In this vehicle electronic control device, a control board having an electronic component mounted thereon is housed inside a case and a connector portion for connecting the control board to the outside is formed integrally with the case. The connector portion is formed by a housing portion covering the control board, and a terminal portion integrally embedded in the housing portion. The terminal portion has: a terminal for external connection, protruding from the housing portion; and an intermediate path portion extending from the terminal and connected to the control board. An exposure portion which allows the intermediate path portion to be exposed over the entire periphery thereof is formed in a part of the housing portion. An interface sealing member for sealing the interface between the housing portion and the intermediate path portion is provided in the exposure portion.

In some examples, a medical device may include circuitry on a circuit board, a casing, and a fill material at least partially within the casing. The casing may receive the circuit board and surround at least a portion of the circuit board. The casing may define an aperture configured to allow one or more electrical connectors of the circuit board to extend through the aperture for one or more electrical connections with one or more components outside of the casing. An outer surface of the casing may define a first portion of an outer surface of the medical device. The casing may comprise a material having a first melting temperature. The fill material may define a second portion of the outer surface of the medical device and may have a second melting temperature that is lower than the first melting temperature.

A power module which inhibits disjoin between a sealing resin and an adhesive. The power module includes: an insulative substrate having a semiconductor element mounted on the top surface; a base plate joined to the rear surface of the insulative substrate; a case member with the base plate, that surrounds the insulative substrate, the case member having a bottom surface whose inner periphery portion side being in contact with a top surface of the base plate, the bottom surface being provided with an angled surface whose distance to the top surface of the base plate increases toward an outer periphery side of the base plate; an adhesive member filled between the base plate and the angled surface to adhere the base plate and the case member; and a filling member filled in a region bounded by the base plate and the case member.

An electronic module, more particularly a control module or sensor module for a motor vehicle transmission, has a circuit board having a first side and a second side facing away from the first side, electronic components arranged on the first side, and a casting compound arranged on the first side. The casting compound covers the electronic components. The circuit board has a through-hole connecting the first side to the second side. A sensor element covering the through-hole is arranged on the first side of the circuit board.

A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector.

A method of encapsulating a printed circuit board of a motor controller with a potting material includes inserting the printed circuit board into a recess formed in a base portion of an encapsulation assembly such that a bottom surface of the printed circuit board is spaced from a surface of the recess. The method also includes coupling a cover portion of the encapsulation assembly to the base portion to define a cavity therebetween. The method further includes injecting the potting material into the cavity through at least one injection port defined in at least one of the base portion and the cover portion such that the printed circuit board is at least partially coated in the potting material.

A field device (1) includes an electronic circuit (200) connected to at least one of a sensor (600) and an actuator, a bimetal temperature switch (400) connected to a power source (100) in series with the electronic circuit (200) and configured to turn on when rising to a first temperature, a heating element (500) connectable to the power source (100) in parallel with the electronic circuit (200) and the temperature switch (400), and a housing (300) configured to house the electronic circuit (200), the temperature switch (400), and the heating element (500).

A housing of a field device of measuring- and automation technology, comprising a housing body, which has at least two housing chambers, wherein the housing chambers are connected together by an opening. The opening is adapted to accommodate a circuit board which is held by at least one holder, wherein the circuit board is adapted to be populated with electronic components or assemblies. The opening is Ex-d sealed with a potting compound.

A seal structure includes a container, a sealant applied in liquid form that cures to a gel, and a cap that applies pressure to the gel. The container surrounds at least one opening in an assembly for the passage of elongated members such as wires. The container defines a chamber that is in communication with the opening and surrounds the wires passing through the opening. A closure spans the opening and is in contact with an inner end of the container. The chamber and the at least opening are partially filled with a predetermined quantity of sealant in liquid form, which cures into a viscous gel. The cap is configured to engage with the container and includes a platform that is positioned within the container and in contact with the gel sealant. In this arrangement, the cap applies positive pressure to the gel sealant.

An electronic unit for a hand-held power tool, having a mounting frame having an accommodation space into which a circuit board carrying a plurality of electronic components is inserted and at least one heat sink for the heat dissipation of waste heat arising at the electronic components. A slot section with at least one insertion slot, oriented perpendicular to the printed circuit board, for mounting an electronic component along a direction of insertion is formed on the mounting frame. The at least one heat sink is associated with the slot section.