Pressure-isolating bulkhead structures with integrated selective electronic switches circuitry are provided. The pressure-isolating bulkhead structure may be a single unit having the integrated electronic switch circuitry, as well as an electrical connector that includes at least one of a wire and a pin contact. Such integrated selective electronic switch circuitry may be fashioned within a self-contained, inner pressure-isolating enclosure body. Such inner pressure-isolating enclosure body may be produced about the selective electronic switch circuitry such that the inner pressure-isolating enclosure body and switch circuitry are produced as a unit, which can be easily placed within a variety of bulkhead structures, and subsequently within a perforating gun.

A vehicular camera module includes a circuit element and a lens mounting element disposed at the circuit element and optically aligned with an imager of the circuit element. An inner lower pressure polymer molding is formed at least partially over and around the circuit element and the lens mounting element so that the inner molding and the lens mounting element substantially encase the circuit element. A connector element is disposed at an aperture of the inner molding so as to be in electrical contact with the electrical connecting elements of the circuit element. An outer higher pressure injection molded shell is molded over and around the inner molding and part of the lens mounting element so as to encase the inner molding. The outer shell includes a connector portion that generally surrounds the connector element, with the connector element being accessible at the connector portion of the outer shell.

An electronic device includes a housing and a water tight display disposed within the housing. The display may include a light guide and a gasket coupled to at least a portion of the light guide. A cavity may be interposed between the gasket and the light guide. A flexible printed circuit assembly (FPCA) may couple to the light guide and the gasket to seal an opening of the cavity. Light sources may be connected to the flexible printed circuit assembly and disposed within the cavity. Adhesive tape may couple to the light guide and the gasket on a side opposite the FPCA to seal an opening of the cavity. Collectively, the light guide, the gasket, the flexible printed circuit assembly, and the adhesive tape may prevent water from reaching the cavity.

A controller (1) includes a primary molded portion (11) in which a resin molded body (10) is integrated with a bus bar (100) using a resin, causing one end of the bus bar (100) to function as a connector terminal which protrudes into connector portions (13) to (15), and configured to form electronic component disposition portions (16a) to (16d) in which an electronic component (40) is disposed and a power device disposition portion (17) in which a power device (50) is disposed, and a secondary molded portion (21) integrated with the electronic component (40), the power device (50), and the primary molded portion (11) in a state in which the electronic component (40) is disposed at the electronic component disposition portions (16a) to (16d) and the power device (50) is disposed at the power device disposition portion (17).

Pressure-isolating bulkhead structures with integrated selective electronic switches circuitry are provided. The pressure-isolating bulkhead structure may be a single unit having the integrated electronic switch circuitry, as well as an electrical connector that includes at least one of a wire and a pin contact. Such integrated selective electronic switch circuitry may be fashioned within a self-contained, inner pressure-isolating enclosure body. Such inner pressure-isolating enclosure body may be produced about the selective electronic switch circuitry such that the inner pressure-isolating enclosure body and switch circuitry are produced as a unit, which can be easily placed within a variety of bulkhead structures, and subsequently within a perforating gun.

Providing an electronic control device excellent in reliability with low cost. An electronic control device includes: an electronic component; a control substrate on which the electronic component is mounted; a sealing resin for sealing the control substrate; and a metal housing case at least a portion of which is sealed with the sealing resin; a terminal for electrically connecting the control substrate with an external device; and a fixing plate for positioning and fixing the terminal with respect to the housing case. After the terminal is fixed to the housing case by the fixing plate, the terminal is electrically connected to the control substrate and subsequently a portion of the terminal and the control substrate are sealed with the sealing resin.

A vehicular camera includes a printed circuit board (PCB) having an imager disposed thereat. A lens barrel accommodates a lens and includes a first end and a second end and an annular flange between the first end and the second end. A front camera housing includes a first portion having a first material having a first coefficient of thermal expansion (CTE) and a second portion having a second material having a second CTE, with the first CTE being higher than the second CTE. A rear camera housing and the second portion of the front camera housing are joined to encase the PCB within a cavity formed by joining the front camera housing and the rear camera housing.

Provided is an inexpensive and highly reliable resin sealed-type onboard electronic control device is mounted in a vehicle such as an engine control unit and a control unit for automatic transmission, which have a heat dissipation structure for dissipating heat generated from an electronic component such as a semiconductor element. The onboard control device includes a circuit board, a member provided to face the circuit board, a heat generating electronic component mounted between the circuit board and the member, a heat dissipating material provided between the heat generating electronic component and the member, and a sealing resin to seal the circuit board and the heat generating electronic component. And a space between the member and the circuit board is at least a part of a range where the heat dissipating material is not provided, and is narrower than a range where the heat dissipating material is provided.

The present disclosure provides a production process of a flexible printed circuit encapsulation structure, includes: a FPC overmolding step: processing the FPC board body and the FPC molding tape into an integrated structure to make the FPC board body and the FPC molding tape fit closely each other; a support body assembly step: assembling two connector assemblies on two ends of the elastic support body respectively; a main body assembly step: assembling a combination obtained by the FPC overmolding step and a combination obtained by the support body assembly step; and a soft rubber overmolding step: performing overmolding on an exterior of an overall structure obtained by assembling the FPC plate body, the FPC molding tape, the elastic support body and the two connector assemblies to form the soft rubber jacket. The present disclosure can meet the requirements of larger deformation amplitude, and high deformation frequency.

A molded assembly, a camera module, a jointed board of molded assembly, and a manufacturing method are provided. The molded assembly includes a circuit board and a molded portion, wherein the circuit board has a molding region, a mounting region and at least two pad regions, the molding region surrounds the mounting region, the pad regions are arranged at corners of the circuit board and located outside corresponding corners of the molding region so as to electrically connect to an actuator, and the pad region has an avoidance boundary, and an angle formed by the avoidance boundary is greater than 90 degrees; wherein the molded portion embeds the molding region, surrounds the mounting region, and has a light window, and the molded portion avoids the pad regions along the avoidance boundary so as to reduce defective rate during production.