A board unit includes a case accommodating a circuit board. A power terminal connects a lead-out part of a bus bar with a connection terminal of an electric wire. A cover covers the power terminal and has a lateral wall overlapping a peripheral wall part. The lateral surface of the peripheral wall part and the lateral wall includes an engagement protrusion and an engagement recess to be engaged with the engagement protrusion. The lateral wall of the cover includes a latch piece at a position offset from the engagement protrusion or the engagement recess in a longitudinal direction and a latch portion to be latched with the latch piece which restricts displacement of the lateral wall of the cover in a direction away from the lateral surface of the peripheral wall part of the case.

A control unit (10) for an apparatus (12), the control unit (10) comprising a component-carrying member (14; 114; 18; 118) provided with at least one electronic component (30, 32, 34, 36, 38; 60, 62; 74, 78) configured to provide a function of the apparatus (12); wherein the component-carrying member is formed of a material that is pliable at least during assembly of the control unit (10). The control unit is provided with an injection moulded layer (22; 22) encapsulating at least a part of the or each electronic component (30, 32, 34, 36, 38; 60, 62; 74, 78).

A digital amplifier integrated circuit (IC), which is a heat-generating electronic component, is mounted on an upper surface of an insulating substrate. The digital amplifier IC is disposed inside a recess of a heat sink. The heat sink includes a peripheral wall having an end face placed on the upper surface of the insulating substrate. A hot-melt resin layer, molded by hot-melt molding, covers the upper surface of the insulating substrate. The hot-melt resin layer is in contact with a side face of the peripheral wall and retains the heat sink on the insulating substrate. The recess of the heat sink has no hot-melt resin therein.

Providing an electronic control device excellent in reliability with low cost. An electronic control device includes: an electronic component; a control substrate on which the electronic component is mounted; a sealing resin for sealing the control substrate; and a metal housing case at least a portion of which is sealed with the sealing resin; a terminal for electrically connecting the control substrate with an external device; and a fixing plate for positioning and fixing the terminal with respect to the housing case. After the terminal is fixed to the housing case by the fixing plate, the terminal is electrically connected to the control substrate and subsequently a portion of the terminal and the control substrate are sealed with the sealing resin.

Embodiments herein are directed an assembly. The assembly includes a circuit board, a plurality of terminal pins, a first material layer, and a second material layer. The circuit board includes a plurality of electrical components. The plurality of terminal pins extend from the circuit board. The first material layer encases a portion of the circuit board and the plurality of electrical components. The second material layer encloses the first material layer and the circuit board. The second material layer defines a connector interface portion that includes a plurality of latch members extending therefrom. A material of the second material layer different from a material of the first material layer.

A control unit having a connection structure for connecting components of the control unit to a base plate which eliminates the need for separate fasteners. The control unit includes circuitry mounted to a PCB, and the PCB is pre-assembled to a base plate, to form a pre-assembly. During assembly, the PCB and the base plate are aligned when placed in a tooling device which clamps and holds the pre-assembly in place during the over molding process. The circuitry is over molded with an epoxy material, such that the epoxy material flows from a top side of the PCB to underneath the base plate, and the PCB is fixed to the base plate without the use of fasteners such as screws, or adhesive materials.

A method of forming a vehicular camera module includes providing an imager circuit board, a connector circuit board and a lens holder for holding a lens assembly. A lens holder and imager circuit board and connector circuit board construction is placed in a first mold and datumed in the first mold by a portion of the lens holder. An inner molded construction is formed by molding an inner molding over the circuit boards and a portion of the lens holder. The inner molded construction is placed in a second mold and datumed in the second mold by the portion of the lens holder. An outer molded construction is formed by molding an outer molding over the inner molding and over another portion of the lens holder. The outer molded construction may include a connector portion that is configured to connect to a connector end of a vehicular wire harness.

Encapsulated conformal electronic devices, encapsulated conformal integrated circuit (IC) systems, and methods of making and using encapsulated conformal electronic devices are presented herein. A conformal IC device is disclosed which includes a flexible substrate, electronic circuitry attached to the flexible substrate, and a flexible multi-part encapsulation housing encasing therein the electronic circuitry and flexible substrate. The multi-part housing includes first and second encapsulation housing components. The first encapsulation housing component has recessed regions for seating therein the electronic circuitry, while the second encapsulation housing component has recessed regions for seating therein the flexible substrate. First encapsulation housing component optionally includes a recessed region for seating therein the flexible substrate. Either housing component may include one or more projections that pass through holes in the substrate to engage complementary depressions in the other housing component to thereby align and interlock the encapsulation housing components with the flexible substrate and electronic circuitry.

An electronic device includes a housing and a water tight display disposed within the housing. The display may include a light guide and a gasket coupled to at least a portion of the light guide. A cavity may be interposed between the gasket and the light guide. A flexible printed circuit assembly (FPCA) may couple to the light guide and the gasket to seal an opening of the cavity. Light sources may be connected to the flexible printed circuit assembly and disposed within the cavity. Adhesive tape may couple to the light guide and the gasket on a side opposite the FPCA to seal an opening of the cavity. Collectively, the light guide, the gasket, the flexible printed circuit assembly, and the adhesive tape may prevent water from reaching the cavity.

Reliability is to be improved. A control board 2 on which an electronic component 1 is mounted and an enclosure 3 in which the control board 2 is sealed with sealing resin 5 are included, wherein the enclosure 3 has a shape in which a volume of resin on one surface side of the control board 2 is larger than a volume of resin on the other surface side, a gate mark 21a is formed in the enclosure 3, a length of the gate mark 21a in a thickness direction of the control board 2 is larger than a thickness of the control board 2, the control board 2 is located such that a side surface partially overlaps a projection region of the gate mark 21a, and the control board 2 is arranged toward the other surface side relative to a center of the gate mark 21a.