A method of forming a camera module for a vehicular vision system includes providing a circuit board and providing a lens holder for holding a lens assembly. A lens holder and circuit board construction is placed in a first mold and datumed in the first mold by a portion of the lens holder. An inner molded construction is formed by molding an inner molding over the circuit board and a portion of the lens holder. The inner molded construction is placed in a second mold and datumed in the second mold by the portion of the lens holder. An outer molded construction is formed by molding an outer molding over the inner molding and over another portion of the lens holder. The outer molded construction may include a connector portion that is configured to connect to a connector end of a vehicular wire harness.

Pressure-isolating bulkhead structures with integrated selective electronic switches circuitry are provided. The pressure-isolating bulkhead structure may be a single unit having the integrated electronic switch circuitry, as well as an electrical connector that includes at least one of a wire and a pin contact. Such integrated selective electronic switch circuitry may be fashioned within a self-contained, inner pressure-isolating enclosure body. Such inner pressure-isolating enclosure body may be produced about the selective electronic switch circuitry such that the inner pressure-isolating enclosure body and switch circuitry are produced as a unit, which can be easily placed within a variety of bulkhead structures, and subsequently within a perforating gun.

A control unit is provided, in particular a transmission control unit, which is designed to be attached to an outer side or to an inner side of a housing, in particular to a transmission housing, wherein the control unit comprises a circuit board as well as at least one plug which is arranged on the circuit board and whose pins are connected to corresponding conducting paths of the circuit board, which is arranged in such a way that it reaches into an opening within the housing and to produce an electrical and/or signal connection between the outer side and the inner side of the housing via conducting paths that are arranged on the circuit board, wherein an overmolding is enclosing at least the circuit board and the plug(s).

An object is to provide the structure of an ECU enabling resin to be filled without deformation of an electronic circuit board. A resin-sealed vehicle-mounted control device includes: a circuit board; a base member housing the circuit board; and resin filled between the circuit board and the base member. The base member has: a base portion fixing the circuit board; and a side wall opposed to the side surface side of the circuit board. The resin is provided at least between the circuit board and the base portion. The side wall has an opening at any position on the side of the base portion from a position opposed to the side surface side of the electronic circuit board.

An over-molded printed circuit board may be used in a battery pack. The over-molded printed circuit board can include a printed circuit board having electronic components, such as battery management circuitry, disposed thereon. A flex connector can be attached to the printed circuit board. An over-mold can formed about the printed circuit board, for example, by injection molding an epoxy resin, polyamide, or other suitable material. The over-mold may facilitate routing of the flex connector at a desired angle from the battery back and may also have a geometry that provides a supporting mechanical interface between the cells of the battery pack and the printed circuit board. Battery packs so constructed may be installed in electronic devices, such as mobile telephones, smart phones, tablet computers, laptop computers, media players, etc.

Described herein is a system and method for securing a printed circuit board without the use of screws in a housing assembly comprising a bottom housing made of plastic and a top housing made of metal. The top housing comprises a plurality of ribs. The bottom housing comprises a plurality of flexible snap arms each having a head portion, which includes an angled lower face, a horizontal crush rib, and a vertical crush rib. Upon coupling of the assembly, the ribs exert a horizontal force on the flexible snap arms resulting in climbing of the angled lower face further onto the printed circuit board. The horizontal force may also crush the horizontal crush ribs allowing for increased flexibility between the components to adjust for interference, preventing potential damage to the printed circuit board. Vertical forces may also crush the vertical crush ribs allowing for increased flexibility between the components.

A shock resistant fuselage system includes first and second fuselage side walls, each of the first and second fuselage side walls having a plurality of guide posts, and a printed circuit board (PCB) rigidly attached to at least one of the first and second fuselage side walls, the PCB having a plurality of guide slots, each of the plurality of guide posts slideably seated in a respective one of the plurality of guide slots so that elastic deformation of the PCB is guided by the guide slots between the first and second fuselage side walls.

An electronic device including: an electronic circuit accommodated in a circuit housing having a first thermal expansion coefficient, and a molded body which surrounds the circuit housing, the body having a second thermal expansion coefficient that differs from the first thermal expansion coefficient. The molded body is fixed to the circuit housing at least at two different mutually spaced fixing points on the circuit housing.

A proximity sensor for detecting the proximity of an object, including a sensing element, a detection circuitry provided on a circuit board, and a housing with a rear portion adjoining a rear end of the housing and a front portion adjoining a front end of the housing, the sensing element being arranged inside the front portion of the housing to interact with the object through the front portion, the detection circuitry being interconnected with the sensing element to receive a detection signal from the sensing element, the housing including side walls extending in a longitudinal direction from the rear end to the front end of the housing, the side walls surrounding the circuit board. To allow a better flexibility of the sensor along its length expansion, the circuit board includes at least one bendable section extending in a transverse direction with respect to the longitudinal direction and that the side walls substantially consist of at least one flexible material in a region surrounding the bendable section of the circuit board such that the sensor is bendable through the transverse direction.

The present disclosure relates to a proximity sensor for detecting the proximity of an object, the sensor including a sensing element (11), a detection circuitry (65), and a housing (5), the sensing element (11) being arranged in a front portion (21) of the housing (5) such that it is adapted to interact with the object through the front portion (21) and the detection circuitry being interconnected with the sensing element (11) in order to receive a detection signal from the sensing element (11), wherein the detection circuitry (65) is provided on a circuit board (15, 15A, 15B, 15C) extending at least through a middle portion (22) of the housing (5).

To allow a better flexibility of the sensor along its length expansion, it is proposed that the housing (5) includes multiple segments (41, 42, 43, 44) that are consecutively arranged in a longitudinal direction (27) from a rear end (56) toward a front end (55) of the housing (5), wherein neighboring segments of said segments (41, 42, 43, 44) are linked to each other via a respective pivot axis (35, 39, 40) extending transversely with respect to said longitudinal direction (27), such that the housing (5) is bendable around each of said pivot axes (35, 39, 40), wherein both of said front portion (21) and said middle portion (22) each includes at least one of said segments (41, 42, 43, 44), and wherein the circuit board (15, 15A, 15B, 15C) includes at least one bendable section (61, 75, 76, 77, 85, 86) extending transversely with respect to said longitudinal direction (27), said bendable section (61, 75, 76, 77, 85, 86) being provided inside said neighboring segments (41, 42, 43, 44).