In some examples, a medical device may include circuitry on a circuit board, a casing, and a fill material at least partially within the casing. The casing may receive the circuit board and surround at least a portion of the circuit board. The casing may define an aperture configured to allow one or more electrical connectors of the circuit board to extend through the aperture for one or more electrical connections with one or more components outside of the casing. An outer surface of the casing may define a first portion of an outer surface of the medical device. The casing may comprise a material having a first melting temperature. The fill material may define a second portion of the outer surface of the medical device and may have a second melting temperature that is lower than the first melting temperature.

A motor drive or bus supply power conversion system includes a rectifier with at least one rectifier switch module for rectifying AC input power. A DC bus is connected to the rectifier and supplies DC output power. An optional inverter is connected to the DC bus and includes at least one inverter switch module for inverting the DC bus voltage to an AC output power. The at least one rectifier switch module and the at least one inverter switch module each include a base plate and a housing connected to the base plate. The housing defines an interior space that contains at least one semiconductor switch. Anti-corrosion features are provided including a conformal coating on printed circuit board assemblies, removable connector covers, dielectric grease coated connections, nano-coated fiber optic transceivers, and an exterior protective film wrap.

A proximity sensor in which generation of voids in a resin sealing portion sealing an inside of a housing can be suppressed and thus a yield is improved. The proximity sensor includes a housing, a detection coil, a circuit board and a resin sealing portion. The circuit board is accommodated in the housing to partition an internal space of the housing, and the resin sealing portion covers at least a part of the circuit board by filling the internal space of the housing and thus seals a covered portion of the circuit board. A resin injection port configured to inject a liquid resin forming the resin sealing portion by curing the liquid resin is provided in the housing, and a cutout portion having a notch shape or an opening shape is provided in the circuit board to include at least a part of a portion facing the resin injection port.

A structure includes a sheet metal antenna as a first member, a rear-surface-side housing as a second member including a through hole, and a sealing portion which seals the through hole while the sealing portion fixes relative positional relation between the first and second members. The second member includes a space. The sheet metal antenna includes a second portion along a second surface and an intermediate portion which passes through the through hole and the like. The space includes a first region covered with the second portion and the like, a second region located opposite to the first region with the intermediate portion being interposed, and a third region which lies from one main surface of the intermediate portion to the other main surface thereof while it is in contact with both of the first region and the second region. The second portion includes an injection hole.

A method and apparatus for providing welding type power is disclosed. At least one circuit board is used that is partially potted using a potting barrier affixed to the circuit board. The partially potted portion can be inside an enclosed air flow space.

A power conversion device that supplies power to a load using a module incorporating a semiconductor element is such that a sealing wall that holds a sealing resin is provided on a metal case that cools the module, a feedback current channel, which is one wiring member forming a current channel that passes into and out of the semiconductor element, is the metal case, and another wiring member is disposed in proximity to and parallel with the sealing wall of the metal case.

A first trench is formed in a first sealing resin layer, which seals first electronic components and second electronic components on one main surface of a circuit board, and a second trench is formed in a second sealing resin layer, which seals third electronic components and fourth electronic components on another main surface. The first trench is formed between the first electronic components and the second electronic components when viewed in plan view, extending from an upper surface of the first sealing resin layer toward a surface opposite from the one main surface of the first sealing resin layer, and the second trench is formed between the third electronic components and the fourth electronic components when viewed in plan view, extending from a lower surface of the second sealing resin layer toward a surface opposite from the other main surface of the second sealing resin layer.

An electronics thermal conduction package is provided. The package may include a housing and an interior space, or envelope, configured to receive a printed circuit board assembly (PCBA) with one or more microprocessors or other heat generating elements. The package can be elastically deformed to open a dimension of the envelope, or receiving cavity, such that a complete PCBA can be inserted inside the interior space of the package. Once inserted, the package may be returned to its undeformed, or substantially undeformed, state such that surfaces in the interior space of the package contact one or more of the heat generating elements on the PCBA creating a conductive thermal path from the heat generating elements to the housing of the package.

An inverter system control (ISC) module is provided. The ISC module includes a power module defining a coolant channel for receiving a coolant, and a capacitor assembly disposed adjacent to the power module. The capacitor assembly includes a housing, a potting material disposed within the housing, and a plurality of power sources disposed within the potting material. The capacitor assembly further includes a cooling bar extending within the potting material between the power sources, and further extending out of the potting material and into the power module.

A cover (1) closes an opening portion of a case (2). The opening portion is formed of resin and belonging to the case (2). The cover (1) includes a resin member (10) having a frame portion having a shape corresponding to the opening portion, a metal member (20) provided in the resin member (10) and closing a hollow place defined by the frame portion, and a watertight member (30) sealing a contact place between the resin member (10) and the metal member (20). The resin member (10) and the metal member (20), in the contact place, define a concave portion by standing a pair of wall portions (11, 13) belonging to the resin member (10) erectly on the metal member (20). The watertight member (30) is provided inside the concave portion.