A multi-layer circuit board comprising a carrier plate with an upper surface and a lower surface, and at least one electrically conductive upper inner layer located on the upper surface of the carrier plate and an electrically insulating upper intermediate layer located thereon, and an electrically conductive upper outer layer located thereon, forming the outermost layer of the upper surface. At least one electrically conductive lower inner layer is located on the lower surface of the carrier plate and an electrically insulating lower intermediate layer located thereon, and an electrically conductive lower outer layer located thereon, forming the outermost layer of the lower surface. The upper and/or lower outer layers are populated with components, and conductor paths in one of the inner layers are oriented in different directions from conductor paths in the other inner layer, and the region between the conductor paths is flooded with a voltage.

The disclosure relates to an electronic unit with a circuit board having at least one component arranged on a main surface of the circuit board and a casing element, which incorporates the at least one component, as well as with an ESD protection arrangement for the circuit board. According to the disclosure, open areas on the circuit board, which are not covered by the casing element, are covered with a gold layer directly mounted on a copper surface of the circuit board.

A vehicle control apparatus is disposed inside a housing for accommodating a transmission. The vehicle control apparatus includes a metal base, a resin case, a printed circuit board on which an electronic component mounts, an oil-tight seal member, and a breathable filter. The metal base is made of metal. The resin case is attached to the metal base to form an interior space. The resin case includes a part having a connector penetrating inside and outside of the housing. The printed circuit board is disposed in the interior space. The oil-tight seal member is placed between the metal base and the resin case to surround the printed circuit board. The connector has a ventilation hole. The breathable filter is disposed at a location where the ventilation hole faces outside.

A vehicle control apparatus is disposed inside a housing for accommodating a transmission. The vehicle control apparatus includes a metal base, a resin case, a printed circuit board on which an electronic component mounts, and an oil-tight seal member. The metal base is made of metal. The resin case is attached to the metal base to form an interior space. The printed circuit board is disposed in the interior space. The oil-tight seal member is disposed between the metal base and the resin case to surround the printed circuit board. The electronic component is included in a control circuit for the transmission. The metal base and the oil-tight seal member are at a hydrogen bonding state, and the rein case and the oil-tight seal member are at a covalent bonding state.

An electronic configuration, which is preferably a gearbox control device, has a control circuit and a sensor dome. The sensor dome has a sensor and dome contacts electrically connected to the sensor. The control circuit has circuit contacts for contacting the dome contacts. The dome contacts and the circuit contacts are configured to achieve a respective plug connection between a respective dome contact and a respective circuit contact.

A method for producing an electric component, including at least one component assembly, wherein the component assembly includes a mounting support and at least one electrically conductive metal wire. In order to form the component assembly the at least one electrically conductive metal wire is mounted on and/or in the mounting support, and the at least one component assembly is covered at least in sections with plastic, in particular is injection moulded at least in sections, in a plastic casting method, in particular in a plastic injection-moulding method. The invention further relates to an electric component.

A method for producing an electronic assembly includes providing a printed circuit board with a first face, a second face facing away from the first face, and a first component arranged on the first face. The method further includes arranging the circuit board such that the second face lies on a reference surface, and applying a sealing material which is substantially not flowable prior to being cured onto the first face. The sealing material surrounds a sub-region of the first face of the circuit board. The method further includes arranging a second component at least partly on the reference surface such that the second component is pressed into the sealing material, electrically connecting the second component to the circuit board via an electric connection line, and applying a covering material onto the circuit board first face sub-region surrounded by the sealing material and onto the first component.

A method may include coating an electronic module in a tool, where the electronic module has a first sub-module and a second sub-module, where the tool has a first tool part and a second tool part, where the tool has a cavity at least partially formed between the first tool part and the second tool part, and where the first sub-module and the second sub-module are supported on the tool and held in the cavity at a spatially defined distance relative to one another in a contactless manner during the coating process. A tool for performing such method may include a first tool part and a second tool part that form a cavity, where the first tool part has a first molding surface section and at least one first supporting section that extends over the first molding surface section and the second tool part has a second molding surface section and at least one second supporting section that extends over the second molding surface section.

An electronic module has a first circuit board element, a second circuit board element, and a spacer. Together, the first circuit board element, the second circuit board element, and the spacer enclose a central cavity, in which components attached to the first circuit board element are accommodated. Respective annular circumferential microstructures are provided on a surface of the first circuit board element directed outward and on a surface of the second circuit board element directed outward, adjacent to an outer periphery of the first circuit board element. In this region, a sealing ring is formed, which has a form-closed connection to both the first and the second circuit board element by means of the microstructures of the first and the second circuit board element. The sealing ring can be made of a resistant plastic, which is molded on by injection molding in the liquid state in the region of the outer periphery of the first circuit board element and flows into recesses of the microstructures and, after the curing, forms the form-closed and sealing connection between the two circuit board elements and the sealing ring thereby formed.

An electronic module, more particularly a control module or sensor module for a motor vehicle transmission, has a circuit board having a first side and a second side facing away from the first side, electronic components arranged on the first side, and a casting compound arranged on the first side. The casting compound covers the electronic components. The circuit board has a through-hole connecting the first side to the second side. A sensor element covering the through-hole is arranged on the first side of the circuit board.