A motor drive or bus supply power conversion system includes a rectifier with at least one rectifier switch module for rectifying AC input power. A DC bus is connected to the rectifier and supplies DC output power. An optional inverter is connected to the DC bus and includes at least one inverter switch module for inverting the DC bus voltage to an AC output power. The at least one rectifier switch module and the at least one inverter switch module each include a base plate and a housing connected to the base plate. The housing defines an interior space that contains at least one semiconductor switch. A protective cover layer includes a corrosion protection material and divides the interior space into an inner sub-space located between the base plate and the protective cover layer and an outer sub-space located between the protective cover layer and the housing. The at least one semiconductor switch is located in the inner sub-space such that an atmosphere in the outer sub-space passes through the protective cover layer of corrosion protection material before entering the inner sub-space. Additional anti-corrosion features are provided including a conformal coating on printed circuit board assemblies, removable connector covers, dielectric grease coated connections, nano-coated fiber optic transceivers, and an exterior protective film wrap.

Apparatus electronically interconnecting first electronic circuitry (72) in a hazardous environment with second electronic circuitry (74) whilst partitioning the second electronic circuitry from the hazardous environment includes a metallic body (42) defining a passage (56) which opens at one end into the hazardous environment. A PCB (58) extends across the passage and is encased within a layer of insulating material (66) on one side to form a gas tight barrier across the passage. The PCB has a first connector (78) connected with said first electronic circuity and at least one second connector (80) extending through the layer of insulating material and connected with said second electronic circuitry. The first and second connectors are electronically coupled so that the first electronic circuitry is electronically connected with the second electronic circuity through the PCB and insulating layer.

An electronic module, more particularly a control module or sensor module for a motor vehicle transmission, has a circuit board having a first side and a second side facing away from the first side, electronic components arranged on the first side, and a casting compound arranged on the first side. The casting compound covers the electronic components. The circuit board has a through-hole connecting the first side to the second side. A sensor element covering the through-hole is arranged on the first side of the circuit board.

A structure includes a first substrate film and a functional electronics assembly. The first substrate film comprises a recess defining a volume. The functional electronics assembly comprises at least a first substrate, at least one electronics component on the first substrate, and at least one connection portion. The functional electronics assembly is connected to the first substrate film via the at least one connection portion. The at least one electronics component is arranged at least partly into the volume. At least part of the at least one electronics component is embedded into a first material arranged into the recess.

A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector.

An example sensor includes a PCB mounted in an internal chamber of housing, wherein the PCB comprises calibration electrical contact points; a sealing grommet mounted in the internal chamber, wherein the sealing grommet comprises an axial hole aligned with the calibration electrical contact points, thereby providing access to the calibration electrical contact points of the PCB; a grommet plug disposed in the axial hole of the sealing grommet; a sensing element disposed in the housing and electrically-coupled to the PCB via an electrical connection; an encapsulant sealing material deposited on the sealing grommet and the grommet plug; and an external cable connected to the PCB and extending through the sealing grommet and through the encapsulant sealing material.

A display device includes a housing including first and second edge areas; a panel assembly between a window and the housing; a first waterproof member corresponding to the first edge area; a second waterproof member corresponding to the second edge area and disconnected from the first waterproof member; and a first sealing member in contact with the first and second waterproof members, the panel assembly, the window and the housing. The panel assembly includes a plurality of members each protruded further than an end of the first waterproof member to respectively define first edges. Each first edge is in contact with the first sealing member, and protruded distances of the first edges from the end of the first waterproof member increase as a cross-sectional distance from the plurality of members to the window decreases to form a stepped shape of the panel assembly at the first edges.

A display device includes a housing including first and second edge areas; a panel assembly between a window and the housing; a first waterproof member corresponding to the first edge area; a second waterproof member corresponding to the second edge area and disconnected from the first waterproof member; and a first sealing member in contact with the first and second waterproof members, the panel assembly, the window and the housing. The panel assembly includes a plurality of members each protruded further than an end of the first waterproof member to respectively define first edges. Each first edge is in contact with the first sealing member, and protruded distances of the first edges from the end of the first waterproof member increase as a cross-sectional distance from the plurality of members to the window decreases to form a stepped shape of the panel assembly at the first edges.

An electronic apparatus has a housing in which a substrate with an electronic component mounted thereon, a thermoplastic hot-melt resin, and a substrate holding part are accommodated. The interior of the housing is divided by the substrate into a plurality of spaces. In the plurality of spaces, a distance between the substrate or the electronic component on the substrate and the substrate holding part, the housing, another substrate, or the electronic component on the another substrate is 0.3 mm to 1.5 mm.

Digital valve controllers and seal washer assemblies for use with digital valve controllers include a seal washer assembly. The seal washer assembly includes a body. The body has a bore. The seal washer assembly includes a flange. The flange is coupled to the body and includes a passage, a face-seal groove, and an exterior-seal groove. The seal washer assembly includes a face seal. The face seal is disposed within the face-seal groove. The seal washer assembly includes an exterior seal. The exterior seal is disposed within the exterior-seal groove.