A method of encapsulating an electronic assembly comprises disposing a plurality of electrically non-conductive particles on a substrate which carries one or more components of the electronic assembly; introducing a reactive parylene monomer in a vapor form into interstitial spaces among the plurality of the electrically non-conductive particles; and forming a parylene binder in the interstitial spaces of the electrically non-conductive particles from the reactive parylene monomer.

A method for manufacturing a housing is described. The methods includes: providing a cover body defining a slot; filling a first material into the slot; and filling a second material into the slot to fill up the slot. A housing and a mobile terminal including the housing are further provided.

A control module for actuating at least one electrically operable actuator includes an actuator housing, a housing part, a casting space, a circuit carrier, and an electronic control circuit. The actuator housing accommodates the electrically operable actuator. The housing part is formed as one piece on the actuator housing. The casting space is formed on the housing part. The circuit carrier is introduced into the casting space. The electronic control circuit is arranged on the circuit carrier. The circuit carrier is surrounded with a casting mass in the casting space and embedded therein, and electrical connection elements of the circuit carrier are guided outwards out of the casting space.

A power module includes a substrate having a first layer and a second layer which are connected to one another and arranged above one another. The first layer includes a first dielectric material having a metallization arranged on a side facing the second layer and the second layer includes a second dielectric material having a metallization arranged on a side facing away from the metallization of the first dielectric material. A power semiconductor having a first contact area and a second contact area opposite the first contact area is connected to the metallization of the first dielectric material via the first contact area and arranged in a first recess of the second layer. A metallic first encapsulation encapsulates the power semiconductor in a fluid-tight manner, with the second contact area of the power semiconductor being electrically conductively connected to the metallization of the second dielectric material via the first encapsulation.

Pressure-isolating bulkhead structures with integrated selective electronic switches circuitry are provided. The pressure-isolating bulkhead structure may be a single unit having the integrated electronic switch circuitry, as well as an electrical connector that includes at least one of a wire and a pin contact. Such integrated selective electronic switch circuitry may be fashioned within a self-contained, inner pressure-isolating enclosure body. Such inner pressure-isolating enclosure body may be produced about the selective electronic switch circuitry such that the inner pressure-isolating enclosure body and switch circuitry are produced as a unit, which can be easily placed within a variety of bulkhead structures, and subsequently within a perforating gun.

A first trench is formed in a first sealing resin layer, which seals first electronic components and second electronic components on one main surface of a circuit board, and a second trench is formed in a second sealing resin layer, which seals third electronic components and fourth electronic components on another main surface. The first trench is formed between the first electronic components and the second electronic components when viewed in plan view, extending from an upper surface of the first sealing resin layer toward a surface opposite from the one main surface of the first sealing resin layer, and the second trench is formed between the third electronic components and the fourth electronic components when viewed in plan view, extending from a lower surface of the second sealing resin layer toward a surface opposite from the other main surface of the second sealing resin layer.

A method of manufacture of a structure includes obtaining or producing a functional electronics assembly including at least a first substrate, at least one electronics component on the first substrate, and at least one connection portion, providing the functional electronics assembly on a first substrate film, wherein the functional electronics assembly is connected to the first substrate film via the at least one connection portion, and providing first material to at least partly embed the at least one electronics component into the first material. The first substrate film is adapted to include a recess defining a volume, and the at least one electronics component is arranged at least partly in the volume.

A housing assembly includes a housing, a printed circuit board (PCB) contained in a housing, and a cup-shaped cap having an interior and a flange portion. A tall component extending from the PCB is covered by the cap such that the tall component is disposed in the interior of the cap and the flange portion of the cap engages the PCB. A vacuum is applied and while maintaining the vacuum, an encapsulant is introduced into the housing to a level so as to cover the PCB and certain other components not the relatively taller component(s). When the vacuum is released, a pressure differential between the environmental pressure and the vacuum remaining in the cap interior forces encapsulant into the cap interior to a level higher than that outside of the cap. A multi-level height potting process is achieved.

An apparatus for discriminating between liquids having differing thermal conductivities includes a thermally conductive substrate, a resistor and a thermistor mounted to the thermally conductive substrate. Two leads on the resistor enable a current to be passed through the resistor to generate heat, and two leads on the thermistor enable a current to be passed through the thermistor to generate a datum indicative of thermistor temperature. An electrical insulator encapsulates the resistor, the thermistor and part of the thermally conductive substrate. A remainder of the thermally conductive substrate may extend beyond the electrical insulator to provide a thermal path from the resistor and thermistor to a liquid in which the apparatus may be immersed.

In implementations of device component exposure protection, a computing device includes device components enclosed within a housing. The device components are assembled within the housing and enclosed within the housing upon completion of assembly of the computing device. The computing device further includes a protective material contained within the housing, which fills void spaces around the device components. The protective material prevents exposure of the device components to external matter that the computing device is exposed to upon completion of the assembly.