A display apparatus includes a display panel having a display region and a non-display region and including a plurality of panel pads disposed in the non-display region, a flexible circuit board including a plurality of connection pads overlapping the plurality of panel pads, and a bonding layer disposed between the display panel and the flexible circuit board and including a conductive polymer, wherein the bonding layer includes a plurality of conductive portions overlapping the plurality of panel pads and the plurality of connection pads and having a first conductivity value, and a plurality of non-conductive portions not overlapping the plurality of panel pads and the plurality of connection pads and having a second conductivity value smaller than the first conductivity value.

An example of a method of making a printed structure comprises providing a destination substrate, contact pads disposed on the destination substrate, and a layer of adhesive disposed on the destination substrate. A stamp with a component adhered to the stamp is provided. The component comprises a stamp side in contact with the stamp and a post side opposite the stamp side, a circuit, and connection posts extending from the post side. Each of the connection posts is electrically connected to the circuit. The component is pressed into contact with the adhesive layer to adhere the component to the destination substrate and to form a printed structure having a volume defined between the component and the destination substrate. The stamp is removed and the printed structure is processed to fill or reduce the volume.

An element array pressurizing device has a pressurizing plate having a pressurizing unit that pressurizes an element array comprising a plurality of elements disposed on a mounting substrate. The pressurizing unit has a plate-shaped hard material for which a surface precision is higher than that of a surface of the pressurizing plate.

A connection method for a chip and a circuit board includes: placing the circuit board on the chip, the circuit board having a first surface in contact with the chip having a plurality of contacts, and the circuit board having a plurality of through holes aligned with the plurality of contacts respectively; placing a mask on a second surface of the circuit board, the mask having a plurality of openings aligned with the plurality of through holes respectively; covering a surface of the mask with a conductive adhesive to fill the plurality of through holes with the conductive adhesive; and keeping portions of the conductive adhesive that are respectively in the plurality of through holes to be spaced apart from each other. The portions of the conductive adhesive that fill the plurality of through holes remain to provide an electrical connection between the circuit board and the chip.

Provided is a method for producing a joined body, the method including a first step of preparing a laminated body which includes a first member having a metal pillar provided on a surface thereof, a second member having an electrode pad provided on a surface thereof, and a joining material provided between the metal pillar and the electrode pad and containing metal particles and an organic compound, and a second step of heating the laminated body to sinter the joining material at a predetermined sintering temperature, in which the joining material satisfies the condition of the following Formula (I):
(M.sub.1−M.sub.2)/M.sub.1×100≥1.0  (I)
[in Formula (I), M.sub.1 represents a mass of the joining material when a temperature of the joining material reaches the sintering temperature in the second step, and M.sub.2 represents a non-volatile content in the joining material.]

Provided is a method for producing a joined body, the method including a first step of preparing a laminated body which includes a first member having a metal pillar provided on a surface thereof, a second member having an electrode pad provided on a surface thereof, and a joining material provided between the metal pillar and the electrode pad and containing metal particles and an organic compound, and a second step of heating the laminated body to sinter the joining material at a predetermined sintering temperature, in which the joining material satisfies the condition of the following Formula (I):
(M.sub.1−M.sub.2)/M.sub.1×100≥1.0  (I)
[in Formula (I), M.sub.1 represents a mass of the joining material when a temperature of the joining material reaches the sintering temperature in the second step, and M.sub.2 represents a non-volatile content in the joining material.]

An integrated circuit package may be formed having a heat transfer fluid chamber, wherein the heat transfer fluid chamber may be positioned to allow a heat transfer fluid to directly contact an integrated circuit device within the integrated circuit package. In one embodiment, a first surface of the integrated circuit device may be electrically attached to a first substrate. The first substrate may then may be electrically attached to a second substrate, such that the integrated circuit device is between the first substrate and the second substrate. The second substrate may include a cavity, wherein the heat transfer fluid chamber may be formed between a second surface of the integrated circuit device and the cavity of the second substrate. Thus, at least a portion of a second surface of the integrated circuit device is exposed to the heat transfer fluid which flows into the heat transfer fluid chamber.

An integrated circuit package may be formed having a heat transfer fluid chamber, wherein the heat transfer fluid chamber may be positioned to allow a heat transfer fluid to directly contact an integrated circuit device within the integrated circuit package. In one embodiment, a first surface of the integrated circuit device may be electrically attached to a first substrate. The first substrate may then may be electrically attached to a second substrate, such that the integrated circuit device is between the first substrate and the second substrate. The second substrate may include a cavity, wherein the heat transfer fluid chamber may be formed between a second surface of the integrated circuit device and the cavity of the second substrate. Thus, at least a portion of a second surface of the integrated circuit device is exposed to the heat transfer fluid which flows into the heat transfer fluid chamber.

A display apparatus includes a display panel having a display substrate on which a plurality of pad terminals is disposed, and a driving unit having a plurality of driving terminals electrically connected to the plurality of pad terminals. Each of the plurality of pad terminals includes a stepped groove that faces a corresponding driving terminal of the plurality of driving terminals or each of the plurality of pad terminals includes an opening hole that faces the corresponding driving terminal of the plurality of driving terminals.

A display apparatus includes a display panel having a display substrate on which a plurality of pad terminals is disposed, and a driving unit having a plurality of driving terminals electrically connected to the plurality of pad terminals. Each of the plurality of pad terminals includes a stepped groove that faces a corresponding driving terminal of the plurality of driving terminals or each of the plurality of pad terminals includes an opening hole that faces the corresponding driving terminal of the plurality of driving terminals.