A housing with an open receiving chamber which has a circumferential edge in the form of a creepage barrier at an open upper face is disclosed. The receiving chamber is filled with a casting compound, and the hardened casting compound forms a concave surface relative to the circumferential edge at the open upper face. A sensor is also disclosed that includes such a housing. In addition, a method for casting an open receiving chamber of such a housing is disclosed. The open receiving chamber has an opening at one end leading to an enclosed interior adjoining the open receiving chamber. The enclosed interior is filled with the casting compound, and the open upper face of the receiving chamber has a varying height where the upper face transitions into the enclosed interior. The circumferential edge has an outwardly descending inclination and a continuous curvature formed by tangential transitions in order to overcome the height difference, and the circumferential edge allows the receiving chamber to be temporarily overfilled, thereby forming a stable convex casting compound surface, during the casting process.

A housing of a field device of measuring- and automation technology, comprising a housing body, which has at least two housing chambers, wherein the housing chambers are connected together by an opening. The opening is adapted to accommodate a circuit board which is held by at least one holder, wherein the circuit board is adapted to be populated with electronic components or assemblies. The opening is Ex-d sealed with a potting compound.

In one exemplary embodiment, an arrangement for protecting electronics from interference radiation includes a housing and a circuit carrier for accommodating the electronics in an interior of the housing. The housing defines an opening for compensating the different pressures inside and outside the housing. The arrangement of the exemplary embodiment is also distinguished by a contact-making element of an electronic component of the electronics arranged between the opening and the circuit carrier in such a manner that the electronics are at least partially screened from interference radiation entering the housing through the opening.

Exemplary embodiments are directed to pool cleaners that remove debris from water using a plurality of cyclonic flows, or that include a removable impeller subassembly, a check valve for a debris canister, a particle separator assembly having a handle that locks to the pool cleaner, a modular roller drive gear box, or a roller latch that secures a roller to the pool cleaner. Exemplary embodiments are also directed to the check valve and the roller latch themselves. Exemplary embodiments are directed to a filter medium for pool cleaners that includes embossments providing flow channels for water, and to roller assemblies for pool cleaners. Exemplary embodiments are directed to pool cleaners including alternative pump motor engagements. Exemplary embodiments are directed to pool cleaners power supplies that include a potted and contoured power board assembly, and to kickstands therefor. Exemplary embodiments are directed to a pool cleaner caddy, and removable wheels therefor.

In a relay connector, a male terminal is formed in a rod-like shape, inserted into a through hole penetrating a male terminal housing chamber, extends inside a cylinder part, and has a first contact part. A protective plate includes a body part that partitions an internal space defined by the cylinder part and the male terminal housing chamber into a first space portion located on the first contact part side of the male terminal and a second space portion located on the male terminal housing chamber side of the male terminal, a terminal hole that is formed in the body part, and configured to receive the male terminal thereinto, and a filling port that is formed in the body part, and communicably connects the first space portion and the second space portion to each other. The second space portion is filled with a potting filling part.

A package module includes a circuit board, an electronic component disposed on the circuit board, a frame disposed next to at least one side of the electronic component, and an encapsulant. A gap is formed between the frame and the electronic component. The encapsulant includes a first portion covering at least a part of the circuit board, and a second portion filling into at least a part of the gap. The first portion has a first height relative to the circuit board, and the second portion has a second height relative to the circuit board, in which the second height is greater than the first height.

Pressure-isolating bulkhead structures with integrated selective electronic switches circuitry are provided. The pressure-isolating bulkhead structure may be a single unit having the integrated electronic switch circuitry, as well as an electrical connector that includes at least one of a wire and a pin contact. Such integrated selective electronic switch circuitry may be fashioned within a self-contained, inner pressure-isolating enclosure body. Such inner pressure-isolating enclosure body may be produced about the selective electronic switch circuitry such that the inner pressure-isolating enclosure body and switch circuitry are produced as a unit, which can be easily placed within a variety of bulkhead structures, and subsequently within a perforating gun.

An apparatus for thermal management for an electric device. In one embodiment the apparatus comprises a primary heat spreader disposed within an enclosure that contains a printed circuit board (PCB) populated with at least one electrical component, wherein the primary heat spreader is thermally conductive and wherein the interior of the enclosure is at least partially filled with an encapsulating material; a secondary heat spreader coupled to an exterior face of a first wall of the enclosure, wherein the secondary heat spreader is thermally conductive; and a thermal interface coupled between the primary head spreader and the PCB, wherein the thermal interface is thermally conductive and electrically insulating.

According to aspects of the present disclosure, a method of environmentally sealing an electrical joint formed between an electrical connection element and an electrical conductor disposed on a transparent pane is described. The method includes adhering a mechanically protective enclosure to the transparent pane to define an internal volume therebetween and filling at least a portion of the internal volume with a sealing material that inhibits ingress of liquid into the volume and provides a fluidic environmental barrier about the electrical joint. The electrical joint is disposed within the internal volume and spaced from the enclosure.

A protective housing for an electronic module comprises a shell defining an inner compartment receiving an electrical component and a cooling element. The cooling element has a cover plate, a first side plate, and a second side plate. The first side plate and the second side plate extend from the cover plate, face each other, and form an inside surface, an outside surface, and edges of the cooling element. A portion of the inside surface of the cooling element covers the shell to form a cover of the inner compartment. The cooling element forms a channel that extends partly in the cover plate between opposing edges of the cooling element and increases a volume of the inner compartment. The inner compartment is filled with an electrically insulating material through a cut-out in the cover plate, leaving a void in a portion of the channel.