A method of manufacturing a printed board, the method comprising: a first step of preparing a laminate having a base member in which a plurality of layers of glass cloths and a plurality of resin layers are alternately laminated, a first metal layer attached to one surface of the base member, and a second metal layer attached an opposite surface of the base member; a second step of forming a protective layer removable with a predetermined solvent on each of the first metal layer and the second metal layer; and a third step of irradiating the laminate on which the protective layer is formed with a laser beam to thereby form a through-hole penetrating in a thickness direction of the laminate.

A member for forming a wiring includes an adhesive layer and a metal foil layer. The adhesive layer is formed from an adhesive composition including electrically conductive particles. The metal foil layer is disposed on the adhesive layer. In this member for forming a wiring, a ratio of surface roughness Rz of a first surface of the metal foil layer on a side attached to the adhesive layer with respect to an average particle diameter of the electrically conductive particles is 0.05 to 3.

A microelectronic device includes a die less than 300 microns thick, and an interface tile. Die attach leads on the interface tile are electrically coupled to die terminals on the die through interface bonds. The microelectronic device includes an interposer between the die and the interface tile. Lateral perimeters of the die, the interposer, and the interface tile are aligned with each other. The microelectronic device may be formed by forming the interface bonds and an interposer layer, while the die is part of a wafer and the interface tile is part of an interface lamina. Kerfs are formed through the interface lamina, through the interposer, and partway through the wafer, around a lateral perimeter of the die. Material is subsequently removed at a back surface of the die to the kerfs, so that a thickness of the die is less than 300 microns.

There is provided a resin-coated copper foil including a resin layer having excellent dielectric characteristics suitable for high frequency applications, exhibiting high interlayer adhesion and heat resistance in the case where the resin layer is used in a copper-clad laminate or printed circuit board. The resin-coated copper foil of the present invention includes a copper foil and a resin layer on at least one side of the copper foil. The resin layer comprises a resin mixture containing an epoxy resin, a polyimide resin, and an aromatic polyamide resin; and an imidazole curing catalyst.

A resin composition includes 10 parts by weight of a first prepolymer and 5 parts by weight to 30 parts by weight of a vinyl group-containing polyphenylene ether resin, wherein the first prepolymer is prepared by subjecting a reaction mixture to a prepolymerization reaction, and the reaction mixture including a polyphenylmethane maleimide, a compound of Formula (1) and a compound of Formula (2) at a weight ratio of 100:10-30:15-45, and the resin composition is absent of a second prepolymer which is prepared by subjecting a maleimide and bis(trifluoromethyl)benzidine to a prepolymerization reaction. An article made from the resin composition may achieve improvement in at least one of the properties including ratio of electroless copper plating, storage modulus and copper foil peeling strength.

Objects of the present invention are to provide an electrically conductive adhesive which is capable of suppressing a rise in an electric resistance value of a joining part between an electronic component and a substrate under high temperature and high humidity while a specific resistance value is suppressed to be low; an electronic circuit using such electrically conductive adhesive; and a method for manufacturing such electronic circuit. According to the present invention, provided is the electrically conductive adhesive which includes an electrically conductive filler, a surface of the electrically conductive filler being a coating layer including silver, a compounded amount of the electrically conductive filler being 29.0 vol. % to 63.0 vol. % with respect to the electrically conductive adhesive, a compounded amount of the silver being 3.5 vol. % to 7.0 vol. % with respect to the electrically conductive adhesive. In addition, also provided are an electronic circuit using the electrically conductive adhesive of the present invention and a method for manufacturing such electronic circuit.

A method for applying an electrical conductor to an electrically insulating substrate, the method comprising providing a flexible membrane with a pattern of grooves formed on a first surface thereof, and loading the grooves with a composition comprising particles of a conductive material. The composition is, or may be made, electrically conductive. Once the membrane is loaded, the grooved first surface of the membrane is brought into contact with a front or/and back surface of the substrate. A pressure is then applied between the substrate and the membrane(s) so that the composition loaded into the grooves adheres to the substrate. The membrane(s) may remain on the electrically insulating substrate. The electrically conductive particles in the composition can then be sintered to form a pattern of electrical conductors on the substrate, the pattern corresponding to the pattern formed in the membrane(s).

The present disclosure relates to a fluororesin substrate laminate for a high-frequency circuit, the fluororesin substrate laminate including a fluororesin substrate and an adhesive layer provided on the fluororesin substrate, wherein the adhesive layer includes a resin composition containing: (A) a maleimide compound having a saturated or unsaturated divalent hydrocarbon group; and (B) an aromatic maleimide compound.

Provided is a method for producing a wiring circuit board capable of improving the dimensional accuracy of a second conductive layer. The wiring circuit board produced by the producing method includes a metal supporting layer, a first insulating layer disposed on one surface of the metal supporting layer in a thickness direction, a first conductive layer disposed on one surface of the first insulating layer in the thickness direction, a second insulating layer disposed on one surface of the first insulating layer in the thickness direction so as to cover the first conductive layer, and a second conductive layer disposed on one surface of the second insulating layer in the thickness direction. The producing method includes a step of forming the second insulating layer by bonding a film made of a photosensitive resin to one surfaces of the first insulating layer and the first conductive layer in the thickness direction.

An apparatus is disclosed for transferring a pattern of a composition containing particles of an electrically conductive material and a thermally activated adhesive from a surface of a flexible web to a surface of a substrate. The apparatus comprises: respective drive mechanisms for advancing the web and the substrate to a nip through which the web and the substrate pass at the same time and where a pressure roller acts to press the surfaces of the web and the substrate against one another, a heating station for heating at least one of the web and the substrate prior to, or during, passage through the nip, to a temperature at which the adhesive in the composition is activated, a cooling station for cooling the web after passage through the nip, and a separating device for peeling the web away from the substrate after passage through the cooling station, to leave the pattern of composition adhered to the surface of the substrate.