A compact solid state relay (7) is provided. Solid state devices (74, 75), such as Triacs or Thyristors are used to implement the relay functionality. The device is at least partially enclosed in a housing that has pins for mounting on an electronics board. A number of “U” shaped jumpers (72) or other jumpers or wires are provided in the housing to act as heat sinks. A sub-miniature fan (70) is positioned to create an air flow over the heat sinks and dissipate heat from the device.

A semiconductor storage device according to an embodiment includes a board, an electronic component, and a holder. The board has a first surface. The electronic component includes a component main body and a first lead. The component main body is at a position out of the board in a direction parallel to the first surface. The first lead protrudes from the component main body toward the board. The holder is on the board. The holder holds the first lead.

The invention relates to the field of techniques for manufacturing electronic devices having surface-mounted components, and can be used in avionics, telecommunication, lighting technology, and other fields, and can be configured as a power source, a converter, sensors, etc. The technical result consists in improved weight and dimension characteristics, improved heat dispersion, and increased electromagnetic screening. The present electronic module comprises a printed circuit board in the form of a three-dimensional structure, faces of which are formed by flat sections of the printed circuit board, and edges of which are formed by fold lines between the sections of the printed circuit board, wherein the mounting surface of the printed circuit board faces the inside of the three-dimensional structure, and electronic components and assemblies are grouped on the mounting surface of at least two sections of the printed circuit board such that the electronic components and assemblies of one section are disposed in the empty space between the components and assemblies of another section of the printed circuit board.

A backplane connector includes a housing, a number of terminal modules assembled to the housing, and a metal shield surrounding member. The housing includes a base, a first side wall and a second side wall. The base, the first side wall and the second side wall jointly form a receiving space for at least partially receiving a mating connector. The terminal module includes a first signal terminal, a second signal terminal and an insulating block fixed on the first signal terminal and the second signal terminal. The metal shield surrounding member at least partially surrounds the periphery of the first signal terminal and the second signal terminal. As a result, the shielding effect of the backplane connector is improved.

A backplane connector assembly includes a first backplane connector and a second backplane connector. The first backplane connector includes a number of first conductive terminals, a first insulating bracket, a first metal shield, a second metal shield and a shielding space. The second backplane connector includes a second terminal module. Each second terminal module includes mating terminals mated with the first conductive terminals and a shielding shell surrounding a periphery of the mating terminals. The shielding shell is received in the shielding space. As a result, the backplane connector assembly of the present disclosure reduces crosstalk and improves the quality of signal transmission.

A press-in machine for pressing electrical, electronic, mechanical and/or electromechanical components into a substrate, in particular into a printed circuit board or carrier plate, and method therefor, including a moving unit, which comprises a receptacle for a substrate and with which the substrate can be moved in a plane, which is spanned by an x-axis and a y-axis and can be placed in a press-in position in which one or more components are pressed into the substrate, a lower tool, which comes to rest against the underside of the substrate before or during the press-in, an upper tool, which can be moved against the component for pressing the component along the z axis toward the substrate, a control unit for controlling the moving unit, and a sensor for detecting at least one reference mark present on the substrate, wherein the control unit is configured and designed such that it controls the moving unit depending on the detected reference mark in such a way that the substrate is placed between the lower tool and the upper tool in the press-in position.

A backplane connector includes a number of conductive terminals, an insulating frame, a first metal shield and a second metal shield. Each conductive terminal includes a connection portion and a contact portion. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. The first metal shield has a first elastic arm and a second elastic arm. The second metal shield has a third elastic arm and a fourth elastic arm. The first elastic arm and the third elastic arm are in contact with two opposite side surfaces of the contact portion of the first ground terminal. The second elastic arm and the fourth elastic arm are in contact with two opposite side surfaces of the contact portion of the second ground terminal. This arrangement increases the grounding shielding area, reduces crosstalk, and improves the quality of signal transmission.

A functional element housing package includes a pin terminal disposed in an outer region of a housing for housing a functional element. A wiring substrate is connected with the pin terminal. The wiring substrate includes a through hole for receiving the pin terminal, a first metallic layer disposed around an opening of the through hole on a side of the wiring substrate which side is located close to the housing, a second metallic layer disposed around an opening of the through hole on a side of the wiring substrate which is opposed to the side located close to the housing, the second metallic layer being greater in area than the first metallic layer, a connection wiring line connected to the first metallic layer or the second metallic layer, and a solder which connects the pin terminal to each of the first metallic layer and the second metallic layer.

The disclosure relates to an implant comprising a housing, in which there are arranged an energy store and an electronics module, wherein a feedthrough to an electrode connection device is formed on the housing, wherein a first contact forms an electrical connection between the energy store and the electronics module, wherein a second contact forms an electrical connection between the electronics module and the feedthrough, and wherein the first contact and the second contact are oriented in the same contact direction. A method for assembling an implant is also disclosed.

A flexible electronic structure includes a flexible substrate comprising an electrically conductive top substrate layer and an opposing electrically conductive bottom substrate layer and a component. The component can include a component substrate non-native to the flexible substrate having a component substrate top side and an opposing component substrate bottom side, a planar component top electrode disposed on the component substrate top side and electrically connected to the electrically conductive top substrate layer thereby defining a planar electrical contact, and a planar component bottom electrode disposed on the component substrate bottom side and electrically connected to the electrically conductive bottom substrate layer thereby defining a planar electrical contact. The component can be disposed between the electrically conductive top substrate layer and the electrically conductive bottom substrate layer.