A relay includes a relay main body (10) including a base (20) having a first surface (21), and a relay substrate (30) extending, in a direction intersecting the first surface (21), from a second surface (22) on the opposite side of the base (20) from the first surface (21), the relay substrate (30) being united with the base (20), and a case (50) attached to the relay main body (10) to cover the relay substrate (30), and the case (50) being filled with sealant. The relay main body (10) includes a board connector (23) provided on the first surface (21) of the base (20), an electronic component mounting portion (33) provided on the relay substrate (30), a conducting portion (40) provided on respective surfaces of the base (20) and the relay substrate (30), and an electronic component (34) mounted on the electronic component mounting portion (33).

A power supply device with PCB-positioning features includes a casing, a PCB (Printed Circuit Board) and at least one pair of slots. The casing defines an accommodating space and has at least one opening. The PCB is disposed in the accommodating space and has electronic elements thereon. The at least one pair of slots is disposed at inner walls of the casing for positioning the PCB. A gel-fillable channel is defined between the electronic elements and the inner walls of the casing.

The present invention relates to novel chemical solutions suitable for forming polymer brushes on a surface of a solid part. The present invention further relates to methods of forming polymer brushes on the surface of a solid part using the novel chemical solutions as well as solid parts having polymer brushes coated onto the surface and uses of such solid parts.

The disclosure relates to an electronic device including a housing filled to a fill level with a first matrix produced from a first potting compound, and a circuit board having a component arranged thereon and having a passageway that connects a component side arranged within the housing interior filled with the first matrix and a front face of the component arranged outside the housing interior filled with the first matrix, the passageway acts as capillaries for media whose viscosity is less than a limit and as barriers for media whose viscosity is greater than the limit, the component is arranged in a spatially bounded region adjoining the component side, a second matrix produced from a second potting compound having a viscosity exceeding the limit, which second matrix effects a terminal sealing of the connection formed by the passageway against the first potting compound used for producing the first matrix.

An electronic circuitry module and a method of potting an electronic circuit are provided. The electronic circuit module includes at least one heat generating electronic component and is potted in a potting material. Additionally, a cooling circuit is potted in the potting material. The cooling circuit includes an inlet and an outlet for flow of cooling liquid therebetween.

A landscape lighting junction device includes a junction body having a first portion and a second portion connectable together in a closed position defining an interior cavity. The junction device may further include a terminal block disposed in the junction body to facilitate the electrical connection of a power source to at least one lighting fixture. The junction device may further include a predetermined amount of viscous sealant disposed in the junction body.

A circuit unit includes a circuit section that has terminal portions connectable to external terminals and main body portions on which electronic components are mounted, and in which portions between the main body portions and the terminal portions are portions to be waterproofed that are made of plate-shaped metals. First waterproofing portions are in intimate contact with the portions to be waterproofed of the circuit section, and are made of resin containing an adhesive component. A second waterproofing portion is made of resin and is in intimate contact with outer surfaces of the circuit section and the first waterproofing portions. The portions to be waterproofed each include recessed portions into which the first waterproofing portion can enter, and protruding portions protruding outward are formed on an outer surface of a portion of each first waterproofing portion overlapping the recessed portions.

A new and improved intrinsically safe barrier (ISB) provides advantages in connection with installation of field equipment in hazardous areas including Division 2/Zone 2 areas. In one embodiment the new ISB provides a pluggable/unpluggable ISB for use with a receiving terminal base adapted for individual field mounting and alternatively for use with a circuit mount terminal base to permit direct mounting of ISB on circuit boards. A highly effective heat sink design and potting material allows for heat dissipation to allow the ISB to serve a wider range of applications.

Pressure-isolating bulkhead structures with integrated selective electronic switches circuitry are provided. The pressure-isolating bulkhead structure may be a single unit having the integrated electronic switch circuitry, as well as an electrical connector that includes at least one of a wire and a pin contact. Such integrated selective electronic switch circuitry may be fashioned within a self-contained, inner pressure-isolating enclosure body. Such inner pressure-isolating enclosure body may be produced about the selective electronic switch circuitry such that the inner pressure-isolating enclosure body and switch circuitry are produced as a unit, which can be easily placed within a variety of bulkhead structures, and subsequently within a perforating gun.

A power module includes a substrate having a first layer and a second layer which are connected to one another and arranged above one another. The first layer includes a first dielectric material having a metallization arranged on a side facing the second layer and the second layer includes a second dielectric material having a metallization arranged on a side facing away from the metallization of the first dielectric material. A power semiconductor having a first contact area and a second contact area opposite the first contact area is connected to the metallization of the first dielectric material via the first contact area and arranged in a first recess of the second layer. A metallic first encapsulation encapsulates the power semiconductor in a fluid-tight manner, with the second contact area of the power semiconductor being electrically conductively connected to the metallization of the second dielectric material via the first encapsulation.