The disclosure relates to a mechatronic assembly. The assembly includes a supporting circuit board with at least one populated flat side . A multiplicity of electronic components are arranged on the at least one populated flat side. In addition, at least one mechanical insert part for the mechanical fixing of at least one electronic component is also arranged on the at least one populated flat side. An encapsulation of one-piece design is provided which, in form-fitting and cohesive fashion, surrounds all of the components arranged on the at least one populated flat side of the supporting circuit board. The disclosure also relates to a method for producing the mechatronic assembly.

Encapsulated PCB assembly (1) for electrical connection to a high- or medium-voltage power conductor in a power distribution network of a national grid, comprising a) a PCB (10), delimited by a peripheral edge (20) and comprising a high-tension pad (60, 62) on a voltage of at least one kilovolt, b) an electrically insulating encapsulation body (70) in surface contact with, and enveloping, the high-tension pad and at least a portion of the PCB edge adjacent to the high-tension pad, c) a shielding layer (80) on an external surface (90) of the encapsulation body and for being held on electrical ground or on a low voltage to shield at least a low-voltage portion of the PCB. The high-tension pad extends to the peripheral edge of the PCB.

A circuit module 2 comprises: a wiring structure 4; at least one electronic component 6a, 6b arranged on the upper surface of the wiring structure 4; an insulating resin layer 8 which is provided on the upper surface of the wiring structure 4 and in which at least one electronic component 6a, 6b is embedded; and a metal layer 10 provided on the upper surface of the insulating resin layer 8. The surface roughness of the portion S1 directly above each electronic component on the upper surface of the insulating resin layer 8 is expressed as R1. The surface roughness of the portion S2 other than the portion directly above all the electronic components on the upper surface of the insulating resin layer 8 is expressed as R2. At least one R1 satisfies the condition: R1>R2.

In a method for printing a three dimensional structure, a continuous length of fiber that includes, interior to a surface of the fiber, a plurality of different materials arranged as an in-fiber functional domain, with at least two electrical conductors disposed in the functional domain in electrical contact with at least one functional domain material, is dispensed through a single heated nozzle. After sections of the length of fiber are dispensed from the heated nozzle, the sections are fused together in an arrangement of a three dimensional structure. The structure can thereby include a continuous length of fiber of least three different materials arranged as an in-fiber functional device, with the continuous length of fiber disposed as a plurality of fiber sections that are each in a state of material fusion with another fiber section in a spatial arrangement of the structure.

The present disclosure relates to an electronic module for a hearing device. The electronic module comprises at least one electronic component for a hearing device and an embedding material covering the electronic component. The electronic component comprises at least one restricted area which is free from the embedding material. The restricted area is surrounded at least partially by a zone and the zone is covered by an attaching material. The attaching material covering the zone has a mold part formed by molding and freely formed edge facing the restricted area.

A method of manufacturing a display device includes forming on a first substrate a display element and a metal layer surrounding the display element, the metal layer including a first portion having a first width and a second portion having a second width less than the first width, forming on a second substrate a sealing member surrounding the display element, the sealing member including a first sealing portion having a first forming width and a second sealing portion having a second forming width greater than the first forming width, arranging the first substrate and the second substrate such that the sealing member on the second substrate faces the first substrate, the first sealing portion overlaps the first portion of the metal layer, and the second sealing portion overlaps the second portion of the metal layer, and sealing the first and second substrates by melting and curing the sealing member.

The present disclosure pertains to an arrangement comprising a housing, a circuit board arranged in the housing and at least one flat contact to connect the circuit board with an electrical component arranged outside of the housing, whereby the housing has a breakthrough that the flat contact protrudes from, whereby the circuit board has breakthrough that the flat contact reaches through, that the circuit board has a contact tab on the side facing away from the housing breakthrough and whereby a molded seal is inserted in the housing breakthrough and the molded seal positively encloses the flat contact and whereby the contact tab is connected with the flat contact in an electrically conductive manner.

A module includes a first partial housing and a second partial housing, wherein the first partial housing and the second partial housing together form a recess, a circuit board disposed in the recess; and an encapsulation mass, which closes the recess. A material from which the first partial housing is manufactured and a material from which the second partial housing is manufactured have a difference in thermal expansion coefficients that is at most 10% of the largest value of the two thermal expansion coefficients, the first partial housing includes a sealing structure and the second partial housing includes a counter-sealing structure, and at least one of the sealing structure and the counter-sealing structure is configured to extend into the other of the sealing structure and the counter-sealing structure.

An airtight-level sensor includes an air pump, a sounding mechanism, and a processing device. The air pump comprises an inlet valve and an outlet valve, the sounding mechanism is disposed near the outlet valve to generate a sound wave corresponding to an airflow blown from the outlet valve, and the processing device is disposed near the sounding mechanism to receive the sound wave generated therefrom and determines an airtight-level of an airtight chamber wherein the airtight-level sensor is disposed.

An electronic device includes a first molded product integrated with an electronic component, and a second molded product secondarily molded outside of the first molded product. The first molded product includes a thermosetting resin, and a first additive contained in the thermosetting resin, and the second molded product includes a thermoplastic resin, and a second additive contained in the thermoplastic resin and having a reactive group that chemically bonds with the first additive. At an interface between the first molded product and the second molded product, the first additive and the second additive are joined to each other by one or more joint actions selected from covalent bonding, ionic bonding, hydrogen bonding, intermolecular forces, dispersion force, and diffusion. As a result, the adhesion between both the molded products can be firmly secured through the molding technique such as the transfer molding method or the compression molding method.