Example welding-type devices include: a housing having a user interface on a first panel; and a display assembly configured to mount to the housing, the display assembly including: a display panel; a cover panel bonded to the display panel, the cover panel having at least one dimension larger than a corresponding dimension of the display panel; and a seal between the cover panel and the first panel.

An electronic module includes a first circuit board. The first circuit board has electronic components, spacers, a cover plate, and a casting compound. The spacers are positioned so as to rest at least in corner regions of the first circuit board. The cover plate is positioned on the spacers. The casting compound acts as an end face and seals a gap formed by the spacers between the first circuit board and the cover plate, so as to form a housing for the electronic components, which are positioned therein. The casting compound secures the cover plate to the first circuit board via positive engagement. A coefficient of linear thermal expansion of the casting compound corresponds substantially to a coefficient of linear thermal expansion of the circuit board and of the cover plate.

Provided is an electronic control device that can reduce a usage amount of an adhesive constituting a seal member, by relieving a stress caused in the seal member disposed in a gap between a first housing part and a second housing part in a high-temperature environment. In an electronic control device including: a component mounting board mounted with an electronic component; and a first housing part and a second housing part that are fixed to each other via a seal member and define a first space that accommodates the component mounting board, at least one predetermined housing part of the first or second housing part has a recess formed on a surface facing the seal member, and a second space is formed between the recess and the seal member.

A junction box used for making electrical connections to a photovoltaic panel. The junction box has two chambers including a first chamber and a second chamber and a wall common to and separating both chambers. The wall may be adapted to have an electrical connection therethrough. The two lids are adapted to seal respectively the two chambers. The two lids are on opposite sides of the junction box relative to the photovoltaic panel. The two lids may be attachable using different sealing processes to a different level of hermeticity. The first chamber may be adapted to receive a circuit board for electrical power conversion. The junction box may include supports for mounting a printed circuit board in the first chamber. The second chamber is configured for electrical connection to the photovoltaic panel. A metal heat sink may be bonded inside the first chamber.

As described herein, an electrical enclosure is sealed against environmental contamination. An enclosure cabinet has an interior space. The interior space is accessible through an opening. A door or cover selectively closes the opening. The enclosure cabinet is manufactured of numerous parts and has holes, joints, gaps, seams and/or fasteners. Electrical control devices are mounted in the cabinet. A thick-film elastomeric coating is on an outer surface of the cabinet. The coating has a thickness of at least 0.6 mm to provide a monolithic bridging layer over holes, joints, gaps, seams and/or fasteners to prevent environmental contamination from penetrating the cabinet.

An electrical component configured to reduce a decrease in lifetime of a solder bonding portion of a lead terminal, and a method for manufacturing the electrical component are provided. The electrical component includes a unit, a housing case, and a sealing member. The unit includes a circuit board, a cover member covering the circuit board, and a lead terminal integrated with the cover member and soldered to the circuit board. The housing case houses the unit. The sealing member is disposed between the cover member and the housing case. The method for manufacturing the electrical component includes positioning the unit with respect to the housing case while disposing a liquid sealing member as a precursor of the sealing member between the cover member and the housing case, and hardening the liquid sealing member after the positioning.

An electronic device according to an embodiment of the disclosure may include: a housing; a waterproof member comprising a waterproof material disposed along a periphery of the housing on one surface of the housing; a window cover disposed to face the one surface of the housing; a display disposed between the window cover and the housing and including a bending part located at one end part of the electronic device; and a molding part extending along peripheries of the window cover and the display and disposed on one surface of the waterproof member, wherein at least a part of the molding part may be disposed in one direction toward an outside of the electronic device and in another direction opposite the one direction based on the bending part of the display.

A housing for an electronic device that allows electromagnetic waves to pass through the housing is disclosed. The housing may include a first portion having an opening, a second portion positioned within the opening, and an insert including a protrusion extending into at least a portion of a gap formed between the first portion and the second portion. The housing also may include a first ink layer disposed within the gap and substantially surrounding the protrusion, and a second ink layer disposed within the gap and over the first ink. The first portion, second ink layer, and second portion may cooperate to form a substantially contiguous surface, and the second ink layer may be positioned approximately 5 microns (m) or less below an exposed surface of the first portion and an exposed surface of the second portion.

A casing structure including a first housing, a glue layer, and a second housing is provided. The first housing has a first inner edge. The glue layer is disposed at the first inner edge. The second housing has a second inner edge. The first housing is assembled to the second housing, and the first inner edge is aligned with the second inner edge. The glue layer abuts against the second inner edge so as to combine the first housing with the second housing. A gap formed between the glue layer and a part of the second inner edge is defined as a glue overflow buffer area.

A method of encapsulating and hermetically sealing a printed circuit board of a flex cable includes: positioning a printed circuit board portion of a flex cable into a channel defined in a first mold half of a mold, the printed circuit board portion including a substrate and electronic components mounted on the substrate; mounting a second mold half onto the first mold half to enclose the channel of the first mold half and form a cavity within the mold; and filling the cavity of the mold with an encapsulation material through an inlet opening defined through the mold.