A connector device that includes: a circuit board; a connector attached to the circuit board; and a molded resin that covers the entire circuit board and part of the connector, wherein: a housing of the connector is made of a liquid crystal polymer or a poly phenylene sulfide resin, and the molded resin is made of a polyamide resin or a polyester resin whose melting point or softening point is 230 C. or less.

A connector-equipped case that includes a case that includes a through hole; and a connector fixed to the case, the connector including: a core that supports a plurality of terminals; and a hood that is formed by forming a region around the through hole of the case and a portion of the core in one piece, wherein a constituent material of the hood is a resin composition containing polybutylene terephthalate and polyethylene terephthalate.

The invention relates to an electronic unit (100, 100) comprising at least one printed circuit board (10, 10, 20) which is populated with a plurality of electric and/or electronic components (50, 50.1, 50.2) on one side or on both sides and which is incorporated into at least one protective housing (90) made of a solidified potting compound (80). In the process, the electronic unit overall forms a volume body (200) in which the solidified potting compound takes up a filling volume (70). In order to minimize the filling volume, the electronic unit additionally comprises a separate insert molding part (60) which is arranged at least adjacently to a populated side of the at least one printed circuit board and which takes up a spatially closed displacement volume in the volume body with respect to a flowable potting compound for forming the protective housing in a solidified state (80).

A proximity sensor for detecting the proximity of an object, including a sensing element, a detection circuitry provided on a circuit board, and a housing with a rear portion adjoining a rear end of the housing and a front portion adjoining a front end of the housing, the sensing element being arranged inside the front portion of the housing to interact with the object through the front portion, the detection circuitry being interconnected with the sensing element to receive a detection signal from the sensing element, the housing including side walls extending in a longitudinal direction from the rear end to the front end of the housing, the side walls surrounding the circuit board. To allow a better flexibility of the sensor along its length expansion, the circuit board includes at least one bendable section extending in a transverse direction with respect to the longitudinal direction and that the side walls substantially consist of at least one flexible material in a region surrounding the bendable section of the circuit board such that the sensor is bendable through the transverse direction.

Encapsulated conformal electronic devices, encapsulated conformal integrated circuit (IC) systems, and methods of making and using encapsulated conformal electronic devices are presented herein. A conformal IC device is disclosed which includes a flexible substrate, electronic circuitry attached to the flexible substrate, and a flexible multi-part encapsulation housing encasing therein the electronic circuitry and flexible substrate. The multi-part housing includes first and second encapsulation housing components. The first encapsulation housing component has recessed regions for seating therein the electronic circuitry, while the second encapsulation housing component has recessed regions for seating therein the flexible substrate. First encapsulation housing component optionally includes a recessed region for seating therein the flexible substrate. Either housing component may include one or more projections that pass through holes in the substrate to engage complementary depressions in the other housing component to thereby align and interlock the encapsulation housing components with the flexible substrate and electronic circuitry.

The present invention relates to a sun visor (1) for a vehicle (100). The sun visor comprises a light source (6, 7) for providing illumination within the vehicle, and a printed electronic circuit (4) located within the sun visor for controlling operation of the light source. The sun visor may include a light dispersion device (10) for dispersing light emitted by the light source, which may include a body portion (11) extending over the printed electronic circuit and a light emission portion (12) extending around the body portion and arranged to transmit light from the light source to the outside of the sun visor.

An electronic device is provided. The electronic device includes a housing including a first plate, a second plate facing in a direction opposite to that of the first plate, and a side member enclosing a space between the first plate and the second plate and formed with a method of solidifying a resin including a predetermined amount of rigidity reinforcing material injected into an injection mold and including a plurality of side surfaces, and a gate mark receiving portion formed in each of the plurality of side surfaces of the side member and configured to receive at least one gate mark according to separation of the injection mold. The gate mark receiving portion is formed by a processing portion disposed at a corresponding position inside a cavity of the injection mold.

An object is to provide the structure of an ECU enabling resin to be filled without deformation of an electronic circuit board. A resin-sealed vehicle-mounted control device includes: a circuit board; a base member housing the circuit board; and resin filled between the circuit board and the base member. The base member has: a base portion fixing the circuit board; and a side wall opposed to the side surface side of the circuit board. The resin is provided at least between the circuit board and the base portion. The side wall has an opening at any position on the side of the base portion from a position opposed to the side surface side of the electronic circuit board.

A method of forming a vehicular camera module includes providing an imager circuit board, a connector circuit board and a lens holder for holding a lens assembly. A lens holder and imager circuit board and connector circuit board construction is placed in a first mold and datumed in the first mold by a portion of the lens holder. An inner molded construction is formed by molding an inner molding over the circuit boards and a portion of the lens holder. The inner molded construction is placed in a second mold and datumed in the second mold by the portion of the lens holder. An outer molded construction is formed by molding an outer molding over the inner molding and over another portion of the lens holder. The outer molded construction may include a connector portion that is configured to connect to a connector end of a vehicular wire harness.

A shock resistant fuselage system includes first and second fuselage side walls, each of the first and second fuselage side walls having a plurality of guide posts, and a printed circuit board (PCB) rigidly attached to at least one of the first and second fuselage side walls, the PCB having a plurality of guide slots, each of the plurality of guide posts slideably seated in a respective one of the plurality of guide slots so that elastic deformation of the PCB is guided by the guide slots between the first and second fuselage side walls.