A method bonds a first member to a second member. The method provides a first member having a bonding surface. A second member is molded from a metal material so as to have a surface constructed and arranged to be bonded to the bonding surface. The surface of the second member is laser trimmed to remove material and to remove byproducts, resulting from molding the second member, from the surface of the second member to thereby define a clean, laser trimmed surface of the second member. A sealant is provided between and in contact with the bonding surface and the clean, laser trimmed surface. The sealant is permitted to cure to thereby bond the first member to the second member.

The purpose of the present invention is to provide a control unit whereby the quantity of a seal material to be used can be reduced, while ensuring waterproof performance. This electronic control device is provided with: a housing, wherein a plurality of members are bonded, and a peripheral end portion thereof is configured from a plurality of sides; a circuit board housed in the housing; and seal structures that are disposed along the sides at the peripheral end portion. A seal material is provided to the seal structures such that the members are connected to each other. The seal structures disposed on one side of the peripheral end portion are configured such that each of seal cross sectional areas at end portions of the side is smaller than a seal cross sectional area at a center portion of the side.

A casing structure including a first housing, a glue layer, and a second housing is provided. The first housing has a first inner edge. The glue layer is disposed at the first inner edge. The second housing has a second inner edge. The first housing is assembled to the second housing, and the first inner edge is aligned with the second inner edge. The glue layer abuts against the second inner edge so as to combine the first housing with the second housing. A gap formed between the glue layer and a part of the second inner edge is defined as a glue overflow buffer area.

Hermetically sealed electronic devices and methods for fabricating the hermetically sealed electronic devices are provided. The devices include a solder sealed vacuum housing. The solder seal is formed using a solder wick having an external solder reservoir. When the reservoir is filled with molten solder, the solder is drawn via capillary action into a precisely defined narrow gap between two components of the housing where it forms an airtight and vacuum-tight seal.

A heat generating component is mounted on a circuit board housed and fixed in a case including a base and a cover. Heat generated from the circuit board is transferred from a back surface of the circuit board via an insulating sheet to a heat transfer base portion formed on an inner surface of the base. Protruding portions configured to press the circuit board through elastic bodies are formed on an inner surface of the cover. When a peripheral portion of the circuit board is in pressure contact with and sandwiched between base-side and cover-side hold portions, curvature deformation of the peripheral portion of the circuit board occurs in a downward direction. Before start of the curvature deformation, the elastic bodies are brought into abutment against a front surface of the circuit board to suppress a reduction in pressure contact force on the insulating sheet.

A radome (10) for housing an antenna (50), the radome (10) comprising a front portion (30); and a rear portion (20) configured to mate with the front portion (30); wherein the front portion (30) includes a peripheral channel region (31) configured to contain an adhesive sealant (60) and receive a peripheral edge (21) of the rear portion (20) that is partially submerged in the adhesive sealant (60) before it cures.

Provided is an electronic control device capable of suppressing outflow of a sealing material to the outside and reducing defective attachment of a bracket.

The electronic control device 1 to be attached to a bracket 2 includes a cover 4 (first housing) and a case 3 (second housing) fitted to the cover 4. The cover 4 (first housing) includes a first flange 4F and a first groove portion 31 filled with a sealing material 5. The case 3 (second housing) includes a second flange 3F overlapping the first flange 4F, and a case protrusion 33 (protrusion) fitted to the first groove portion 31 and embedded in the sealing material 5. The first flange 4F of the cover 4 (first housing) has a second groove portion 41 present at a position that is closer to the outside than the first groove portion 31 is.

A heat generating component is mounted on a circuit board housed and fixed in a case including a base and a cover. Heat generated from the circuit board is transferred from a back surface of the circuit board via an insulating sheet to a heat transfer base portion formed on an inner surface of the base. Protruding portions configured to press the circuit board through elastic bodies are formed on an inner surface of the cover. When a peripheral portion of the circuit board is in pressure contact with and sandwiched between base-side and cover-side hold portions, curvature deformation of the peripheral portion of the circuit board occurs in a downward direction. Before start of the curvature deformation, the elastic bodies are brought into abutment against a front surface of the circuit board to suppress a reduction in pressure contact force on the insulating sheet.

An electronics device includes a housing having a through-hole disposed in a central portion of the housing. A printed circuit board is connected to the housing. The printed circuit board includes one or more electronic components disposed thereon. A plastic housing cover is connected to the housing and covers the printed circuit board. The housing cover includes a centrally-located post member integral to the housing. The post member extends through the through-hole of the housing and engages with the housing. The engagement between the housing and the housing cover prevents outward deflection of the housing cover.

An electronic device includes an outer case, a wire assembly, and a water-proof glue member. The outer case has an inner space and a hole communicating with the inner space. The wire assembly extends from the inner space of the outer case to outside of the outer case through the hole. The wire assembly includes a plurality of wires, a flexible tube covering the wires, and a hard supporting tube located between the wires and the flexible tube. The water-proof glue member is disposed between a wall surface of the outer case surrounding the hole and the wire assembly.