An electrical assembly includes a printed circuit board substrate, at least one electrical component which is arranged on the printed circuit board substrate and with which the printed circuit board substrate makes electrical contact, a protective cap which is arranged above the electrical component, and a sheathing material which is applied to the printed circuit board substrate over the protective cap and which covers at least the protective cap on the outside in such a way that the protective cap is provided with at least one filling opening. The sheathing material is introduced through the at least one filling opening into a cap interior between the protective cap and the printed circuit board substrate in such a way that a clearance, which is not filled with the sheathing material and which directly adjoins the at least one electrical component, remains between the protective cap and the printed circuit board substrate.

This electronic device includes a metallic casing that accommodates a component and a circuit board in respective spaces separated by a partition wall, and a metallic cover for protecting the circuit board by covering the casing. The cover has a protruding portion protruding toward the accommodating space for accommodating the circuit board, and the casing has a receiving portion to which the protruding portion is fitted at a position corresponding to the protruding portion. The cover has a deformation suppressing portion formed so that a bending rigidity with respect to a bending which is bent with a forming position of the protruding portion as a fulcrum and is directed to a protruding direction of the protruding portion as a fulcrum is greater than a bending rigidity in planar structure in a facing surface opposed to the circuit board.

Provided is an inexpensive and highly reliable resin sealed-type onboard electronic control device is mounted in a vehicle such as an engine control unit and a control unit for automatic transmission, which have a heat dissipation structure for dissipating heat generated from an electronic component such as a semiconductor element. The onboard control device includes a circuit board, a member provided to face the circuit board, a heat generating electronic component mounted between the circuit board and the member, a heat dissipating material provided between the heat generating electronic component and the member, and a sealing resin to seal the circuit board and the heat generating electronic component. And a space between the member and the circuit board is at least a part of a range where the heat dissipating material is not provided, and is narrower than a range where the heat dissipating material is provided.

The present disclosure relates to a microelectronic package, which includes a base substrate, a perimeter wall, an electronic component, and a mold compound. The perimeter wall extends from a periphery of the base substrate to form a cavity that is over the base substrate and within the perimeter wall. The electronic component is mounted on the base substrate and exposed to the cavity. The electronic component is thermally coupled to a thermal management component, which extends through the base substrate and conducts heat generated from the electronic component. The electronic component is also electrically coupled to a wall signal via, which extends through the perimeter wall and transmits signals. The mold compound resides over the base substrate and within the cavity, so as to encapsulate the electronic component.

An electronic medical device is disclosed here. An exemplary embodiment of the medical device includes a printed circuit board assembly, a protective inner shell surrounding at least a portion of the printed circuit board assembly, and an outer shell surrounding at least a portion of the protective inner shell. The printed circuit board assembly has a printed circuit board, electronic components mounted to the printed circuit board, a battery mounted to the printed circuit board, and an interface compatible with a physiological characteristic sensor component. The protective inner shell is formed by overmolding the printed circuit board assembly with a first material having low pressure and low temperature molding properties. The outer shell is formed by overmolding the protective inner shell with a second material that is different than the first material.

The present invention relates to a sun visor (1) for a vehicle (100). The sun visor comprises a light source (6, 7) for providing illumination within the vehicle, and a printed electronic circuit (4) located within the sun visor for controlling operation of the light source. The sun visor may include a light dispersion device (10) for dispersing light emitted by the light source, which may include a body portion (11) extending over the printed electronic circuit and a light emission portion (12) extending around the body portion and arranged to transmit light from the light source to the outside of the sun visor.

A method of forming a camera module for a vehicular vision system includes providing a circuit board and providing a lens holder for holding a lens assembly. A lens holder and circuit board construction is placed in a first mold and datumed in the first mold by a portion of the lens holder. An inner molded construction is formed by molding an inner molding over the circuit board and a portion of the lens holder. The inner molded construction is placed in a second mold and datumed in the second mold by the portion of the lens holder. An outer molded construction is formed by molding an outer molding over the inner molding and over another portion of the lens holder. The outer molded construction may include a connector portion that is configured to connect to a connector end of a vehicular wire harness.

In one embodiment a device may include an electrical assembly having at least one electrical component; an inner shell comprising a first polymeric material conformally disposed around the electrical component, the inner shell comprising a first mechanical strength; and an outer shell comprising a second polymeric material conformally disposed around the inner shell, the outer shell comprising a second mechanical strength greater than the first mechanical strength, wherein the electrical component comprises a first coefficient of thermal expansion (CTE), the inner shell comprises a second CTE, and the outer shell comprises a third CTE, and wherein a difference between the first CTE and second CTE is less than a difference between the first CTE and third CTE.

A control unit (10) for an apparatus, the control unit (10) comprising: a component-carrying member (18) provided with at least one electronic component (29) configured to provide a function of the apparatus; wherein the component-carrying member is formed of a material that is pliable at least during assembly of the control unit (10); and a laminate encapsulation layer (22) encapsulating at least a part of the or each electronic component (29). Optionally, the control unit comprises a second member (14) which defines a user-interaction surface (16).

Described herein is a system and method for securing a printed circuit board without the use of screws in a housing assembly comprising a bottom housing made of plastic and a top housing made of metal. The top housing comprises a plurality of ribs. The bottom housing comprises a plurality of flexible snap arms each having a head portion, which includes an angled lower face, a horizontal crush rib, and a vertical crush rib. Upon coupling of the assembly, the ribs exert a horizontal force on the flexible snap arms resulting in climbing of the angled lower face further onto the printed circuit board. The horizontal force may also crush the horizontal crush ribs allowing for increased flexibility between the components to adjust for interference, preventing potential damage to the printed circuit board. Vertical forces may also crush the vertical crush ribs allowing for increased flexibility between the components.