main surface. The housing is arranged on the wiring substrate in such a way that the heat sink is connected to the heat dissipation region via a solder layer. A number of spacers which are arranged between the heat sink and the heat dissipation region are embedded in the solder layer. Furthermore, a method for producing a power semiconductor component is specified.