The invention relates to a system for arranging electronic control units (ECUs) in a chassis of a vehicle. The system comprises a set of ECUs arranged on corresponding circuit boards that in turn are arranged in corresponding casing members Each casing member comprises a frame structure extending circumferentially in a plane substantially parallel to its corresponding layer. Each circuit board extends in a plane substantially parallel to its corresponding layer and is arranged inside the frame structure of the corresponding casing member. First and second end plates are arranged at opposite end portions of the layered structure. The first end plate is adapted to be connected directly or indirectly to the chassis of the vehicle, and at least one connection member extending extends along the layered structure between the opposite end portions thereof. The at least one connection member is configured to be connected to the first and second end plates so as to hold the layered structure together.

An energy module is disclosed. The energy module includes a control circuit and a two wire interface coupled to the control circuit. The two wire interface is configured as a power source and as a communication interface between the energy module and a neutral electrode.

An engine control system includes an integrated engine control module assembly having an engine control module and an adapter module. The integrated engine control module assembly further includes a first connector, a second connector, and a hermetic enclosure. The first connector includes a connection circuit configured to connect the integrated engine control module assembly to engine hardware. The second connector is configured to connect the adapter module to engine hardware. The hermetic enclosure houses the engine control module and is configured to protect the engine control module from environmental conditions.

Pressure-isolating bulkhead structures with integrated selective electronic switches circuitry are provided. The pressure-isolating bulkhead structure may be a single unit having the integrated electronic switch circuitry, as well as an electrical connector that includes at least one of a wire and a pin contact. Such integrated selective electronic switch circuitry may be fashioned within a self-contained, inner pressure-isolating enclosure body. Such inner pressure-isolating enclosure body may be produced about the selective electronic switch circuitry such that the inner pressure-isolating enclosure body and switch circuitry are produced as a unit, which can be easily placed within a variety of bulkhead structures, and subsequently within a perforating gun.

An electronic device with storage functionality is provided. The electronic device includes a first housing member, a first circuit board, a second housing member and a second circuit board. The first circuit board is connected to the first housing member. The second circuit board is coupled to the first circuit board and is parallel to the first circuit board. The first housing member includes two hooks, and the hooks are wedged against the first edge of the second circuit board.

A substrate case can be used in common with different types of substrates, and thus reduces production costs. A substrate case is tubular and has a bottom that includes an open portion into which a first substrate and a second substrate that has a different size can be selectively inserted. Guide portions are configured to guide movement of the first substrate and the second substrate in an insertion direction when the first substrate and the second substrate are selectively inserted through the open portion. A first restricting portion is configured to restrict movement of the first substrate when the first substrate has been guided by the guide portion and inserted to a regular position; and a second restricting portion that is configured to restrict movement of the second substrate when the second substrate has been guided by the guide portion and inserted to the regular position.

An inverter unit includes an inverter and an inverter housing. The inverter drives an electric motor and includes at least one power module and a printed circuit board. The power module converts a High Voltage (HV) Direct Current (DC) to a three-phase Alternating Current (AC) that drives the electric motor. The power module includes lead frames to be received in apertures formed on the PCB. The PCB configured with electronic components mounted thereon controls the electric motor. The inverter housing includes a front head and a cover. The cover in conjunction with the front head defines an enclosure for receiving the inverter. The inverter unit includes support elements to support the power module in a hanging configuration with respect to the PCB.

Systems and methods for providing an electronics module including a raceway for mounting submodules and establishing electrical communication with said submodules. The raceway comprises a base structure and a conductive trace formed by a conductive plating process. Connection pads on the raceway are configured to receive connection nodes of the submodules for providing a continuous electrical connection between the raceway and the submodules for electrical communication and power transmission.

An electronic control unit (ECU) with separable cooling and memory modules is described. The cooling module has an integrated liquid-cooling circuit with a direct connection to the cooling circuit. The memory module includes an independent memory that can store data and be tested independent of the cooling module. The cooling module and the memory module contact at thermal-contact surfaces to enable cooling when installed in a vehicle. In this way, the cooling module may provide cooling through the thermal-contact surface to one or more memory modules and the memory module may be implemented without an internal cooling system.

A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector.