A floating electrical connector includes a housing with a tubular portion. An axis is defined in a center of the tubular portion. Several floating terminals are arranged around the axis and are partially connected. Each floating terminal has an inner terminal sheet on an inner side and a spring structure on an outer side. Each spring structure is connected to one of the inner terminal sheets. A portion of the inner terminal sheet is inserted into the tubular portion and arranged along an inner peripheral surface of the tubular portion. The portion of each inner terminal sheet located in the tubular portion has an electronic contact bulging inward. Several external pins are electrically connected around the floating terminals. When a conductive pin is inserted into the tubular portion, the spring structures could elastically deform, allowing the tubular portion to adapt to a horizontal deviation or a skew deviation of the conductive pin, providing a greater tolerance for alignment deviations.

A PCB structure and a method and apparatus for forming the PCB structure are disclosed. The PCB structure further includes a metal plate configured between a first PCB and a second PCB by soldering. Therefore, the PCB structure is easy to be produced and the feasibility can be improved with a cheap solution.

A connection structure including: a first circuit member having a plurality of first electrodes; a second circuit member having a plurality of second electrodes; and an intermediate layer having a plurality of bonding portions electrically connecting the first electrodes and the second electrodes, in which at least one of the first electrode and the second electrode that are connected by the bonding portion is a gold electrode, and 90% or more of the plurality of bonding portions include a first region containing a tin-gold alloy and connecting the first electrode and the second electrode and a second region containing bismuth and being in contact with the first region.

A camera module includes an imaging sensor, a light emitter, and a circuit board. The circuit board includes first and second rigid printed wiring boards. A surface of the first rigid printed wiring board on which the imaging sensor is mounted has a holder which is configured to hold the second rigid printed wiring board in a state in which a surface of the second rigid printed wiring board on which the light emitter is mounted and the surface on which the imaging sensor is mounted face the same direction. The holder is arranged at a position which is different from the imaging sensor, and holds the second rigid printed wiring board at a height higher than the surface of the first rigid printed wiring board.

An information handling system motherboard integrates components through integrated wirelines, including at least some components coupled to the motherboard on opposite sides of a narrow region, such as formed by an opening that accepts a cooling fan. A bridge circuit board couples to contacts of the motherboard on opposing sides of the narrow region so that wirelines integrated in the bridge circuit board interface motherboard wirelines, thus offering greater communication density across the narrow region.

A circuit board fastening system consists of a two-piece assembly including an electrically conductive circuit board retainer for surface mounting and a flexible clip for retaining a daughter-card to the retainer. The clip is preferably made of a flexible polymer so that a band portion in the middle of the clip can be comfortably folded 180 degrees at a u-shaped bend. During assembly, an arrow-shaped barb at one end of the clip is inserted into a retain bore thereby resiliently securing the daughter-card to a retainer flange upon which the card is seated. At the opposite end of the clip, a notched aperture in the clip is affixed around a groove in the retainer flange. The resilience of the barb provides a residual clamping effect to the daughter-card that is tightly sandwiched between a broad planar portion of the clip and a top surface of the retainer flange.

3D electrical integration is provided by connecting several component carriers to a single substrate using contacts at the edges of the component carriers making contact to a 2D contact array (e.g., a ball grid array or the like) on the substrate. The resulting integration of components on the component carriers is 3D, thereby providing much higher integration density than in 2D approaches.

A method for manufacturing a circuit board, includes obtaining a second laminated body by laminating, in this order, an uncured second insulating substrate and a resin film on a second surface opposite to a first surface of a cured first insulating substrate of a first laminated body, and performing thermocompression bonding thereon. The first laminated body includes the first insulating substrate and a metal layer that is formed into a pattern shape on the first surface of the first insulating substrate. A third laminated body is obtained by forming a hole that reaches the metal layer, in the resin film, the second insulating substrate, and the first insulating substrate, from a resin film side of the second laminated body, filling conductive paste into the hole, and then peeling off the resin film. Thermocompression bonding is performed by stacking one third laminated body and another third laminated body.

A power module includes a power source module and a metallic heat-dissipation substrate. The power source module has an input pin and an output pin soldered on and electrically connected with a system board and includes a printed circuit board. The printed circuit board has a first surface and a second surface. At least a heat-generating component is disposed on the second surface. The metallic heat-dissipation substrate has a first surface and a second surface opposite to each other. The first surface has at least a fixing position and at least a heat-dissipating position. The fixing position is directly or indirectly connected with the second surface. A gap accumulated by tolerances is existed between the heat-dissipating position and the heat-generating component. A gap-filling material is filled into the gap. The second surface and the system board are soldered with each other. Therefore, the heat-dissipation efficiency is enhanced.

An electronic device according to various embodiments of the disclosure may include: a housing which includes a first plate facing a first direction, a second plate facing a second direction opposite to the first direction, and a lateral member covering at least part of the space between the first and second plates; a display disposed to be visible in at least part of the first plate; a first circuit board which includes a first face facing the first direction and a second face facing the second direction, and which is disposed in the second direction of the display; a second circuit board which is disposed not to overlap at least in part with the first printed circuit board, and which is electrically coupled with the first circuit board; a socket mounted to the second circuit board; at least one or more metal structures disposed on the first circuit board to transfer, to another component, heat of at least one or more exothermic elements mounted on the first circuit board; and a ground path constructed in at least part of the second circuit board so as to be electrically coupled to the first circuit board or the metal member or the first circuit board and the metal structure.