This application describes covers for electronic devices, electronic devices, and methods for making the covers. In one example, a cover comprises a substrate comprising a first metal; a second metal injection molded 10 on the surface of the substrate; a paint layer or an electrophoretic deposition layer on the second metal surface; a chamfered edge on the substrate, wherein the chamfered edge cuts through the paint layer or the electrophoretic deposition layer, the second metal, and partially through the first metal; and a hydrophobic coating.

A method for preventing corona effects in an electronic circuit comprising applying a coating of a first material to a surface of the electronic circuit, and applying a second material having a dielectric constant that is lower than that of the first material on an exposed surface of the first material, wherein the second material comprises a solid dielectric.

A circuit module 2 comprises: a wiring structure 4; at least one electronic component 6a, 6b arranged on the upper surface of the wiring structure 4; an insulating resin layer 8 which is provided on the upper surface of the wiring structure 4 and in which at least one electronic component 6a, 6b is embedded; and a metal layer 10 provided on the upper surface of the insulating resin layer 8. The surface roughness of the portion S1 directly above each electronic component on the upper surface of the insulating resin layer 8 is expressed as R1. The surface roughness of the portion S2 other than the portion directly above all the electronic components on the upper surface of the insulating resin layer 8 is expressed as R2. At least one R1 satisfies the condition: R1>R2.

A printed circuit board assembly (PCBA) controls an electrically-initiated device (EID) in an electric field. The PCBA includes a conductive layer, a dielectric layer, and a trans-conductive layer (TCL). The conductive layer of the PCBA designated protected areas. An electrical current with a predetermined current density is impressed in the conductive layer when the PCBA is in the electric field. The TCL is a nickel-metal composite metamaterial positioned between the conductive and dielectric layers and configured to change in shape or thickness in the electric field such that the impressed current is steered away from the conductive layer and into the dielectric layer to prevent premature activation of the EID. A system includes an outer housing, power supply, an EID such as a sonobuoy or medical device, and the PCBA, all of which are encapsulated in the housing. A method is also disclosed for manufacturing the PCBA.

A method of manufacturing an electronic component includes temporarily fixing an electronic component body to a support with a temporary fixation material having an area smaller than that of the electronic component body interposed therebetween, disposing a shield resin layer having an area larger than that of an upper surface of the electronic component body on the upper surface of the electronic component body, and applying pressure to the shield resin layer via an elastic layer and causing the shield resin layer to adhere such that the shield resin layer extends from the upper surface that is the surface of the electronic component body opposite to the temporary fixation material to a bottom surface that is a surface of the electronic component body that faces the temporary fixation material via side surfaces of the electronic component body.

A terminal-equipped case member having an external terminal for electrically connecting an external device, which is fixed to a case body for housing an electronic component or a case member constituting a case lid attached to the case body, includes a base material made of metal that forms the case member; the external terminal inserted into a through hole formed through the base material; a sealing material formed of a first resin material that seals a gap between the external terminal and the base material; and a terminal adhesion layer. The external terminal and the sealing member are bonded to each other through the terminal adhesion layer formed of a second resin material with a higher adhesion to the external terminal than that of the first resin material.

A composition is provided. The composition consists essentially of (a) 1 to 30 wt. % of a hydrogen phosphate selected from the group consisting of mono and dihydrogen phosphates of sodium, potassium, ammonium, magnesium, calcium, aluminium, zinc, iron, cobalt, and copper; (b) 1 to 40 wt. % of a compound selected from the group consisting of oxides, hydroxides, and oxide hydrates of magnesium, calcium, iron, zinc, and copper; (c) 40 to 95 wt. % of a particulate filler selected from the group consisting of glass; mono-, oligo- and poly-phosphates of magnesium, calcium, barium and aluminum; calcium sulfate; barium sulfate; simple and complex silicates; simple and complex aluminates; simple and complex titanates; simple and complex zirconates; zirconium dioxide; titanium dioxide; aluminum oxide; silicon dioxide; silicon carbide; aluminum nitride; boron nitride and silicon nitride; and (d) 0 to 25 wt. % of a constituent that differs from constituents (a) to (c).

The present invention relates to an elongated catheter comprising a tubular section with a side wall with essentially annular cross-section defined by an outer surface and an inner surface of the tubular section. In the outer surface of the tubular section, there is at least one longitudinal installation recess extending over a first predefined distance over the longitudinal dimension of the catheter. A flexible circuit board is wrapped around the tubular section. Electrical wiring is disposed on the outer surface of the tubular section. At least one electronic device is assembled on the flexible circuit board and disposed within the at least one longitudinal installation recess. The at least one electronic device is interconnected via the flexible circuit board with the electrical wiring.

A module includes a substrate including a first surface, a first component mounted on the first surface, at least a part of which is covered with a first conductive film, a sealing resin arranged to cover the first surface and the first component, and a shield film that covers a part of a surface of the sealing resin on a side distant from the substrate. The surface of the sealing resin on the side distant from the substrate includes a shielded region covered with the shield film when viewed in a direction perpendicular to the first surface and a non-shielded region not covered with the shield film. The non-shielded region is superimposed on at least a part of the first conductive film.

A waterproof electronic device includes: an electronic component module having an electronic component including a semiconductor element, a heat dissipating member provided on the electronic component in a thermally conductive manner, and an insulating material that surrounds the electronic component in such a manner that one surface of the heat dissipating member is exposed; and a waterproof film that is formed at least on whole surfaces in regions of the electronic component module that are to be immersed in a coolant.