A circuit module may include a circuit board and an overmold. The circuit board may have a first surface from which an electronic component extends and a second surface opposite the first surface. The circuit board may be characterized by a width across the circuit board. The circuit board may include a tie-bar residual extending from a sidewall of the circuit board beyond the width across the circuit board. The overmold may at least partially encapsulate the first surface of the circuit board and the second surface of the circuit board. The overmold may extend laterally beyond the width of the circuit board along a length of the circuit board. The overmold may define a region about the tie-bar residual characterized by a first recessed height with respect to the first surface and a second recessed height with respect to the second surface. The overmold may define a notch within the region recessed from an outer edge of the overmold.

An electronic device includes a substrate and a plastic layer. The substrate has a first surface and a second surface opposite to each other; at least one of the first surface and the second surface is provided with an electronic assembly and a conducting wire; the conducting wire is electrically connected to the electronic assembly; the substrate further has a plurality of perforated holes; and the perforated holes extend to the second surface from the first surface. The plastic layer covers the first surface and the second surface, and fills in the perforated holes. Therefore, the electronic assemblies and the conducting wires can be arranged on both surfaces of the substrate, and the electronic assemblies on the first surface and the second surface both are protected by the plastic layer. In addition, also provided is a method to produce the electronic device.

In one embodiment a device may include an electrical assembly having at least one electrical component; an inner shell comprising a first polymeric material conformally disposed around the electrical component, the inner shell comprising a first mechanical strength; and an outer shell comprising a second polymeric material conformally disposed around the inner shell, the outer shell comprising a second mechanical strength greater than the first mechanical strength, wherein the electrical component comprises a first coefficient of thermal expansion (CTE), the inner shell comprises a second CTE, and the outer shell comprises a third CTE, and wherein a difference between the first CTE and second CTE is less than a difference between the first CTE and third CTE.

A resin molded body includes a connector unit having a side wall and an inner wall, both of which define a fitting chamber to which a mating connector is fitted and having a terminal penetrating through the inner wall and extending in a fitting direction, a substrate accommodating unit accommodating a circuit substrate to which the terminal is connected, and a device accommodating unit accommodating a device connected to the circuit substrate. The resin molded body is an integral molded product made of resin. A connecting portion has a plate shape extending outwards from the inner wall of the connector unit, and a second thickness thinner than a first thickness of the inner wall. The connecting portion is linked to the device accommodating unit.

Described herein is a system and method for securing a printed circuit board without the use of screws in a housing assembly comprising a bottom housing made of plastic and a top housing made of metal. The top housing comprises a plurality of ribs. The bottom housing comprises a plurality of flexible snap arms each having a head portion, which includes an angled lower face, a horizontal crush rib, and a vertical crush rib. Upon coupling of the assembly, the ribs exert a horizontal force on the flexible snap arms resulting in climbing of the angled lower face further onto the printed circuit board. The horizontal force may also crush the horizontal crush ribs allowing for increased flexibility between the components to adjust for interference, preventing potential damage to the printed circuit board. Vertical forces may also crush the vertical crush ribs allowing for increased flexibility between the components.

A vehicular camera assembly includes a first portion, a second portion and a lens barrel accommodating a lens. The lens barrel has a first end and a second end. The first portion of the vehicular camera assembly is formed of plastic and the second portion is formed of metal. The first portion of the vehicular camera assembly receives the first end of the lens barrel, and the lens barrel is bonded at the first portion of the vehicular camera assembly via adhesive. The first portion of the vehicular camera assembly has a first coefficient of thermal expansion (CTE), and the second portion of the vehicular camera assembly has a second CTE. The first CTE is higher than the second CTE. The adhesive has a third CTE that is higher than the second CTE.

A control device for a motor vehicle is provided. The control device includes a printed circuit board having a first side and an edge. The first side of the printed circuit board is delimited by the edge. The control device includes at least one electronic component arranged on the first side of the printed circuit board and electrically conductively connected to the printed circuit board). The control device also includes a first conductor loop formed as a resistor and arranged on the first side of the printed circuit board. The first conductor loop is arranged between the edge and the electronic component. The control device also includes an encapsulation of the printed circuit board. The encapsulation surrounds at least the first side, the at least one electronic component and the first conductor loop.

The invention discloses a substrate storage apparatus having a detecting device detachably connecting to an outer pod. The detecting device includes a sensing member having a sensing terminal, a cavity and a sensor. The sensing terminal detachably connects to the outer pod such that the sensing terminal exposes in an accommodating space inside of the outer pod. The cavity receiving the sensor extends to an outside of the outer pod and the accommodating space. The cavity communicates with the accommodating space through the sensing terminal, allowing the sensor to read information regarding the accommodating space.

A sensor for outputting an electrical signal on the basis of a detected physical variable, including: a measuring circuit accommodated in a circuit housing and capable of contacting an external circuit by an electric signal connection; and a protective body consisting of a protective compound with an opening, the compound surrounding the circuit housing and the opening exposing part of the circuit housing. The surface of the circuit housing has a moulded element which is surrounded by the protective compound.

A circuit board mounting arrangement is provided including a circuit board and a press fit mounting bushing including a cylindrical inner piece and an outer piece secured to the inner piece. The outer piece has a plurality of radially projecting, deformable elements and the circuit board has a cylindrical opening having a diameter less than an outer diameter of the radially projecting deformable elements. The deformable elements deform when the mounting bushing is pushed into the cylindrical opening of the circuit board so as to hold the mounting bushing to the circuit board. The circuit board and press fit bushing are then overmolded.