A fin frame baseplate is disclosed. Specific implementations include a baseplate configured to be coupled to a substrate, a fin frame including a base portion coupled to the baseplate, and a plurality of fins extending from the base portion, the plurality of fins protruding from the base portion. The fin frame may include a plurality of openings therethrough.

One disclosed method includes defining an electrical trace on a first substrate; physically coupling an electronic component to the first substrate, wherein a portion of the electrical trace completely encircles the electronic component; overlaying a second substrate onto the first substrate, the overlaying causing the second substrate to completely cover the portion of the electrical trace and the electronic component; electrically coupling an electrical power source to the electrical trace to generate a current in the electrical trace; melting the second substrate using heat generated by the current through the electrical trace; and fusing the second substrate to the first substrate to generate a hermetic seal around the electronic component.

A method includes contacting a glass sheet with a forming surface to form a shaped glass article. An effective viscosity of the glass sheet during the contacting step is less than a contact viscosity of the glass sheet in contact with the forming surface during the contacting step.

Clamping devices and associated methods that are useful to develop both axial and circumferential clamping forces in response to a common axial clamping force. The clamp is able to use a simple mechanism to generate both kinds of clamping forces from a single, axial actuating force. The clamping devices of the present invention are particularly useful for clamping cover and base deck components of a hard disk drive enclosure together to allow the components to be joined and sealed together using welding techniques.

A subsea enclosure arrangement for a subsea component, the enclosure includes walls of a fluid tight material, each wall terminating in a flange; a cover for closing the enclosure; an elastomeric seal between the flange and the cover; compressive members to apply a compressive force to the elastomeric seal, via the cover and the flange; a bracket connecting the flange to the cover; a weld seal between the bracket and the flange; and a weld seal between the bracket and the cover.

Various embodiments of a hermetic assembly and a method of forming such assembly are disclosed. The hermetic assembly includes a dielectric substrate having a first major surface and a second major surface, a patterned layer connected to the first major surface of the dielectric substrate by a laser bond, and a ferrule having a body and a flange extending from the body. The flange is welded to a welding portion of the patterned layer that is disposed between the flange and the first major surface of the dielectric substrate such that the ferrule is hermetically sealed to the dielectric substrate.

A method for producing a housing for electronics in which the housing is formed by a first housing element and a second housing element and in which the housing elements are composed of aluminum or an aluminum alloy. The method further includes connecting the housing elements to one another by welding so that the housing elements are held tightly together. The method also includes producing at least one of the housing elements by a die casting method in which gas that is created in the die-casting method is evacuated from the housing element by helium gas.

The invention relates to a housing for an electrical device, in particular an electrical machine. The housing encloses a cavity. The housing has a housing cup and a housing part. The housing part, which is formed, for example, by a closing element, in particular a housing cover, is designed to be connected to the housing cup, in particular separably or inseparably, or to close the housing cup. According to the invention, the housing cup, in particular a housing wall of the housing cup, has an opening. The housing cup is made of metal, in particular steel or aluminum, at least in the region of a housing cup edge extending peripherally around the opening. The housing part is preferably made of plastic. The housing preferably has an adapter, which is in particular tubular, for connecting the housing cup to the housing part. The adapter is injection-molded or fused onto a longitudinal section of the housing cup edge. The adapter has, at an end opposite the housing cup, an adapter edge, which surrounds an adapter opening, is in particular in the form of a flange and is designed to be adhesively bonded or welded, in particular tightly, to the housing part.

Various embodiments of a hermetically-sealed package and methods of forming such packages are disclosed. In one or more embodiments, the hermetically-sealed package can include a housing and a feedthrough assembly that forms a part of the housing. The feedthrough assembly can include a non-conductive substrate and a feedthrough. The feedthrough can include a via from an outer surface to an inner surface of the non-conductive substrate, a conductive material disposed in the via, and an external contact disposed over the via on the outer surface of the non-conductive substrate. The external contact can be electrically coupled to the conductive material disposed in the via. Further, the external contact can be hermetically sealed to the outer surface of the non-conductive substrate by a laser bond surrounding the via.

An enclosure configured to hermetically seal electronics of a surgical instrument therein includes a first casing component defining a first weld deck about a perimeter thereof, a second casing component defining a second weld deck about a perimeter thereof, and an energy director extending from the first weld deck and configured to facilitate ultrasonic welding of the first and second weld decks of the first and second casing components, respectively, with one another to establish a weld seam hermetically sealing the first and second casing components. The first weld deck lies in multiple planes.