An apparatus comprising an irrigation sprinkler body cover with an integrated battery-powered decoder is disclosed. A method of retrofitting existing irrigation systems to wirelessly communicate with one or more of the present apparatus is also disclosed. Concerning the present method, an irrigation controller provides message data to a gateway regarding the control of irrigation valves. The gateway contains configurable encoder software that encodes and then wirelessly transmits the message data, for example via long-range radio hardware at 902-928 MHz frequency. The encoded data is received by a present apparatus to which the message is addressed. The apparatus decodes the message data and subsequently provides a power signal via wire to one or more proximally-located DC latching solenoid valves to control the irrigation valves according to the user input.

A connector device that includes a circuit board; a connector attached to the circuit board; a plurality of collars for external attachment; a first molded resin that is made of a first resin material whose melting point or softening point is 230 C. or less, and covers the entire circuit board and part of the connector; and a second molded resin that is welded to the first molded resin, is made of a second resin material whose melting point or softening point is higher than that of the first resin material for the first molded resin, and covers outer circumferences of the collars.

A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector.

Apparatus electronically interconnecting first electronic circuitry (72) in a hazardous environment with second electronic circuitry (74) whilst partitioning the second electronic circuitry from the hazardous environment includes a metallic body (42) defining a passage (56) which opens at one end into the hazardous environment. A PCB (58) extends across the passage and is encased within a layer of insulating material (66) on one side to form a gas tight barrier across the passage. The PCB has a first connector (78) connected with said first electronic circuity and at least one second connector (80) extending through the layer of insulating material and connected with said second electronic circuitry. The first and second connectors are electronically coupled so that the first electronic circuitry is electronically connected with the second electronic circuity through the PCB and insulating layer.

A shock-resistant memory device comprises a housing and a memory module. The memory module is disposed within the housing and surrounded by potting material to protect the memory module from damage during a shock event. The housing can include a port that accommodates a data connection between the memory module and a sensor from which data is desirably received by the memory module. During a shock event the connection between the memory module and the sensor may be severed, but data stored in the memory module can be retained in the memory module which is protected by the housing. To facilitate retrieval of the memory device subsequent to a shock event, a balloon can be affixed to the housing. The balloon can be configured to inflate subsequent to the shock event so that the shock-resistant memory device does not sink in water and to make the memory device more visible for recovery.

An electronics thermal conduction package is provided. The package may include a housing and an interior space, or envelope, configured to receive a printed circuit board assembly (PCBA) with one or more microprocessors or other heat generating elements. The package can be elastically deformed to open a dimension of the envelope, or receiving cavity, such that a complete PCBA can be inserted inside the interior space of the package. Once inserted, the package may be returned to its undeformed, or substantially undeformed, state such that surfaces in the interior space of the package contact one or more of the heat generating elements on the PCBA creating a conductive thermal path from the heat generating elements to the housing of the package.

A fluid meter with an electronic unit has a housing in which an electronic device and an energy storage device are disposed. The electronic device and the energy storage device are potted separately with a potting compound in a respective potting housing and they are coupled with one another either via a cable connection or via an inductive energy transmission interface.

An electronic circuit board includes electronic components to be mounted; a plurality of hard rigid board portions each of which has an insulating insulator and a conductive circuit pattern and electrically connects the mounted electronic component to the circuit pattern; and at least one soft flexible board portion which has an insulating insulator, has a conductive circuit pattern electrically connected to each of the circuit patterns of at least two rigid board portions among the plurality of rigid board portions, and is integrated with the rigid board portions which are electrically connected to the circuit pattern thereof. A plurality of contact relays as the electronic components is dispersedly arranged on the respective rigid board portions.

A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation. The mold may be used to form part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector. Reuseable plates may be used instead of the heat sink panels. Alternatively the panel may be encapsulated in and separated from a re-useable mold after curing.

A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation. The mold may be used to form part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector. Reuseable plates may be used instead of the heat sink panels. Alternatively the panel may be encapsulated in and separated from a re-useable mold after curing.