An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active metallization that is electrically connected to the active electrode plates and a ground metallization that is electrically connected to the ground electrode plates of the capacitor. A ground electrical path extends from the ground metallization of the chip capacitor to the ferrule. A conductive ground pin is electrically and mechanically connected to the ferrule. The ground path comprises an internal ground plate disposed within the circuit board substrate. The internal ground plate is electrically connected to the ground metallization of the chip capacitor and to either the ferrule or the ground pin connected to the ferrule. An active electrical path extends between the active metallization of the chip capacitor and the lead wire.

Methods, devices, and systems are provided for the encapsulation of electronic devices. The encapsulation includes positioning an electronic device in a cavity of a mold, and screen or stencil printing an encapsulant, in a liquid form, around the flexible electronic device. The mold is of a sufficient thickness to allow the encapsulant to completely cover electronic components mounted on a first surface of the electronic device.

A protective cover assembly and a protected electronic device are provided. The protective cover assembly for example includes: a silicone base, having an inner surface and an outer surface opposite to the inner surface; a patterned double-sided adhesive layer, attached onto the inner surface of the silicone base; and a releasable protective paper, attached onto a side of the patterned double-sided adhesive layer facing away from the inner surface of the silicone base and thereby the patterned double-sided adhesive layer is sandwiched between the silicone base and the releasable protective paper. The protective cover assembly can be applied for protecting a keypad and/or display part of an electronic device to thereby make the protected electronic device gain a liquid sealing and corrosion-resistant performance and the service life is prolonged consequently.

An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the chip capacitor. There is a ground path electrically extending between the ground end metallization of the chip capacitor and the ferrule. The ground path comprises at least a first electrical connection material connected directly to the first gold braze, and at least an internal ground plate disposed within the circuit board substrate with the internal ground plate being electrically connected to both the first electrical connection material and the ground end metallization of the chip capacitor. An active path electrically extends between the active end metallization of the chip capacitor and the lead wire.

The waterproof member of the present disclosure includes a waterproof membrane configured to prevent entry of water while permitting sound and/or gas to pass therethrough, and a support layer having air permeability in a thickness direction thereof. The waterproof member has a joining region where the waterproof membrane and the support layer are joined, and a non-joining region where the waterproof membrane and the support layer are spaced apart from each other. The non-joining region is surrounded by the joining region when viewed in a direction perpendicular to a main surface of the waterproof membrane. A thickness of the support layer in the non-joining region is 500 μm or less. A spacing distance between the waterproof membrane and the support layer in the non-joining region is 150 μm or less. An air resistance in an in-plane direction of the support layer is greater than 80,000 seconds/100 mL.

A method for producing a hermetically gastight optoelectronic or electro-optical component with great robustness to heat and moisture is described. A housing cap is connected to a carrier in a hermetically gastight manner. Orifices in the housing cap are closed in a hermetically gastight manner by a window element. An electronic component with a housing has a housing cap, a carrier as base plate of the housing, and an interior space enclosed by the housing cap and the carrier. An optoelectronic or electro-optical converter element is arranged in the interior space. The housing cap is closed in a hermetically gastight manner by the carrier through a bonding connection of fused metal. The orifice is connected to the housing cap in a hermetically gastight manner by a window element along an edge metallization of the window element by a circumferential first seam of a fused metallic material.

An electric component assembly includes a housing with which an electric component is fitted together, and the electric component and the housing are fixed to one side of a base body. The electric component includes a connecting terminal configured to be press-fitted in a through-hole of the control board of the housing, and a direction in which the connecting terminal is inserted into the through-hole is same as a fitting direction relative to the housing. There are provided a rib protruding from one of the electric component and the housing, and a groove portion recessed from another one of the electric component and the housing and into which the rib is press-fitted. Movement of the electric component in a direction intersecting the fitting direction and rotation of the electric component around an axis parallel to the fitting direction are restrained by the rib press-fitted into the groove portion.

The waterproof member of the present disclosure includes a waterproof membrane configured to prevent entry of water while permitting sound and/or gas to pass therethrough, and a support layer having air permeability in a thickness direction thereof. The waterproof member has a joining region where the waterproof membrane and the support layer are joined, and a non-joining region where the waterproof membrane and the support layer are spaced apart from each other. The non-joining region is surrounded by the joining region when viewed in a direction perpendicular to a main surface of the waterproof membrane. A thickness of the support layer in the non-joining region is 500 m or less. A spacing distance between the waterproof membrane and the support layer in the non-joining region is 150 m or less. An air resistance in an in-plane direction of the support layer is greater than 80,000 seconds/100 mL.

An electronic component module includes: electronic components mounted on a substrate, each of the electronic components having terminals located on a side, upper, and/or lower surface thereof; and a shield that is located on the substrate, has side plates surrounding the electronic components, and is supplied with a ground potential, wherein in an electronic component closest to one side plate of the side plates among one or more electronic components, in each of which at least one terminal of the terminals is located on the side and/or upper surface, a terminal a first distance of which to the one side plate is shortest among the at least one terminal is a first terminal supplied with the ground potential, and a second distance each of second terminals not supplied with the ground potential to the one side plate is greater than the first distance.

A surge protective device (SPD) assembly module includes a polymeric outer enclosure, an SPD module, a first terminal, and a second terminal. The polymeric outer enclosure defines an enclosed, environmentally sealed enclosure chamber. The SPD module is disposed in the enclosure chamber. The SPD module defines an environmentally sealed SPD chamber and includes: first and second electrically conductive electrode members; and a varistor member formed of a varistor material and electrically connected between the first and second electrode members. The varistor member is disposed in the SPD chamber between the first and second electrode members. The first terminal is electrically connected to the first electrode member and extending out from the outer enclosure. The second terminal is electrically connected to the second electrode member and extending out from the outer enclosure.