H05K5/0095

Punctual stimulation device
09821153 · 2017-11-21 ·

The invention relates to a device for the punctual stimulation of endings, located in the region of the ears, of nerves leading to brain stem nuclei, and device (1) having a battery-powered therapeutic current generator (3), which is arranged in a housing (2) to be worn in the ear region and is provided with an electronic circuit that forms a low-frequency therapeutic current, and said device also having at least one flexible line (5) proceeding from the therapeutic current generator (3) for connecting to an electrode to be positioned at a nerve ending and having a base electrode (7), which is likewise connected to the therapeutic current generator and by means of which the therapeutic circuit leading across the former electrode is closed, wherein the device (1), at least by means of an external part of said device (1), can be adapted to the shape of the body point of patient intended for the positioning of the device due to a mechanically pliable structure.

Control Unit Device For A Motor Vehicle And Method For Manufacturing Such A Device

A control unit device for a motor vehicle includes a circuit board, on which a plurality of electronic components are disposed. The electronic components are electrically coupled to one another by conductor tracks on the circuit board. A substantially gas-impermeable cover is materially joined or bonded to the circuit board in such a way that the cover, together with the circuit board, forms a closed cavity in which the electronic components and the associated conductor tracks are located. A method for producing the control unit device is also provided.

OPTICAL DEVICE PACKAGE AND OPTICAL SWITCH
20170276704 · 2017-09-28 · ·

The present invention makes it possible to inhibit decrease in optical performance due to a foreign object, while securing a space necessary for wire bonding. A cover (3) is configured such that a distance (z2) between an optical device (1) and a sub-cover member (32) becomes greater than a distance (z1) between the optical device (1) and a cover glass (31).

Feedthrough terminal assembly with an electrically conductive pad conductively connected to a terminal pin

A feedthrough terminal assembly for active implantable medical devices includes an electrically conductive pad for a convenient attachment of wires from either the circuitry inside the implantable medical device or wires external to the device. The electrically conductive pad enables direct thermal or ultrasonic bonding of a circuit board or lead wire to the terminal pin.

Film coatings as electrically conductive pathways
11426091 · 2022-08-30 · ·

This disclosure describes a portable electronic device that includes a first housing component having an exterior-facing surface and an interior-facing surface; and a second housing component cooperating with the first housing component to define an interior volume. A seal fills an interface between the first and second housing components. Electrically conductive material that forms an electrically conductive pathway extends across portions of the interior and exterior-facing surfaces of the first housing component. The electrically conductive pathway is configured to transmit and/or receive signals or power between an exterior and interior of the portable electronic device.

Ground Electrical Path From An MLCC Filter Capacitor On An AIMD Circuit Board To The Ferrule Of A Hermetic Feedthrough

An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the chip capacitor. There is a ground path electrically extending between the ground end metallization of the chip capacitor and the ferrule. The ground path comprises at least a first electrical connection material connected directly to the first gold braze, and at least an internal ground plate disposed within the circuit board substrate with the internal ground plate being electrically connected to both the first electrical connection material and the ground end metallization of the chip capacitor. An active path electrically extends between the active end metallization of the chip capacitor and the lead wire.

DEVICE AND FORMING METHOD OF DEVICE

A device comprises a first sealing member basically comprising a first film formed of a film, a second sealing member, a first circuit member comprising a first contact point and a second circuit member comprising a second contact point. The device is formed with a closed space which is enclosed by the first sealing member and the second sealing member and is shut off from an outer space outside the device. The first circuit member and the second circuit member are shut in the closed space. At least one of the first sealing member and the second sealing member is provided with an uneven portion. The uneven portion is in contact with at least one of the first circuit member and the second circuit member and covers a predetermined region which corresponds to at least one of the first contact point and the second contact point.

Reliable Miniature Implantable Connector With High Channel Density And Methods Of Using The Same
20210351544 · 2021-11-11 ·

Embodiments are provided that enable an implantable connector, along with related apparatuses, devices, systems, methods, computing devices, computing entities, and/or the like to serve patients with neural interfaces requiring connectors with higher channel densities (>0.05 ch/mm.sup.3) or higher channel counts (>32) than is practical with conventional implant-connector technology.

Modular multipurpose telecommunications enclosure
11172586 · 2021-11-09 ·

A modular multipurpose telecommunications enclosure has a plurality of walls, to which are removably affixed a plurality of mounting bulkheads. Each mounting bulkhead has a plurality of mounting holes arranged into a specified hole pattern that is configured to receive and mount cameras or other electronics units from various different equipment manufacturers which employ different hole patterns in their mounting kits. The enclosure is made of a high thermal conductivity material such as aluminum to promote convection cooling and employs one or more airflow vents to keep any internal electronics from reaching undesirably high temperatures during operation. The enclosure also features antenna mounting holes to accommodate various wireless communication antennas, as well as a mounting bracket to allow easy installation of the enclosure in a desired location. The enclosure is rugged and durable against the elements to facilitate purposes such as video monitoring of an outdoor area.

Power conversion system with enhanced protection for gaseous corrosive atmospheres

A motor drive or bus supply power conversion system includes a rectifier with at least one rectifier switch module for rectifying AC input power. A DC bus is connected to the rectifier and supplies DC output power. An optional inverter is connected to the DC bus and includes at least one inverter switch module for inverting the DC bus voltage to an AC output power. The at least one rectifier switch module and the at least one inverter switch module each include a base plate and a housing connected to the base plate. The housing defines an interior space that contains at least one semiconductor switch. A protective cover layer includes a corrosion protection material and divides the interior space into an inner sub-space located between the base plate and the protective cover layer and an outer sub-space located between the protective cover layer and the housing. The at least one semiconductor switch is located in the inner sub-space such that an atmosphere in the outer sub-space passes through the protective cover layer of corrosion protection material before entering the inner sub-space. Additional anti-corrosion features are provided including a conformal coating on printed circuit board assemblies, removable connector covers, dielectric grease coated connections, nano-coated fiber optic transceivers, and an exterior protective film wrap.