An ECU 1 includes a circuit board 10, a connector 20 fixed to the circuit board 10, a resin portion 50 covering the circuit board 10 and the connector 20. A buffer portion 60 is interposed between the circuit board 10 and the connector 20, between the circuit board 10 and the resin portion 50, or between the connector 20 and the resin portion 50. This configuration enables the buffer portion 60 having elasticity to absorb the stresses generated due to differences in linear expansion coefficient in the boundary portion between the circuit board 10 and the connector 20, the boundary portion between the circuit board 10 and the resin portion 50, and the boundary portion between the connector 20 and the resin portion 50. This makes it possible to prevent the connector 20 from peeling from the circuit board 10.

The invention relates to a field device of automation technology with an opened housing and an electronics part in the housing, comprising at least one component for filling potting compound into the housing, wherein the component has a trough, in order to conduct the potting compound, with targeting, to a location of the housing to be potted.

A display device includes a housing including first and second edge areas; a panel assembly between a window and the housing; a first waterproof member corresponding to the first edge area; a second waterproof member corresponding to the second edge area and disconnected from the first waterproof member; and a first sealing member in contact with the first and second waterproof members, the panel assembly, the window and the housing. The panel assembly includes a plurality of members each protruded further than an end of the first waterproof member to respectively define first edges. Each first edge is in contact with the first sealing member, and protruded distances of the first edges from the end of the first waterproof member increase as a cross-sectional distance from the plurality of members to the window decreases to form a stepped shape of the panel assembly at the first edges.

Digital valve controllers and seal washer assemblies for use with digital valve controllers include a seal washer assembly. The seal washer assembly includes a body. The body has a bore. The seal washer assembly includes a flange. The flange is coupled to the body and includes a passage, a face-seal groove, and an exterior-seal groove. The seal washer assembly includes a face seal. The face seal is disposed within the face-seal groove. The seal washer assembly includes an exterior seal. The exterior seal is disposed within the exterior-seal groove.

An electronic circuitry module and a method of potting an electronic circuit are provided. The electronic circuit module includes at least one heat generating electronic component and is potted in a potting material. Additionally, a cooling circuit is potted in the potting material. The cooling circuit includes an inlet and an outlet for flow of cooling liquid therebetween.

A radio frequency module includes a wiring substrate, a plurality of components mounted on an upper surface of the wiring substrate, a sealing resin layer laminated on the upper surface of the wiring substrate and covering the plurality of components, a groove formed in an upper surface of the sealing resin layer and extending between predetermined components of the plurality of components, and a shielding wall made of conductive paste in the groove. The sealing resin layer has a stepped area defining the higher portion and lower portion in the upper surface. The groove intersects the stepped area when the wiring substrate is seen in plan view.

A method of electrically connecting an electronic textile to an electronic device, the electronic textile comprising an electrically insulating textile carrier and one or more electrical conductor lines, the method comprising: positioning the electronic textile relative to the electronic device such that each conductor line is in contact with an electrical conductor of the electronic device, thereby providing an assembly; and fixing a clamp member to the assembly such that each conductor line is sandwiched between the clamp member and an electrical conductor of the electronic device. The clamp member may comprise one or more grooves, and fixing the clamp member to the assembly may be such that each conductor line is located within a respective groove.

In implementations of device component exposure protection, a computing device includes device components enclosed within a housing. The device components are assembled within the housing and enclosed within the housing upon completion of assembly of the computing device. The computing device further includes a protective material contained within the housing, which fills void spaces around the device components. The protective material prevents exposure of the device components to external matter that the computing device is exposed to upon completion of the assembly.

The present disclosure relates to a waterproofing method for an electronic device. In one example method, silane is coated on an inner wall of a first housing of the electronic device and an inner wall of a second housing of the electronic device. The first and second housings and a main board of the electronic device are assembled. Fluoride is injected into a cavity of the electronic device through a liquid inlet hole on the first housing. An integral continuous waterproofing membrane is formed on the inner walls of the first and second housings through chemical reaction between the silane and the fluoride.

An electronic device includes a housing that defines an aperture, and a display assembly positioned in the aperture. The display assembly can include a display layer having a first portion, and a second portion bending at least partially below the first portion. The first portion and the second portion can define a bend volume, and a potting material can be disposed in the bend volume, such that the potting material contacts the first portion and the second portion. An internal enclosure can be contoured to the display assembly.