This electronic device includes a metallic casing that accommodates a component and a circuit board in respective spaces separated by a partition wall, and a metallic cover for protecting the circuit board by covering the casing. The cover has a protruding portion protruding toward the accommodating space for accommodating the circuit board, and the casing has a receiving portion to which the protruding portion is fitted at a position corresponding to the protruding portion. The cover has a deformation suppressing portion formed so that a bending rigidity with respect to a bending which is bent with a forming position of the protruding portion as a fulcrum and is directed to a protruding direction of the protruding portion as a fulcrum is greater than a bending rigidity in planar structure in a facing surface opposed to the circuit board.

A job-site gear in one aspect of the present disclosure includes a circuit board, at least one electronic component, and a resin member. A first surface of the circuit board includes a first area, a second area, and a third area. The third area is located in a boundary between the first area and the second area. A second surface of the circuit board includes a fourth area, a fifth area, and a sixth area located behind the first area, the second area, and the third area, respectively. The third area and the sixth area include at least one slit penetrating through the circuit board. The resin member is integrally molded so as to (i) penetrate through the at least one slit and (ii) cover the first area, the fourth area, and a part of the at least one electronic component on the first area.

A resin molded body includes a connector unit having a side wall and an inner wall, both of which define a fitting chamber to which a mating connector is fitted and having a terminal penetrating through the inner wall and extending in a fitting direction, a substrate accommodating unit accommodating a circuit substrate to which the terminal is connected, and a device accommodating unit accommodating a device connected to the circuit substrate. The resin molded body is an integral molded product made of resin. A connecting portion has a plate shape extending outwards from the inner wall of the connector unit, and a second thickness thinner than a first thickness of the inner wall. The connecting portion is linked to the device accommodating unit.

A board unit includes a case accommodating a circuit board. A power terminal connects a lead-out part of a bus bar with a connection terminal of an electric wire. A cover covers the power terminal and has a lateral wall overlapping a peripheral wall part. The lateral surface of the peripheral wall part and the lateral wall includes an engagement protrusion and an engagement recess to be engaged with the engagement protrusion. The lateral wall of the cover includes a latch piece at a position offset from the engagement protrusion or the engagement recess in a longitudinal direction and a latch portion to be latched with the latch piece which restricts displacement of the lateral wall of the cover in a direction away from the lateral surface of the peripheral wall part of the case.

An outer case in an electronic circuit unit is injection molded by setting the circuit board in a die and injection molding of the outer case by filling molten resin into a cavity in the die, in pressing at least a part of a front surface side of the mold exclusion part facing a non-cavity space by press member toward a rear surface side.

A shock resistant fuselage system includes first and second fuselage side walls, each of the first and second fuselage side walls having a plurality of guide posts, and a printed circuit board (PCB) rigidly attached to at least one of the first and second fuselage side walls, the PCB having a plurality of guide slots, each of the plurality of guide posts slideably seated in a respective one of the plurality of guide slots so that elastic deformation of the PCB is guided by the guide slots between the first and second fuselage side walls.

The present disclosure relates to a proximity sensor for detecting the proximity of an object, the sensor including a sensing element (11), a detection circuitry (65), and a housing (5), the sensing element (11) being arranged in a front portion (21) of the housing (5) such that it is adapted to interact with the object through the front portion (21) and the detection circuitry being interconnected with the sensing element (11) in order to receive a detection signal from the sensing element (11), wherein the detection circuitry (65) is provided on a circuit board (15, 15A, 15B, 15C) extending at least through a middle portion (22) of the housing (5). To allow a better flexibility of the sensor along its length expansion, it is proposed that the housing (5) includes multiple segments (41, 42, 43, 44) that are consecutively arranged in a longitudinal direction (27) from a rear end (56) toward a front end (55) of the housing (5), wherein neighboring segments of said segments (41, 42, 43, 44) are linked to each other via a respective pivot axis (35, 39, 40) extending transversely with respect to said longitudinal direction (27), such that the housing (5) is bendable around each of said pivot axes (35, 39, 40), wherein both of said front portion (21) and said middle portion (22) each includes at least one of said segments (41, 42, 43, 44), and wherein the circuit board (15, 15A, 15B, 15C) includes at least one bendable section (61, 75, 76, 77, 85, 86) extending transversely with respect to said longitudinal direction (27), said bendable section (61, 75, 76, 77, 85, 86) being provided inside said neighboring segments (41, 42, 43, 44).

The present disclosure relates to a microelectronic package, which includes a base substrate, a perimeter wall, an electronic component, and a mold compound. The perimeter wall extends from a periphery of the base substrate to form a cavity that is over the base substrate and within the perimeter wall. The electronic component is mounted on the base substrate and exposed to the cavity. The electronic component is thermally coupled to a thermal management component, which extends through the base substrate and conducts heat generated from the electronic component. The electronic component is also electrically coupled to a wall signal via, which extends through the perimeter wall and transmits signals. The mold compound resides over the base substrate and within the cavity, so as to encapsulate the electronic component.

In some examples, an electronic device includes an outer housing, support structures for electronic components of the electronic device, and a seal that extends along a circumference on an inner surface of the outer housing, the seal engaged to the inner surface of the outer housing and engaged to the support structures for the electronic components. The seal is deflectable by the support structures upon engagement of the seal with the support structures when the support structures are received in an inner chamber defined by the outer housing, and the seal is arranged to enhance sealing engagement with the support structures responsive to pressure applied by a liquid that has penetrated a portion of the outer housing.

An electronic device chassis is manufactured with a multi-step molding process. The process includes at least two separate injection molding steps. During the first step, an electronic component is placed in a first mold, and a first material is injected into the first mold to create a first chassis that surrounds part of the electronic component. In the second step, the first chassis is placed in a second mold, and a second material is injected into the second mold to create a second chassis that surrounds part of the first chassis. The second step can be performed at a higher pressure than the first step, which can produce a smoother exterior surface. Furthermore, the first chassis shields the electronic component from the higher pressure of the second step, which reduces the likelihood of damage to the electronic component.