Exemplary embodiments are directed to pool cleaners that remove debris from water using a plurality of cyclonic flows, or that include a removable impeller subassembly, a check valve for a debris canister, a particle separator assembly having a handle that locks to the pool cleaner, a modular roller drive gear box, or a roller latch that secures a roller to the pool cleaner. Exemplary embodiments are also directed to the check valve and the roller latch themselves. Exemplary embodiments are directed to a filter medium for pool cleaners that includes embossments providing flow channels for water, and to roller assemblies for pool cleaners. Exemplary embodiments are directed to pool cleaners including alternative pump motor engagements. Exemplary embodiments are directed to pool cleaners power supplies that include a potted and contoured power board assembly, and to kickstands therefor. Exemplary embodiments are directed to a pool cleaner caddy, and removable wheels therefor.

A seal structure includes a container, a sealant applied in liquid form that cures to a gel, and a cap that applies pressure to the gel. The container surrounds at least one opening in an assembly for the passage of elongated members such as wires. The container defines a chamber that is in communication with the opening and surrounds the wires passing through the opening. A closure spans the opening and is in contact with an inner end of the container. The chamber and the at least opening are partially filled with a predetermined quantity of sealant in liquid form, which cures into a viscous gel. The cap is configured to engage with the container and includes a platform that is positioned within the container and in contact with the gel sealant. In this arrangement, the cap applies positive pressure to the gel sealant.

Embodiments are directed to a circuit assembly for an electronic device having an electromagnetic shield that defines a sensing element or contact pad along an outer surface of the assembly. The circuit assembly includes a group of electrical components attached to a surface of a printed circuit board. A molded structure may encapsulate the group of electrical components and at least a portion of the surface of the printed circuit board. A metal layer may be formed over an outer surface of the molded structure. The metal layer may define both a shield portion configured to provide shielding for one or more of the group of electrical components and an electrode configured to detect an input applied to the electronic device.

A package module includes a circuit board, an electronic component disposed on the circuit board, a frame disposed next to at least one side of the electronic component, and an encapsulant. A gap is formed between the frame and the electronic component. The encapsulant includes a first portion covering at least a part of the circuit board, and a second portion filling into at least a part of the gap. The first portion has a first height relative to the circuit board, and the second portion has a second height relative to the circuit board, in which the second height is greater than the first height.

The present disclosure relates to a waterproofing method for an electronic device. In one example method, silane is coated on an inner wall of a first housing of the electronic device and an inner wall of a second housing of the electronic device. The first and second housings and a main board of the electronic device are assembled. Fluoride is injected into a cavity of the electronic device through a liquid inlet hole on the first housing. An integral continuous waterproofing membrane is formed on the inner walls of the first and second housings through chemical reaction between the silane and the fluoride.

Various embodiments disclose an electronic device comprising a housing, said housing comprising: at least one metallic material portion; and a synthetic resin material portion, said synthetic resin material comprising a sealing resin, the synthetic resin material portion joined and injection molded to at least a part of the at least one metallic material portion, wherein the sealing resin is disposed at at least a portion of a joint between the metallic material portion and the synthetic resin material portion.

The invention relates to an electrical device (10), notably intended to control an electric machine, comprising: a first zone filled with an insulating material (A) and comprising a first electronic unit (12) embedded in the insulating material (A); a second zone filled with an insulating material (B) and comprising a second electronic unit (18) embedded in the insulating material (B); and a third zone filled with an insulating material (B) and comprising at least one electrical connection element (22) embedded in the insulating material (B), the at least one electrical connection element (22) connecting the first electronic unit (12) with the second electronic unit (18); in which the first and the second zone are each in contact with the third zone so that the electrical device comprises at least one space extending around the third zone and between the first and the second zone.

Pressure-isolating bulkhead structures with integrated selective electronic switches circuitry are provided. The pressure-isolating bulkhead structure may be a single unit having the integrated electronic switch circuitry, as well as an electrical connector that includes at least one of a wire and a pin contact. Such integrated selective electronic switch circuitry may be fashioned within a self-contained, inner pressure-isolating enclosure body. Such inner pressure-isolating enclosure body may be produced about the selective electronic switch circuitry such that the inner pressure-isolating enclosure body and switch circuitry are produced as a unit, which can be easily placed within a variety of bulkhead structures, and subsequently within a perforating gun.

A method for assembling a power supply module, wherein a plurality of spacers are positioned between planes of different electrical potential on at least a high voltage end of a printed circuit board (PCB). The plurality of spacers having an electric field of a creepage distance greater than 0.4 kV/mm and configured to mechanically support the PCB during assembly and curing of an encapsulant. The encapsulant being an insulating material configured to provide electrical and thermomechanical insulation to the power supply module.

A feedthrough apparatus, such as for a passage through a barrier between a first compartment and a second compartment of a housing, can include a sleeve configured to sealingly couple with the passage, a printed circuit board (PCB) disposed through the sleeve and configured to provide electrical communication among the first compartment and the second compartment of the housing, and a seal disposed within the sleeve. The seal can be sealingly coupled to the PCB, and the sleeve, the PCB and the seal can be configured to hermetically seal the passage. The seal can include potting material and a V-groove connection.