A method for producing a printed circuit board on a substrate uses control data derived from a circuit schematic, CAD file, Gerber file or files or equivalents, to operates a function head configured to effect printing conductive and non-conductive materials on the substrate and produces control data to effect the circuit printing. The method optionally uses a layout translation module configured to accept PCB multilayer circuit board files and convert multilayer circuit board layout data of the PCB multilayer circuit board files to printing data files for controlling the function head to print conductive material and nonconductive material onto the substrate to produce a printed circuit effecting functionality of the multilayer circuit board layout data.

A printed wiring board used to suppress parasitic component is provided. The printed wiring board 100 includes a multi-layer substrate 110, and a power line 50 laid on the multi-layer substrate 110 and connected with a power terminal row T11a-T11d of a semiconductor device 10. The power line 50 includes a first wiring pattern 51 formed on a surface of the multi-layer substrate 110, a second wiring pattern 52 formed within the multi-layer substrate 110, and interlayer connections 53x and 53y electrically conducting the first wiring pattern 51 and the second wiring pattern 52 to bypass at least a portion of the power terminal row T11a-T11d.

A stretchable structure comprises or is configured to receive a conductive path and an interface region. The interface region comprises a peripheral line comprising at least one inwardly curved portion, such as an inverted teardrop or a fjord like recess pointing essentially towards the center area of the interface region. The interface region is arranged to receive said stretchable conductive path via said inwardly curved portion of said peripheral line of said interface region. In this way the interface region minimizes strains or other twisting or stretching forces directed to the conductor entering into the opening of the inwardly curved portion of the interface region.

A method and apparatus for producing an electronic device are disclosed. An adhesive material is jetted in a first pattern on a surface of a receiver substrate. A carrier having a metal foil disposed thereon is brought into contact with the first substrate such that a portion of the metal foil contacts the adhesive material. The adhesive material is activated using at least one of mechanical pressure and heat while the portion of the metal foil is in contact with the adhesive material. The first substrate and the second substrate are separated, whereby the portion of the metal foil is transferred to the first substrate.

A method for producing a printed circuit board on a substrate uses control data derived from a circuit schematic, CAD file, Gerber file or files or equivalents, to operates a function head configured to effect printing conductive and non-conductive materials on the substrate and produces control data to effect the circuit printing. The method optionally uses a layout translation module configured to accept PCB multilayer circuit board files and convert multilayer circuit board layout data of the PCB multilayer circuit board files to printing data files for controlling the function head to print conductive material and nonconductive material onto the substrate to produce a printed circuit effecting functionality of the multilayer circuit board layout data.

A circuit wire crossing structure, comprising a substrate with a supporting surface, an electrical circuit disposed on the supporting surface of the substrate, with the electrical circuit comprising, two lateral wires with one of the wires having a first terminal and a second terminal and another one of the lateral wires having a second terminal, wherein the first terminal and the second terminal are spaced apart from each other, and a central wire, disposed between and apart from the first terminal and the second terminal, and an electronic component arranged above the supporting surface and two terminals of the electronic component connecting with the first terminal and the second terminal, wherein the electronic component has an insulating shell facing the central wire, and an orthographic projection of the electronic component to the supporting surface extends across an orthographic projection of the central wire to the supporting surface.

A wiring substrate includes signal input portions for inputting signals, a signal receiving portion that receives the signals input from the signal input portions, and a plurality of connection wires provides connections between the signal input portions and the signal receiving portion. The plurality of connection wires constitutes a connection wire group in which three connection wires are arranged overlapping one another with insulating layers being interposed therebetween, and the connection wire group is provided with a switching contact portion at which transmission paths of the signals respectively input to the connection wires are switched to the other connection wires.

An apparatus for producing a printed circuit board on a substrate, has a table for supporting the substrate, a function head configured to effect printing conductive and non-conductive materials on the substrate, a positioner configured to effect movement of the function head relative to the table, and a controller configured to operate the function head and the positioner to effect the printing of conductive and non-conductive materials on the substrate. The apparatus optionally has a layout translation module configured to accept PCB multilayer circuit board files and convert multilayer circuit board layout data of the PCB multilayer circuit board files to printing data files for controlling the function head to print conductive material and nonconductive material onto the substrate to produce a printed circuit effecting functionality of the multilayer circuit board layout data.

A method for producing a wired circuit board including an insulating layer and a conductive pattern, including (1), providing the insulating layer having an inclination face; (2), providing a metal thin film at least on the surface of the insulating layer; (3), providing a photoresist on the surface of the metal thin film; (4), disposing a photomask so that a first portion, where the conductive pattern is provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask; (5), removing the first portion to expose the metal thin film corresponding to the first portion; and (6), providing the conductive pattern on the surface of the metal thin film exposed from the photoresist. The inclination face has a second portion that allows the light reflected at the metal thin film to reach the first portion.

A wiring assembly includes a differential input port, a differential output port, and first and second pairs of electrical conductors. The differential input port is configured to receive a differential signal from a sensor at a first end of the wiring assembly. The differential output port is configured to output the differential signal at a second end of the wiring assembly. The first and second pairs of electrical conductors are laid out in a three-dimensional (3D) crossover configuration relative to one another and configured to conduct the differential signal from the first end to the second end, and to cancel pickup of a magnetic field by the wiring assembly. The electrical conductors of each pair are connected to one another at the first end and at the second end.