A wiring circuit board includes two insulating layers, a wiring layer, a pad portion, and a conductive connection portion. The wiring layer is on one side in a thickness direction of the first insulating layer, and has a contact portion. The second insulating layer is on one side in the thickness direction of the first insulating layer to cover the wiring layer. The pad portion is on one side in the thickness direction of the second insulating layer. The second insulating layer has a through opening portion and having an opening along at least a part of a peripheral end portion of the pad portion. The contact portion of the wiring layer faces the through opening portion. The conductive connection portion, is connected to at least the peripheral end portion of the pad portion, and the contact portion, and electrically connects the wiring layer to the pad portion.

A wiring circuit board includes two insulating layers, a wiring layer, a pad portion, and a conductive connection portion. The wiring layer is on one side in a thickness direction of the first insulating layer, and has a contact portion. The second insulating layer is on one side in the thickness direction of the first insulating layer to cover the wiring layer. The pad portion is on one side in the thickness direction of the second insulating layer. The second insulating layer has a through opening portion and having an opening along at least a part of a peripheral end portion of the pad portion. The contact portion of the wiring layer faces the through opening portion. The conductive connection portion, is connected to at least the peripheral end portion of the pad portion, and the contact portion, and electrically connects the wiring layer to the pad portion.

A welding structure and a display module. The welding structure includes: an output carrier, arranged with a first welding area on a side edge of the output carrier; an input carrier. A first end of the input carrier is arranged with a second welding area, the second welding area being electrically connected to the first welding area; an orthographic projection of the first end of the input carrier on the output carrier is disposed beyond the first welding area; and at least one set of a first support member and a second support member. The first support member is disposed on the input carrier and at a position of the first end beyond the first welding area; the second support member is disposed on the output carrier and opposite to the first support member.

A circuit arrangement (1), in particular for an electrically driven motor vehicle, has at least one bus bar (5) which is connected electrically to a supplier (2) and which is connected to a first consumer (3) at a first transfer point (6) and to a second consumer (4) at a second transfer point (7). Both the first and the second transfer point (6, 7) are formed as flexible contact points.

A paddle card includes a printed circuit board and a twin-axial cable. The PCB includes a first signal pad on a top surface of the PCB and a second signal pad on a bottom surface of the PCB. The second signal pad is directly below the first signal pad. The twin-axial cable includes a first signal conductor coupled to the first signal pad and a second signal conductor coupled to the second signal pad.

According to one embodiment of the present disclosure, an antenna device, an apparatus for manufacturing the same, and a method for manufacturing the same are disclosed. The antenna device according to one embodiment of the present disclosure comprises an antenna substrate sheet and an antenna pattern. A connecting PCB is attached on the antenna substrate sheet. The antenna pattern starts from one of a plurality of connecting terminals of the connecting PCB and ends at another one of the plurality of connecting terminals. The antenna pattern comprises a plurality of wires which functions as one line and a bridge. The plurality of wires is embedded on the antenna substrate sheet. The bridge connects the connecting PCB and a point where winding of the plurality of wires on the antenna substrate sheet is completed.

A secondary battery pack comprises a battery and a protection circuit module (PCM), a pair of electrodes of the battery being connected to a protection circuit board (PCB) forming part of the PCM such that the electrode connections are located on a face of the PCB other than a major face that receives PCM components thereon. In some embodiments, the PCM components are mounted on one of a pair of major faces of the PCB, the electrode connections being located on the opposite one of the major faces. In other embodiments, the electrode connections are located on a peripheral edge face that extends transversely between the pair of major outer faces of the PCB. The spatial arrangement of the electrode connections and the PCM components on the PCB is such that substantially the entirety of one major outer face of the PCB is available for the placement of PCM components.

A secondary battery pack comprises a battery and a protection circuit module (PCM), a pair of electrodes of the battery being connected to a protection circuit board (PCB) forming part of the PCM such that the electrode connections are located on a face of the PCB other than a major face that receives PCM components thereon. In some embodiments, the PCM components are mounted on one of a pair of major faces of the PCB, the electrode connections being located on the opposite one of the major faces. In other embodiments, the electrode connections are located on a peripheral edge face that extends transversely between the pair of major outer faces of the PCB. The spatial arrangement of the electrode connections and the PCM components on the PCB is such that substantially the entirety of one major outer face of the PCB is available for the placement of PCM components.

In a method for manufacturing a circuit board according to an additive manufacturing shaping method, a circuit board manufacturing method and a circuit board manufacturing device that can reduce the influence of thermal stress on a circuit board by reducing the number of heating steps are provided. A circuit board manufacturing method according to the present disclosure includes a board shaping step of laminating and shaping a circuit board having a wiring on a peeling member adhered to a base member, an attachment step of attaching a metal paste contacting the wiring to the circuit board, an electronic component arrangement step of arranging an electronic component on the circuit board to arrange the electronic component and the wiring via the metal paste, and a heating press step of arranging a press member above the circuit board, and causing the peeling member to be easily released from the base member and curing the metal paste by collectively heating the peeling member and the metal paste while pressing the circuit board with the base member and the press member to correct warpage of the circuit board.

In a method for manufacturing a circuit board according to an additive manufacturing shaping method, a circuit board manufacturing method and a circuit board manufacturing device that can reduce the influence of thermal stress on a circuit board by reducing the number of heating steps are provided. A circuit board manufacturing method according to the present disclosure includes a board shaping step of laminating and shaping a circuit board having a wiring on a peeling member adhered to a base member, an attachment step of attaching a metal paste contacting the wiring to the circuit board, an electronic component arrangement step of arranging an electronic component on the circuit board to arrange the electronic component and the wiring via the metal paste, and a heating press step of arranging a press member above the circuit board, and causing the peeling member to be easily released from the base member and curing the metal paste by collectively heating the peeling member and the metal paste while pressing the circuit board with the base member and the press member to correct warpage of the circuit board.