Various embodiments of a sealed package and a method of forming such package are disclosed. The package can include a non-conductive substrate that includes a cavity disposed in a first major surface. A cover layer can be disposed over the cavity and attached to the first major surface of the non-conductive substrate to form a sealed enclosure. The sealed package can also include a feedthrough that includes a via between a recessed surface of the cavity and a second major surface of the substrate, and a conductive material disposed in the via. An external contact can be disposed over the via on the second major surface of the non-conductive substrate, where the external contact is electrically connected to the conductive material disposed in the via. The sealed package can also include an electronic device disposed within the sealed enclosure that is electrically connected to the external contact.

An apparatus includes a housing, a circuit board, a sealant and a baseplate. The housing may have a shelf and a flange along an open side. The circuit board may be (i) disposed on the shelf of the housing and inside the flange of the housing and (ii) secured to the housing. The sealant may be dispensed (i) through the open side of the housing and (ii) along a gap between the flange and the circuit board. The baseplate may be compressed to the housing thereby causing the sealant to flow between (i) the baseplate and the circuit board and (ii) the baseplate and the flange.

A device for transferring heat from a device component to an environment includes a heat plate connected to a spring. A first fastener attaches the spring to the heat plate at a first location. A second fastener, such as a rivet, attaches the spring to the heat plate at each of a second and a third location. The second fastener includes a tab on and extending above the heat plate and corresponding tab slot on the spring. The spring is riveted to the heat plate at the first location and a second spring member accepts the tab at each of the second location and the third location. Ribs on a top surface of spring facilitate thermal coupling of the spring to the component when the device is assembled. One or more spring curvatures facilitate vertical deflection and horizontal extension of the spring during device assembly.

A device (1) for the detecting and registering of measurement data, having a first housing (2) in which electronics (7) are arranged, and having at least one sensor (14), which is electrically connected to the electronics (7). The first housing (2) includes at least two housing parts (3, 4), having at least one metallic connection site and being joined together at the connection site by a gas-tight metal/metal connection. The at least one sensor (13) is arranged in a second housing (11), which encloses the first housing (2) substantially entirely, and which includes at least two housing parts (12, 15), which are detachably joined together or can be so joined.

There are provided an electronic component housing package and the like which have high efficiency of heating by infrared rays. An electronic component housing package includes an insulating substrate including a plurality of insulating layers stacked on top of each other, an upper surface of the insulating substrate being provided with an electronic component mounting section. The plurality of insulating layers each contain a first material as a major constituent. The electronic component housing package comprises one or more infrared-ray absorbing layers disposed between the plurality of insulating layers and/or disposed on an upper surface of uppermost one of the plurality of insulating layers. The one or more absorbing layers contain a second material which is higher in infrared absorptivity than the first material.

An enclosure for an electronic device includes a housing having wall defining a cavity that is configured to receive an electronic assembly therein. The wall includes a plurality of housing steps formed in an interior surface. A cap includes a side surface extending around a perimeter of the cap with a plurality of cap steps formed in the side surface. The cap is positioned at an entrance to the cavity such that the plurality of housing steps align with the plurality of cap steps and welded in place. Flash from the weld is captured in a flash trap so that no weld flash is visible on the exterior surface of the enclosure.

A waterproof housing including a first case, a second case, a welded member, and a waterproof unit is provided. The first case includes a side wall and a groove. The side wall is disposed on an outer periphery of the first case. The groove is disposed on the side wall. The second case is disposed in correspondence with the first case, and the second case includes a first inner wall disposed at an inner side of the second case. The first inner wall and the side wall are disposed in correspondence with each other. The welded member is disposed in correspondence with the first case and the second case, and a joint direction of the welded member is different from an opening direction of the groove. The waterproof unit is disposed in the groove and is partially protruded from the side wall. The first case and the second case are jointed to each other via the welded member. The waterproof unit and the first inner wall are abutted against each other for sealing the first case and the second case.

This hermetic sealing lid member (10) is made of a clad material (20) including a silver brazing layer (21) that contains Ag and Cu and a first Fe layer (22) bonded onto the silver brazing layer and made of Fe or an Fe alloy. The hermetic sealing lid member is formed in a box shape including a recess portion (13) by bending the clad material.

An enclosure for an electronic device includes a housing having a wall defining a cavity that is configured to receive an electronic assembly therein. The wall includes a distal end having a tongue. A cap is sized to attach to the housing with a corresponding groove that is formed in a perimeter of the cap. A double shear weld joint is formed between the tongue and the groove such that flash from the weld is contained within the enclosure and is not visible on the exterior surface of the enclosure.

A method includes contacting a glass sheet with a forming surface to form a shaped glass article. An effective viscosity of the glass sheet during the contacting step is less than a contact viscosity of the glass sheet in contact with the forming surface during the contacting step.