A vehicle-mounted antenna device includes a base, a board, a circuit section, and a housing. The base is mountable on a roof of a vehicle. The board has an antenna element section and is stood on the base. The circuit section is implemented on the board and serves as at least part of a wireless communication circuit electrically connected to the antenna element section. The housing is made of a resin material and forms a projection of an outer shape of the vehicle. The board and the circuit section are located in space formed by the base and the housing. A heat transfer path having a thermal conductivity higher than that of air is formed between the circuit section and the housing without passing the base.

A tamper-proof structure and an electronic device are provided in the present application. The tamper-proof structure includes a first-order circuit board, at least one tamper-proof component, at least one safety signal wire and a security chip. The safety signal wire is wrapped around an outer layer of the first-order circuit board or penetrates through a through hole and is wrapped around an inner layer of the first-order circuit board to form a tamper-proof area as required. The safety signal wire is connected to a tamper-proof switch and the security chip correspondingly, and a level of the safety signal wire is changed when the tamper-proof switch or the safety signal wire is damaged, and the security chip is triggered to erase sensitive information accordingly. By punching on the first-order circuit board, an objective of tamper-proof and an objective of reduction of design cost and simplification of security solution are achieved simultaneously.

The electronic control device includes: a housing; a first plate disposed in the housing; a second plate disposed in the housing and having an inner surface facing the inner surface of the first plate; a first control module disposed in the housing; and a second control module disposed in the housing, wherein the first control module includes: a first printed circuit board having an inner surface coupled to one side of the first plate and one side of the second plate; a first power supply substrate disposed on an outer surface of the second plate; and a first EMI filter disposed between the first plate and the second plate, an inner surface of which is opposite to an inner surface of the first printed circuit board, and wherein the second control module includes: a second printed circuit board having an inner surface coupled to the other side surface of the first plate and the other side surface of the second plate; a second power supply substrate disposed on an outer surface of the first plate; and a second EMI filter disposed between the first plate and the second plate, an inner surface thereof faces an inner surface of the second printed circuit board.

A modular printed circuit board assembly is provided. The modular printed circuit board assembly includes a housing unit. The housing unit includes a plurality of connectors, a heat transfer unit, and an identification unit. The plurality of connectors connects a host interface board of a plurality of host interface boards with a plurality of module boards and connects a module board of the plurality of module boards with the plurality of host interface boards. The host interface board includes information about an electronic device. The heat transfer unit dissipates the heat to a heat sink. The heat sink is a passive heat exchanger for conducting the heat generated by the electronic device. The identification unit is configured to read the unique identification of the electronic device from the host interface board to determine a structural combination of the electronic device.

A circuit substrate includes a base material, a first electrode, and a second electrode. The base material has an upper side and a lower side opposite to each other in a length direction. The first electrode extends and is configured on the base material along the length direction. The second electrode is configured beside the first electrode and includes a first portion and a second portion connected to each other. The first portion is configured on the base material along the length direction. The second portion is configured on the base material along a width direction and is located between the upper side and the first electrode. A cross-sectional width of the first portion becomes larger from the lower side to the upper side.

An electronic device is provided. The electronic device includes a flexible circuit structure, a package structure, and a flexible encapsulation layer. The package structure is supported by the flexible circuit structure and includes a first stress-dissipating part at a periphery region of the package structure. The flexible encapsulation layer encapsulates the package structure.

An electronics assembly used in a vehicle included a printed circuit board (PCB) having a first side and a second side; a plurality of electrical components mounted on the first side of the PCB; a heat sink, configured to receive cooling fluid from a source, positioned adjacent to the second side of the PCB; and a cooling fluid conduit, configured to communicate the cooling fluid from a fluid inlet to a fluid outlet, wherein the cooling fluid conduit is positioned adjacent to the first side of the PCB and directly contacts an outer surface of the electrical components.

An electronic assembly includes a first electronic component, a second electronic component, and a primary circuit board. The first electronic component is provided with a first secondary circuit board, the second electronic component is provided with a second secondary circuit board, the first secondary circuit board is electrically connected to the primary circuit board by using a first electrical connector, interlayer space is formed between the first secondary circuit board and the primary circuit board, a portion of the second secondary circuit board that enters the interlayer space overlaps the first secondary circuit board and is electrically connected to the primary circuit board by using a second electrical connector, the first electrical connector is located between the first secondary circuit board and the primary circuit board, and the second electrical connector is located between the second secondary circuit board and the primary circuit board.

Disclosed are a connector assembly and a vehicle electronic control unit including the same. The connector assembly and the vehicle electronic control unit including the same according to the present disclosure may include a housing, a printed circuit board (PCB) provided inside the housing, a terminal electrically connected to the PCB and formed of a first material such that at least a portion of the terminal is exposed to an outside of the housing, and a sacrificial member of which at least a portion is adjacent to the terminal and exposed to the outside of the housing, wherein the sacrificial member may be formed of a second material having higher reactivity than the first material.

A printed circuit board assembly for an aircraft solid state power controller (SSPC). The assembly includes t least one printed circuit board having a top side and a bottom side. At least one of the top side and the bottom side has a surface layer made from an electrically conductive material and has a plurality of heat generating electronic circuit components mounted thereon. An insulating potting covers the plurality of heat generating electronic circuit components on the at least one of the top side and the bottom side, the insulating potting comprising an insulating potting body covering the plurality of heat generating electronic circuit components in a contiguous manner. The printed circuit board is configured to form a male part of a card edge connector in at least one peripheral region thereof.