H05K5/064

Temperature sensing arrayal for freeboard detection

An exemplary inventive freeboard detection system includes a tubular watertight temperature-sensing device and a computer. The temperature-sensing device includes a printed circuit board assembly (PCBA), a potting compound, and a hollow rigid tube. Inside the tube the potting compound encapsulates the PCBA, which includes a printed circuit board (PCB) and multiple temperature sensors closely and equidistantly arrayed along the length of the tube. The temperature-sensing device is vertically secured in a partially submerged state to a vessel with the expectation that some of the vertically arrayed temperature sensors will sense air temperature and others will sense water temperature. On an ongoing basis, the computer receives signals from the temperature sensors and processes the signals to monitor freeboard values, which the computer calculates based on differences in temperature measurements corresponding to pairs of consecutive (and/or nonconsecutive) temperature sensors. A maximum calculated difference in temperature measurements is indicative of the location of the water surface.

PROXIMITY SENSOR
20180266851 · 2018-09-20 · ·

A proximity sensor in which generation of voids in a resin sealing portion sealing an inside of a housing can be suppressed and thus a yield is improved. The proximity sensor includes a housing, a detection coil, a circuit board and a resin sealing portion. The circuit board is accommodated in the housing to partition an internal space of the housing, and the resin sealing portion covers at least a part of the circuit board by filling the internal space of the housing and thus seals a covered portion of the circuit board. A resin injection port configured to inject a liquid resin forming the resin sealing portion by curing the liquid resin is provided in the housing, and a cutout portion having a notch shape or an opening shape is provided in the circuit board to include at least a part of a portion facing the resin injection port.

CONNECTOR
20180261952 · 2018-09-13 ·

In a relay connector, a male terminal is formed in a rod-like shape, inserted into a through hole penetrating a male terminal housing chamber, extends inside a cylinder part, and has a first contact part. A protective plate includes a body part that partitions an internal space defined by the cylinder part and the male terminal housing chamber into a first space portion located on the first contact part side of the male terminal and a second space portion located on the male terminal housing chamber side of the male terminal, a terminal hole that is formed in the body part, and configured to receive the male terminal thereinto, and a filling port that is formed in the body part, and communicably connects the first space portion and the second space portion to each other. The second space portion is filled with a potting filling part.

FIELD DEVICE WITH A COMPONENT FOR FILLING POTTING COMPOUND
20180249587 · 2018-08-30 ·

The invention relates to a field device of automation technology with an opened housing and an electronics part in the housing, comprising at least one component for filling potting compound into the housing, wherein the component has a trough, in order to conduct the potting compound, with targeting, to a location of the housing to be potted.

IMPLANTABLE SENSOR ASSEMBLY SYSTEMS AND METHODS

A system includes an implantable sensor assembly. The implantable sensor assembly includes a housing. The housing includes a substrate layer comprising an interior surface and an exterior surface, and a cap layer, wherein the substrate layer and the cap layer are coupled to form an enclosed cavity that at least partially encloses the interior surface of the substrate layer within the cavity and wherein both the substrate layer and the cap layer are formed from an insulating material. The implantable sensor assembly also includes one or more electronic components disposed within the cavity of the housing and one or more probes disposed on the exterior surface of the substrate layer and electrically coupled to the one or more electronic components by one or more electrical connections extending through the housing.

PRINTED CIRCUIT BOARD ASSEMBLY
20240357753 · 2024-10-24 ·

A printed circuit board assembly for a field bus device is described, comprising a housing, a printed circuit board, and at least one electronic component fastened to the printed circuit board. The printed circuit board is arranged in the housing. The housing has at least one bearing surface on which a gap filler is arranged, against which the electronic component rests so that the printed circuit board is mounted in the housing via the electronic component and the gap filler. A potting compound is provided, which covers the printed circuit board and contacts the gap filler.

ELECTRONICS THERMAL MANAGEMENT

Potted electronic assemblies are disclosed along with methods of making and cooling them. The electronic assemblies include a conductive heat transfer medium disposed between and in contact with an electronic component and a heat sink. The conductive heat transfer medium has a hardened fluid polymer material that includes boron nitride nanotubes dispersed therein.

Electronic control apparatus for vehicle using potting layer and method of manufacturing the same
10021799 · 2018-07-10 · ·

An electronic control apparatus for a vehicle according to the present invention includes: an electronic control board which electrically controls respective parts in the vehicle; a connector which is electrically connected with the electronic control board; an extruded housing which is opened at both sides, and has one side into which the connector connected with the electronic control board is inserted and accommodated in a slot manner; a connector cover which is coupled to the connector and covers the one open side of the extruded housing into which the connector is inserted; and a back cover which covers the other open side of the extruded housing, in which a first potting layer is formed at an upper side of the connector cover, and a second potting layer is formed in the back cover adjacent to the other side of the extruded housing.

ELECTRONIC CONTROL DEVICE

Electronic component unit (20) is received in inside of housing (1) prepared by joining base (2) and cover (3). Sealing groove (24) for sealing material (24a) is formed on joining surface (21) of base (2). Protruding rib (35) fittable into seal groove (24) is formed on joining surface (33) of cover (3). Furthermore, spring hook portion (4) is provided to be positioned outside of the joining surfaces (21, 33) on an outer peripheral side of housing (1). Spring hook portion (4) is structured to include flexible portion (41) that extends to span between outer peripheral surfaces of base (2) and cover (3) and that is formed into a beam supported at only one end thereof on the outer peripheral surface of cover (3), and engaging portion (40) that is formed on a tip end side of flexible portion (41) and is engaged with the outer peripheral surface of base (2).

RADIO REQUENCY MODULE AND METHOD FOR MANUFATURING THE SAME

A radio frequency module includes a wiring substrate, a plurality of components mounted on an upper surface of the wiring substrate, a sealing resin layer laminated on the upper surface of the wiring substrate and covering the plurality of components, a groove formed in an upper surface of the sealing resin layer and extending between predetermined components of the plurality of components, and a shielding wall made of conductive paste in the groove. The sealing resin layer has a stepped area defining the higher portion and lower portion in the upper surface. The groove intersects the stepped area when the wiring substrate is seen in plan view.