A method and a system for stacking printed circuit boards includes providing a lower baseboard, a pinboard, and an upper baseboard; printing a first solder paste on the lower baseboard; placing a placement component on the lower baseboard; placing the pinboard on the lower baseboard; reflow soldering the lower baseboard with the placement component and the pinboard and forming a first assembly; printing the first solder paste and a second solder paste on the upper baseboard; placing the placement component on the upper baseboard and the first assembly on the upper baseboard; and reflow soldering the upper baseboard with the placement component and the first assembly and forming a printed circuit board; a melting point of the first solder paste is higher than a melting point of the second solder paste.

Disclosed is an electronic device including a camera module enabling a movable member (e.g., a circuit board) having an image sensor disposed thereon to move for an image stabilization function and including a connecting member that provides electrical connection of the image sensor, and an electronic device including the camera module.

An example of an apparatus may comprise a first set of compression contact pads formed on a first side of a circuit board, a second set of compression contact pads formed on a second side of the circuit board opposite to the first side of the circuit board, where the first set of compression contact pads are respectively electrically connected to the second set of compression pads. An example of the circuit board may include a memory board. An example stackable memory module may include memory devices mounted to both sides of the memory board. Other examples are disclosed and claimed.

System for enabling circuit board surface-slot-edge connections. A main board includes a slot through its surfaces. At least one edge of the slot includes electrical contacts to the main board. An auxiliary board includes a connector component mounted on a surface that opposes a surface of the main board. When the connector component is aligned with the slot, the connector component can protrude vertically through the slot, in addition to moving laterally towards an edge of the slot. Electrical contacts on the edge of the slot can engage with electrical contacts in the connector component. This enables two boards to be arranged closely, without extending the main surface in an orthogonal or lateral direction, using a secure connection provided by a connector attached to the auxiliary board, rather than the main board.

An endoscope device and a cable assembly thereof are provided. The cable assembly includes a first substrate, a second substrate, and a wire. The first substrate includes a first body and a first solder pad disposed on the first body. The second substrate is correspondingly disposed on the first substrate and includes a second body, a second solder pad disposed on the second body and corresponding to the first solder pad, and an accommodating portion corresponding to the second solder pad. The wire includes a soldering portion disposed in the accommodating portion. The first solder pad and the second solder pad are coupled to each other by at least one of a first solder and a second solder, and the soldering portion and the second solder pad are coupled to each other by the first solder.

A method and apparatus for conducting heat away from a semiconductor die are disclosed. A board assembly is disclosed that includes a circuit board, a semiconductor die electrically coupled to the circuit board and a Chemical Vapor Deposition Diamond (CVDD) coated wire. A portion of the CVDD-coated wire extends between a hot-spot on the semiconductor die and the circuit board. The board assembly includes a layer of thermally conductive paste that is disposed between the hot-spot on the semiconductor die and the circuit board. The layer of thermally conductive paste is in direct contact with a portion of the CVDD-coated wire.

An electronic device includes a component mounting portion, an electronic component disposed on the component mounting portion, a solder between the component mounting portion and the electronic component, a mounting base member, and a supporting beam connecting the component mounting portion and the mounting base member. The supporting beam has a plurality of bent portions. The supporting beam includes a frame, an outer supporting portion connecting the frame and the mounting base member, and an inner supporting portion connecting the frame and the component mounting portion. The inner supporting portion is shifted from the outer supporting portion along the frame. One of the plurality of bent portions is a connecting portion between the frame and the outer supporting portion. Another of the plurality of bent portions is a connecting portion between the frame and the inner supporting portion.

A display module is provided. The display module includes: a display panel, a light control panel, at least one first circuit board for the display panel, and at least one second circuit board for the light control panel. The display panel and the light control panel are stacked, the display panel is on a light-emitting side of the light control panel, a light-emitting surface of the display panel is on a first surface, and at least part of an orthographic projection of any one of the at least one first circuit board on the first surface does not overlap with an orthographic projection of the at least one second circuit board on the first surface in a direction perpendicular to the first surface.

An electronic textile system and a docking assembly for the electronic textile system. The system includes a textile substrate, an input device attached to the textile substrate, and a docking assembly attached to the textile substrate for removably receiving a controller device. The docking assembly includes a first electrical interface for mating with a second electrical interface of the controller device. The system includes an electrical conductive pathway network integrated in the textile substrate for electrically coupling the input device and the first electrical interface. The input device may transmit to the controller device electronic signals representing input data when the controller device is received by the docking assembly.

A method for connecting stacked circuit boards includes: a connecting structure is provided, the connecting structure is a bendable and flexible circuit board; a first circuit board and a plurality of supporting posts are provided, each of the supporting posts is dispersedly fixed to a side surface of the first circuit board; a second circuit board is provided, and two peripheral portions of the connecting structure are respectively fixed to the first circuit board and the second circuit board, the peripheral portions of the connecting structure are respectively near two opposite ends of the connecting structure; the connecting structure is bent to flip the second circuit board super-positioned above the first circuit board, and the second circuit board is connected to a free end of each of the supporting posts.