An electrical connectors with electrodeposited terminals that are grown in place by electroplating cavities formed in a series of resist layers. The resist layers are subsequently stripped away. The resulting terminal shape is defined by the shape of the cavity created in the resist layers. Complex terminal shapes are possible. The present conductive terminals are particularly useful for electrical interconnects and semiconductor packaging substrates.

A communication system includes a circuit board assembly including a mating circuit board having a mating edge and a plurality of mating pads at the mating edge, the circuit board assembly having an electrical component electrically coupled to the mating circuit board. The communication system includes a cable receptacle connector removably coupled to the mating edge of the mating circuit board. The cable receptacle connector includes a connector housing having a connector cavity and a card slot. A cable extends from the connector housing. The cable receptacle connector includes signal contacts each having a mating end mated with the corresponding mating pads and a terminating end electrically connected to a cable conductor of the cable.

An anisotropic conductive film has a three-layer structure in which a first connection layer is sandwiched between a second connection layer and a third connection layer that each are formed mainly of an insulating resin. The first connection layer has a structure in which conductive particles are arranged in a single layer in the plane direction of an insulating resin layer on a side of the second connection layer, and the thickness of the insulating resin layer in central regions between adjacent ones of the conductive particles is smaller than that of the insulating resin layer in regions in proximity to the conductive particles.

The power conversion device includes: a main circuit having first and second wiring layers formed respectively on both surfaces of a base board, mounted parts mounted on the first and second wiring layers, and first and second GND layers formed respectively, between external- and internal-layer portions of the base board and in regions corresponding to the mounted parts each being a mounted part which forms a circuit other than a circuit having an inductance component as a lumped constant, and to the first and second wiring layers; and a cooler attached to the base board by means of fixing screws through a first through-hole created in an end portion of the board; wherein the first and second GND layers are each formed so that creepage distance is created around a second through-hole in which a lead insertion part that mutually connects the first and second wiring layers is inserted.

The power conversion device includes: a main circuit having first and second wiring layers formed respectively on both surfaces of a base board, mounted parts mounted on the first and second wiring layers, and first and second GND layers formed respectively, between external- and internal-layer portions of the base board and in regions corresponding to the mounted parts each being a mounted part which forms a circuit other than a circuit having an inductance component as a lumped constant, and to the first and second wiring layers; and a cooler attached to the base board by means of fixing screws through a first through-hole created in an end portion of the board; wherein the first and second GND layers are each formed so that creepage distance is created around a second through-hole in which a lead insertion part that mutually connects the first and second wiring layers is inserted.

Glucose monitoring devices and related systems and methods, the glucose monitoring devices including a sensor electronics unit having a housing and a printed circuit board disposed within the housing, a transcutaneous glucose sensor assembly, and a conductive sensor connector. The printed circuit board includes a first electrical contact, the transcutaneous glucose sensor assembly includes a distal portion having a working electrode and proximal portion having a working-electrode contact in electrical communication with the working electrode, and the conductive sensor connector electrically connects the working-electrode contact with the first electrical contact. Further, the conductive sensor connector extends through a hole in the proximal portion of the transcutaneous glucose sensor assembly and through a hole in the printed circuit board.

A multi head flexible printed circuit (FPC) ultraviolet laser drilling device and a using method thereof are provided, the device includes a body frame; a support frame connected to the body frame; a first movement assembly disposed on the body frame and configured to move along a Y-axis direction of the body frame; a second movement assembly disposed on the support frame and configured to move along an X-axis direction of the body frame; a third movement assembly disposed on the second movement assembly and configured to move along a Z-axis direction of the body frame; a suction assembly slidably connected to the first movement assembly and configured to fix one or more FPC boards; and a drilling assembly including drilling parts. The device can realize the simultaneous processing of FPC board by adopting two or more processing modes, thereby improving the processing efficiency.

A method for contacting and rewiring an electronic component embedded in a PCB in the following manner is disclosed. A first permanent resist layer is applied to one contact side of the PCB. The first permanent resist layer is structured to produce exposures in the area of contacts of the electronic component. A second permanent resist layer is applied onto the structured first permanent resist layer. The second permanent resist layer is structured to expose the exposures in the area of the contacts and to produce exposures in line with the desired conductor tracks. The exposures are chemically coated with copper the copper is electric-plated to the exposures. Excess copper in the areas between the exposures is removed.

A method for contacting and rewiring an electronic component embedded in a PCB in the following manner is disclosed. A first permanent resist layer is applied to one contact side of the PCB. The first permanent resist layer is structured to produce exposures in the area of contacts of the electronic component. A second permanent resist layer is applied onto the structured first permanent resist layer. The second permanent resist layer is structured to expose the exposures in the area of the contacts and to produce exposures in line with the desired conductor tracks. The exposures are chemically coated with copper the copper is electric-plated to the exposures. Excess copper in the areas between the exposures is removed.

A method of manufacturing component carriers is disclosed. The method includes providing a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, forming a first hole in a core of the stack and subsequently embedding a first component in the first hole, thereafter forming a second hole in the same core of the stack and subsequently embedding a second component in the second hole. A component carrier has a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A first hole is formed in a core of the stack. A first component is embedded in the first hole. A second hole is formed in the same core of the stack and subsequently a second component is embedded in the second hole.