An electronic device includes an FPC as an extending member which extends to connect a first region and a second region to each other and includes a first surface and a second surface facing away from each other, a first member located to abut on the first surface, and a second member located to abut on the second surface. The first member and the second member form in combination, a sealing region which surrounds a certain section of the extending member with a gap being located in part. The first region and the second region are watertightly separated from each other by a sealant located in the gap at least in the sealing region. The first member includes a through hole which allows communication between the gap and the outside.

An electrical assembly structure includes electric circuitry, a first waterproof layer, and a second waterproof layer. The electric circuitry includes an electric unit and a lead wire electrically connected to the electric unit. The lead wire includes an inner section, an outer section, and an intermediate section between the inner section and the outer section. The inner section is connected to the electric unit. The first waterproof layer covers the electric unit and the inner section. The second waterproof layer covers the intermediate section and is connected to the first waterproof layer. The second waterproof layer is located between the outer section and the first waterproof layer. The outer section is exposed outside the second waterproof layer. A material of the second waterproof layer is softer than a material of the first waterproof layer. Motors including the electrical assembly structure are also disclosed.

A method and circuit board arrangement for an intrinsically safe portable device includes two or more circuit boards having a frame structure that forms a contiguous boundary around a space between the circuit boards. In the space there are circuit components mounted on both circuit boards, and a connector that connect the two circuit boards. An encapsulant material fills the space bounded by the frame structure between the circuit boards to exclude airborne material from coming into contact with the encapsulated circuit components.

In one exemplary embodiment, an arrangement for protecting electronics from interference radiation includes a housing and a circuit carrier for accommodating the electronics in an interior of the housing. The housing defines an opening for compensating the different pressures inside and outside the housing. The arrangement of the exemplary embodiment is also distinguished by a contact-making element of an electronic component of the electronics arranged between the opening and the circuit carrier in such a manner that the electronics are at least partially screened from interference radiation entering the housing through the opening.

Motor control modules with multiple potted sub-modules, and associated systems and methods are disclosed. A representative electric motor control module can include a potted contactor module, a potted controller module at least partially nested inside the contactor module and mechanically connected to the contactor module, and one or more connectors positioned between and electrically connecting the contactor module and the controller module.

An auxiliary adhesive dispensing apparatus is connected to a printed circuit board (PCB) through an opening on a side surface of a shielding cover above the PCB, and the auxiliary adhesive dispensing apparatus includes a flow guiding groove, an adhesive-injection opening connected to an end of the flow guiding groove, and a fixing part connecting the flow guiding groove and the PCB. The auxiliary adhesive dispensing apparatus is connected to a PCB through an opening on a side surface of a shielding cover above the PCB. By means of the auxiliary adhesive dispensing apparatus, an adhesive dispensing operation can still be performed after a shielding cover is mounted, so that the adhesive dispensing operation can be performed after second-reflow soldering processing.

A steering computer for a vehicle includes: at least one printed circuit positioned inside a computer casing, the computer casing including on an external surface at least one joining contact, at least one connection box provided with at least one connector, the at least one connector being connected to at least one joining contact, characterized in that the at least one connection box is fixed to the computer casing by means of at least one fixing element, said at least one fixing element being at least partially embedded in a resin.

The present disclosure relates to a process automation field device having a housing and a printed circuit board, wherein the printed circuit board and housing have at least one common fixation region by which a relative movement of the printed circuit board within the housing is prevented, characterized in that the printed circuit board has at least one opening to compensate for diverging changes in length between the printed circuit board and housing.

A method of manufacturing a resin sealing module, which includes an injection step of injecting an uncured curable liquid resin into a module case and a positioning step of positioning the mold member, is provided. In the injection step, a substrate with electronic components is immersed into the curable liquid resin. In the positioning step, the mold member is positioned so that inside space of the first partition wall faces a second region. In the positioning step, at least a protruding end portion of the first partition wall is immersed into the curable liquid resin while a gas layer is held in the inside space. Thereby, a partial region of an upper surface of the curable liquid resin is depressed by the gas layer, so that this region is positioned lower in level than other regions.

Circuit board for a field device of automation technology comprising a plurality of electronic components (4) and a potting compound container (2) made of a plastic and having a peripheral side wall defining an outer contour of the potting compound container, a potting compound cover adjoining the side wall and an opening located on the potting compound cover far side, wherein the potting compound container is set via the opening over at least a part of the plurality of electronic components (4) and filled with a potting compound in such a manner that electronic components covered by the potting compound have a predetermined, or defined, minimum covering, wherein the potting compound container is, however, not completely filled with potting compound and wherein in the potting compound cover in an edge region, which borders a transition from the side wall to the potting compound cover, at least one gap is present, which extends at least over a convex edge region of the outer contour.